Substrate treatment method, computer storage medium and substrate treatment system

A computer-readable storage medium storing a program running on a computer of a control unit configured to control a substrate treatment system so as to cause the substrate treatment system to execute a substrate treatment method of performing a plurality of predetermined treatments on a substrate to form a plurality of patterns stacked on the substrate,

• the substrate treatment method comprising:
• a calculation step of calculating, about patterns in two layers stacked on the substrate, a mutual pattern displacement amount being a displacement amount between the patterns in the two layers, based on an end portion positional displacement of a pattern in an upper layer, an end portion positional displacement of a pattern in a lower layer, and an overlay of the patterns in the two layers;
• and
• a correction step of correcting, when the mutual pattern displacement amount exceeds a predetermined threshold, treatment conditions in the predetermined treatments to make the mutual pattern displacement amount fall within the predetermined threshold.

A substrate treatment system configured to form a plurality of patterns stacked on a substrate, the substrate treatment system comprising:

• a plurality of treatment apparatuses configured to perform predetermined treatments on the substrate;
• and
• a control unit configured to set treatment conditions of the predetermined treatments,
• wherein the control unit is configured to perform, through control of the control unit:
• a calculation step of calculating, about patterns in two layers stacked on the substrate, a mutual pattern displacement amount being a displacement amount between the patterns in the two layers, based on an end portion positional displacement of a pattern in an upper layer, an end portion positional displacement of a pattern in a lower layer, and an overlay of the patterns in the two layers;
• and
• a correction step of correcting, when the mutual pattern displacement amount exceeds a predetermined threshold, treatment conditions in treatments on the substrate to make the mutual pattern displacement amount fall within the predetermined threshold.