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US 10,379,156 B2Granted
Bump ball testing system and method
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChewn-Pu Jou, Min-Jer Wang
Life of this patent
Estimating the term…
Abstract
An integrated circuit testing system includes a conductive structure, a conductive pad electrically connected with the conductive structure, a test circuit electrically connected with the conductive pad, a conductive line electrically connected with the conductive structure, the conductive line being configured to be connected with a ground, and a controller coupled with the test circuit. The controller is configured to selectively cause the test circuit to supply a voltage to the conductive structure via the conductive pad. The test circuit is configured to provide feedback to the controller indicative of whether the conductive structure is electrically connected with the conductive pad.
Claims20
An integrated circuit testing system, comprising:
- a conductive line connected to a node configured to have a ground voltage;
- and
- an integrated circuit comprising:
- a conductive structure;
- a conductive pad;
- a test circuit electrically connected with the conductive pad;
- and
- a controller coupled with the test circuit, the controller being configured to selectively cause the test circuit to supply a voltage to the conductive structure via the conductive pad,
- wherein
- the conductive structure is positioned between the conductive line and the conductive pad, wherein the conductive structure is the only conductive structure that is between the node and the test circuit,
- the conductive line and the conductive pad are positioned between the node and the test circuit, and
- the test circuit is configured to provide feedback to the controller indicative of whether the conductive structure is electrically connected with the conductive pad.
9 more elements
An integrated circuit testing system, comprising:
- a conductive line configured to carry a ground voltage;
- and
- an integrated circuit comprising:
- a first conductive bump structure, wherein the conductive line is configured to contact the first conductive bump structure;
- a second conductive bump structure separated from the first conductive bump structure, wherein the conductive line is configured to contact the second conductive bump structure;
- a first test circuit comprising a first current measurement circuit electrically connected with the first conductive bump structure;
- a second test circuit comprising a second current measurement circuit electrically connected with the second conductive bump structure;
- and
- a controller coupled with the first test circuit and with the second test circuit, the controller being configured to:
- selectively cause the first test circuit to supply a first voltage to the first conductive bump structure, the first voltage being different from the ground voltage;
- or
- selectively cause the second test circuit to supply a second voltage to the second conductive bump structure, the second voltage being different from the ground voltage,
- wherein
- the first test circuit is configured to provide a first test result from the first current measurement circuit electrically connected with the first conductive bump structure to the controller based on an output generated by the first current measurement circuit, the first test result being indicative of whether the first conductive bump structure is electrically connected with the conductive line, and
- the second test circuit is configured to provide a second test result from the second current measurement circuit electrically connected with the second conductive bump structure to the controller based on an output generated by the second current measurement circuit, the second test result being indicative of whether the second conductive bump structure is electrically connected with the conductive line.
12 more elements
A method of testing an integrated circuit, the method comprising:
- electrically connecting a first conductive structure of the integrated circuit and a second conductive structure of the integrated circuit to a conductive line having a ground voltage;
- supplying a first voltage from the integrated circuit to the first conductive structure to determine if the first conductive structure is capable of carrying the first voltage, the first voltage being different from the ground voltage;
- supplying a second voltage from the integrated circuit to the second conductive structure to determine if the second conductive structure is capable of carrying the second voltage, the second voltage being different from the ground voltage;
- and
- using a controller of the integrated circuit, generating a report indicating whether one or more of the first conductive structure or the second conductive structure is incapable of carrying the first voltage or the second voltage based on feedback received from a first test circuit individually coupled with the first conductive structure, the first test circuit is configured to output a first test result indicative of whether the first conductive structure is incapable of carrying the first voltage, and a second test circuit individually coupled with the second conductive structure, the second test circuit is configured to output a second test result indicative of whether the second conductive structure is incapable of carrying the second voltage.
2 more elements
Dependencies are inferred from the claim text.