Exterior forming method and exterior forming structure of electronic component

Abstract

Disclosed herein are an exterior forming method and an exterior forming structure of an electronic component. The exterior forming method of an electronic component may include mounting an injection-molded product, which is injection molded as an electronic component, to an upper portion a heat transferring base unit, mounting a printing film having an ink layer for a heat transfer to the upper portion of the heat transferring base unit such that the ink layer faces an upper surface of the injection-molded product, and heat-transferring the ink layer on the upper surface of the injection-molded product by rotating a heating roll while closely attached at an upper portion of the printing film. The exterior forming method may also include forming an UV coating layer on an upper portion of the ink layer that is heat-transferred on the injection-molded product.

Dependencies are inferred from the claim text.