Substrate processing method, substrate processing apparatus and a computer-readable storage medium
AssigneeTokyo Electron Limited
InventorsYasuaki Noda, Tadashi Nishiyama
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AssigneeTokyo Electron Limited
InventorsYasuaki Noda, Tadashi Nishiyama
Estimating the term…
A processing method in one embodiment includes: a step that takes an image of the end face of a reference substrate, whose warp amount is known, over the whole periphery thereof using a camera to obtain shape data of the end face of the reference substrate over the whole periphery of the reference substrate; a step that takes an image of the end face of a substrate over the whole periphery thereof using a camera to obtain shape data of the end face of the substrate over the whole periphery of the substrate; a step that calculates warp amount of the substrate based on the obtained shape data; a step that forms a resist film on a surface of the substrate; a step that determines the supply position from which an organic solvent is to be supplied to a peripheral portion of the resist film and dissolves the peripheral portion by the solvent supplied from the supply position to remove the same from the substrate.
A substrate processing method comprising:
A substrate processing method comprising:
Dependencies are inferred from the claim text.