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AssigneeJX Nippon Mining & Metals Corporation
InventorsHiroshi Takamura, Ryo Suzuki
Estimating the term…
Provided is a backing plate obtaining by bonding an anticorrosive metal and Mo or a Mo alloy, wherein the backing plate comprises, on a surface of the Mo or Mo alloy backing plate to be cooled (cooling surface side), a layer having a thickness corresponding to 1/40 to ⅛ of a total thickness of the backing plate and formed from an anticorrosive metal obtained by bonding one or more types of metals selected from among Cu, Al and Ti, or an alloy thereof. Additionally provided is a sputtering target-backing plate assembly obtained by bonding the foregoing Mo or Mo alloy backing plate and a target formed from a low thermal expansion material. Particularly in semiconductor applications, reductions in size have progressed and control of particles during sputtering has become stricter. The present invention aims to resolve the problem of warpage of sputtering targets formed from low thermal expansion materials and problems occurring with respect to the anticorrosive properties of Mo or Mo alloy backing plates.
A Mo or Mo alloy backing plate to be bonded to a target, wherein the Mo or Mo alloy backing plate has, on a surface of the Mo or Mo alloy backing plate to be cooled, a layer of an anticorrosive metal bonded thereto having a thickness equal to 1/40 to ⅛ of a total thickness of the backing plate, wherein the surface of the Mo or Mo alloy backing plate bonded to the anticorrosive metal is recessed to a predetermined depth at a location including a center of the surface of the Mo or Mo alloy backing plate and thereby includes a recessed portion and an outer peripheral non-recessed portion, the recessed portion has a face at a level that is spaced from a level of a face of the non-recessed portion, and wherein the surface of the Mo or Mo alloy backing plate bonded to the anticorrosive metal defines a surface edge rounded along a border between the recessed portion and the outer peripheral non-recessed portion.
Dependencies are inferred from the claim text.