Apparatus with a high heat capacity and method for producing the same
AssigneeInfineon Technologies AG
InventorsBernd Goller, Matthias Steiert
Life of this patent
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Abstract
The present disclosure relates to an apparatus comprising a substrate, wherein a MEMS module is arranged on a first side of the substrate, the output signal from said MEMS module changing in the event of a change in temperature. Furthermore, the apparatus has a housing structure which is arranged on a first side of the substrate and has a recess in which the MEMS module is arranged. The apparatus also has a layer which is applied to the housing structure and increases the heat capacity of the apparatus. The present disclosure also relates to a method for producing an apparatus of this kind.
Claims21
An apparatus comprising:
- a substrate, wherein a MEMS module is arranged on a first side of the substrate, the MEMS module configured to produce an output signal that changes in the event of a change in temperature,
- a housing structure arranged on the first side of the substrate, the housing structure comprising a recess in which the MEMS module is arranged, and
- a layer applied to the housing structure, the layer configured to increase a heat capacity of the apparatus, wherein a heat capacity of the layer is greater than a heat capacity of the housing structure by at least a factor of one and a half.
A method comprising the following steps:
- providing a wafer substrate comprising a plurality of MEMS modules arranged on a first side of the wafer substrate, wherein an output signal from each MEMS module of the plurality of MEMS modules changes in the event of a change in temperature, and comprising a plurality of housing structures arranged on the first side of the wafer substrate, wherein each housing structure of the plurality of housing structures has a recess in each of which one of the plurality of MEMS modules is arranged, and wherein the plurality of housing structures and the plurality of MEMS modules form a plurality of packages, each housing structure of the plurality of housing structures together with its respective MEMS module of the plurality of MEMS modules forming one package of the plurality of packages
- applying a layer to at least one side of the housing structure of the plurality of packages, wherein the layer increases a heat capacity of each package of the plurality of packages, a heat capacity of the layer is greater than a heat capacity of the plurality of housing structures by at least a factor of one and a half, and
- separating each of the plurality of packages.
An apparatus comprising:
- a substrate, wherein a MEMS module is arranged on a first side of the substrate, the MEMS module configured to produce an output signal that changes in the event of a change in temperature,
- a housing structure arranged on the first side of the substrate, the housing structure comprising a recess in which the MEMS module is arranged, and
- a layer applied to the housing structure, the layer configured to increase a heat capacity of the apparatus, wherein the layer contains magnetic particles.
Dependencies are inferred from the claim text.