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AssigneeFuji Corporation
InventorsMasafumi Amano, Shuichiro Kito, Taizo Umezaki
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An electronic component picked up and held by a mounting head of a component mounter is moved to an imaging position above a component imaging camera, the tip of the lead of the electronic component is imaged from below by the camera to acquire a lead image, and the lead image is inputted into an image recognition device configured from a neural network or the like and imaged processed so as to output the center position of the tip of the lead. Here, whenever an image processing error occurs, the lead image for which the image processing error occurred is displayed on a display device, and an operator specifies the center position of the tip of the lead in the lead image display on the display device and the specified center position is inputted into the image recognition device.
A lead tip position image recognition method for recognizing a center position of a lead tip of an electronic component to be inserted into a through-hole of a circuit board by processing an image of the lead tip as a lead image captured by a camera using an image recognition device, the lead tip position image recognition method comprising:
A lead tip position image recognition system for recognizing a center position of a lead tip of an electronic component to be inserted into a through-hole of a circuit board by processing an image of the lead tip as a lead image captured by a camera using an image recognition device, the lead tip position image recognition system comprising:
A lead tip position image recognition system for recognizing a center position of a lead tip of an electronic component to be inserted into a through-hole of a circuit board by processing an image of the lead tip as a lead image captured by a camera using an image recognition device, the lead tip position image recognition system comprising:
Dependencies are inferred from the claim text.