Systems, methods and metrics for wafer high order shape characterization and wafer classification using wafer dimensional geometry tool

A polar grid partitioning method for partitioning a wafer surface, the method comprising:

• specifying a number of sectors and a number of zones required for the polar grid partitioning;
• calculating, with one or more processors, a sector angular span based on the number of sectors specified;
• calculating, with one or more processors, a radial span for each of the number of zones, wherein the radial span for a first zone having a first radial distance to the center of the wafer is different from the radial span for a second zone having a second radial distance to the center of the wafer;
• partitioning, with one or more processors, the wafer surface into a plurality of sites based on the sector angular span and the radial span for each zone to improve accuracy of wafer shape analysis performed on the wafer, wherein the plurality of sites have uniform site areas;
• calculating, with one or more processors, one or more measurement metrics based on the partitioning of the wafer surface into the plurality of sites based on the sector angular span and the radial span for each zone;
• and
• providing, with one or more processors, the one or more measurement metrics to control a process of one or more process tools.