Wireless communication device and wireless communication module manufacturing method

A wireless communication device comprising:

• a wireless communication module that includes a wireless IC chip including first and second input/output terminals and processing an RF signal of a UHF band, and an impedance matching circuit connected to the first and the second input/output terminals;
• and
• an antenna base material including the wireless communication module mounted thereon and including an antenna element disposed thereon;
• wherein
• the impedance matching circuit includes:
• a first multi-layer coil electric conductor including one end connected to the first input/output terminal and including a plurality of loop electric conductors provided in a plurality of layers;
• and
• a second multi-layer coil electric conductor including one end connected to another end of the first multi-layer coil electric conductor and another end connected to the second input/output terminal and including a plurality of loop electric conductors provided in a plurality of layers;
• wherein
• a surface of the wireless communication module includes a first terminal electrode disposed thereon that is connected to any one of the plurality of loop electric conductors of the first multi-layer coil electric conductor through a first in-plane electric conductor and a first interlayer electric conductor, and a second terminal electrode disposed thereon that is connected to any one of the plurality of loop electric conductors of the second multi-layer coil electric conductor through a second in-plane electric conductor and a second interlayer electric conductor;
• wherein
• the first and the second in-plane electric conductors are respectively connected to the first and the second multi-layer coil electric conductors at positions located within the first and the second multi-layer coil electric conductors.