Method of providing an electronic device and electronic device thereof

A method comprising:

• providing a carrier substrate;
• providing a first bond promoting layer over the carrier substrate, the first bond promoting layer comprising a first bond promoting layer material;
• providing a second bond promoting layer over the carrier substrate, the second bond promoting layer comprising a second bond promoting layer material different than the first bond promoting layer material;
• and
• depositing a first device substrate over the carrier substrate, the first bond promoting layer, and the second bond promoting layer;
• wherein:
• the first device substrate is configured to bond to the carrier substrate with a first device substrate-carrier substrate adhesion strength;
• depositing the first device substrate comprises:
• bonding the first device substrate to the first bond promoting layer, the first device substrate bonding to the first bond promoting layer with a first device substrate-first bond promoting layer adhesion strength greater than the first device substrate-carrier substrate adhesion strength;
• and
• coupling the first device substrate to the carrier substrate;
• at least one of:
• the first device substrate-carrier substrate adhesion strength comprises a first tensile adhesion strength less than approximately 0.0390 MegaPascal, and the first device substrate-first bond promoting layer adhesion strength comprises a second tensile adhesion strength greater than or equal to approximately 0.0390 MegaPascal;
• or
• the first device substrate-carrier substrate adhesion strength comprises a first peel adhesion strength less than approximately 0.0100 kilogram per centimeter, and the first device substrate-first bond promoting layer adhesion strength comprises a second peel adhesion strength greater than or equal to approximately 0.0100 kilogram per centimeter;
• providing the first bond promoting layer over the carrier substrate comprises providing the first bond promoting layer over a perimeter portion of the carrier substrate;
• the carrier substrate comprises a rigid substrate;
• and
• the first device substrate comprises a flexible substrate.

A system comprising:

• a carrier substrate comprising a rigid substrate;
• a first bond promoting layer over the carrier substrate, the first bond promoting layer comprising a first bond promoting layer material;
• a second bond promoting layer over the carrier substrate, the second bond promoting layer comprising a second bond promoting layer material different than the first bond promoting layer material;
• and
• a first device substrate over the carrier substrate, the first bond promoting layer, and the second bond promoting layer;
• wherein:
• the first device substrate is configured to bond to the carrier substrate with a first device substrate-carrier substrate adhesion strength;
• the first device substrate is bonded to the first bond promoting layer with a first device substrate-first bond promoting layer adhesion strength greater than the first device substrate-carrier substrate adhesion strength, and is coupled to the carrier substrate;
• at least one of:
• the first device substrate-carrier substrate adhesion strength comprises a first tensile adhesion strength less than approximately 0.0390 MegaPascal, and the first device substrate-first bond promoting layer adhesion strength comprises a second tensile adhesion strength greater than or equal to approximately 0.0390 MegaPascal;
• or
• the first device substrate-carrier substrate adhesion strength comprises a first peel adhesion strength less than approximately 0.0100 kilogram per centimeter, and the first device substrate-first bond promoting layer adhesion strength comprises a second peel adhesion strength greater than or equal to approximately 0.0100 kilogram per centimeter;
• the first bond promoting layer is over a perimeter portion of the carrier substrate;
• and
• the first device substrate comprises a flexible substrate.