Alkaline earth metal-containing cleaning solution for cleaning semiconductor element, and method for cleaning semiconductor element using same
AssigneeMitsubishi Gas Chemical Company, Inc.
InventorsToshiyuki Oie, Kenji Shimada
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Abstract
According to the present invention, it is possible to provide a cleaning solution which removes a dry etching residue and photoresist on a surface of a semiconductor element having a low dielectric constant film (a low-k film) and at least one material selected from between a material that contains 10 atom % or more of titanium and a material that contains 10 atom % or more of tungsten, wherein the cleaning solution contains: 0.002-50 mass % of at least one type of oxidizing agent selected from among a peroxide, perchloric acid, and a perchlorate salt; 0.000001-5 mass % of an alkaline earth metal compound; and water.
Claims11
A cleaning solution which removes a dry etching residue and a photoresist on a surface of a semiconductor element having a low dielectric constant film (a low-k film) and at least one material selected from a material that contains 10 atomic % or more of titanium and a material that contains 10 atomic % or more of tungsten, wherein:
- the cleaning solution comprises:
- 0.002 to 50% by mass of at least one oxidant selected from the group consisting of a peroxide, perchloric acid and a perchlorate salt,
- 0.000001 to 5% by mass of an alkaline earth metal compound,
- a pH adjuster, and
- water;
- the cleaning solution has a pH value ranging from 3 to 14;
- and
- the cleaning solution does not contain hydrogen fluoride and does not contain strontium nitrate.
Dependencies are inferred from the claim text.