3D memory with staged-level multibit programming
AssigneeMacronix International Co., Ltd.
InventorsChen-Jun Wu, Chih-Chang Hsieh, Tzu-Hsuan Hsu, Hang-Ting Lue
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AssigneeMacronix International Co., Ltd.
InventorsChen-Jun Wu, Chih-Chang Hsieh, Tzu-Hsuan Hsu, Hang-Ting Lue
Estimating the term…
A two-sided, staged programming operation is applied to a memory having first and second stacks of memory cells C1(i) and C2(i), i being the physical level of a cell. The staged programming operation includes applying a preliminary program stage S1, an intermediate program stage S2, and a final program stage S3 to memory cells in the first and second stacks. In a programming order the final program stage S3 is applied to memory cells in the first and second stacks at each level (i) for which the intermediate program stage S2 has already been applied to the memory cells in any neighboring levels (levels i+1 and i−1). The intermediate program stage S2 is applied only to memory cells for which the preliminary program stage S1 has already been applied to the cells in any neighboring levels (levels i+1 and i−1).
A memory device including a plurality of memory cells, comprising:
An integrated circuit, comprising:
A method for operating a 3D memory device having a NAND string having 2N word lines, the NAND string comprising a first stack of memory cells C1(i) coupled with a first set of N word lines of the 2N word lines and a second stack of memory cells C2(i) coupled with a second set of N word lines of the 2N word lines, in a plurality of levels where i is an index indicating a level of a cell in the stack, and i goes from 1 to N, and wherein level N is one of the uppermost level and the lowermost level in the first and second stacks;
Dependencies are inferred from the claim text.