Direct probing characterization vehicle for transistor, capacitor and resistor testing

A method for testing an integrated circuit (IC) product, the method comprising:

• importing an original full-chip layout of a real IC product;
• partitioning the original full-chip layout into a plurality of probe groups, each probe group comprising a plurality of probe pads, and, a plurality of IC devices within an area of interest (AOI) having original routing interconnect for those IC devices;
• selecting a set of IC devices within the AOI using pattern extraction;
• for the selected set of IC devices, using pattern extraction to remove the original routing interconnect, and create customized interconnect layers (CIL) to reconfigure connection between the individual IC devices;
• incorporating the selected set of IC devices with the CIL into the original full-chip layout to create a modified full-chip layout such that a wafer fabricated using the modified full-chip layout comprises a real product with a built-in test vehicle;
• and
• testing the fabricated wafer utilizing one or more of the plurality of probe pads with the built-in test vehicle having the CIL and the selected set of IC devices,
• wherein the one or more of the plurality of probe pads are coupled to at least one of the selected set of IC devices in the fabricated wafer via the CIL.