Ceramic electronic device

A ceramic electronic device comprising:

• a chip component including a rectangular-parallelepiped element body having dielectrics and internal electrodes and a pair of terminal electrodes, each of the pair of terminal electrodes having an electrode end-surface portion covering one of a pair of end surfaces of the element body and a side surface portion covering portions of side surfaces of the element body, the side surfaces connecting between the pair of end surfaces;
• and
• a pair of metal terminals each respectively having a pair of engagement arm portions configured to hold the chip component and arranged correspondingly with the pair of terminal electrodes,
• wherein the side surface portion of each of the pair of terminal electrodes comprises:
• a first side surface portion having a predetermined value of a side-surface electrode thickness representing a distance from the side surfaces of the element body covered by the side surface portion of the terminal electrode to an external surface of the side surface portion of the terminal electrode covering the side surfaces of the element body;
• and
• a second side surface portion disposed farther from the end surface of the element body than the first side surface portion and having electrode second thickness which is smaller than the predetermined value of the side-surface electrode thickness,
• wherein each of the pair of engagement arm portions of each of the pair of metal terminals is in contact with the chip component at a position that is farther from the associated end surface of the element body than the associated first side surface portion and closer to one of the side surfaces of the element body than the external surface of the associated first side surface portion, and
• the first side surface portion of each of the pair of terminal electrodes has the predetermined value of the side-surface electrode thickness to catch the associated engagement arm portion of the respective metal terminal when the associated engagement arm portion is positioned past the associated end surface of the element body.