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AssigneeInternational Business Machines Corporation
InventorsWilliam L. Brodsky, Silvio Dragone, Roger S. Krabbenhoft, David C. Long, Stefano S. Oggioni, Michael T. Peets, William Santiago-Fernandez
Estimating the term…
Methods of fabricating electronic circuits and electronic packages are provided. The electronic circuit includes a multilayer circuit board, and a tamper-respondent sensor embedded within the circuit board. The tamper-respondent sensor defines, at least in part, a secure volume associated with the multilayer circuit board. In certain implementations, the tamper-respondent sensor includes multiple tamper-respondent layers embedded within the circuit board including, for instance, one or more tamper-respondent frames and one or more tamper-respondent mat layers, with the tamper-respondent frame(s) being disposed, at least in part, above the tamper-respondent mat layer(s), which together define the secure volume where extending into the multilayer circuit board. In certain embodiments, one or more of the tamper-respondent layers are divided into multiple, separate tamper-respondent circuit zones, with the tamper-respondent layers, including the circuit zones, being electrically connected to monitor circuitry within the secure volume.
An electronic circuit comprising:
An electronic package comprising:
Dependencies are inferred from the claim text.