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US 10,380,016 B2Granted
Semiconductor device including one or more semiconductor chips on a substrate
AssigneeToshiba Memory Corporation
InventorToshimitsu Arai
Life of this patent
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Abstract
In one embodiment, a semiconductor device includes a substrate, and a first wiring layer provided on the substrate. The device further includes a first insulator provided on the substrate and the first wiring layer and including an opening. The device further includes a first semiconductor chip provided above the substrate and in the opening of the first insulator, and a wire electrically connecting the first semiconductor chip and the first wiring layer.
Claims18
A semiconductor device comprising:
- a substrate;
- a first wiring layer provided on the substrate;
- a first insulator provided on the substrate and the first wiring layer and including an opening;
- a first semiconductor chip provided above the substrate and in the opening of the first insulator;
- a wire electrically connecting the first semiconductor chip and the first wiring layer;
- and
- a second semiconductor chip provided above the first semiconductor chip via a second adhesive and having a size larger than a size of the first semiconductor chip, the first semiconductor chip being located in the second adhesive.
4 more elements
Dependencies are inferred from the claim text.