Overmolded ink delivery device
AssigneeHewlett-Packard Development Company, L.P.
InventorsChien-Hua Chen, Michael W. Cumbie, Devin Alexander Mourey
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Abstract
An ink delivery device is described. The ink delivery device includes an ink die with a first surface. The ink delivery device also includes an overmold to encapsulate a number of surfaces of the ink die. The overmold has a second surface that is wider than the first surface. The second surface receives an adhesive to attach the ink delivery device to a printhead. The ink delivery device also includes an ink slot passing through the overmold and at least a portion of the ink die.
Claims18
An ink delivery device comprising:
- an ink die comprising:
- a first surface to contact an overmold;
- and
- a groove which forms part of an ink slot;
- and
- the overmold to encapsulate a number of surfaces of the ink die, the overmold comprising:
- a second surface to receive an adhesive to attach the ink delivery device to a printhead, which second surface is wider than the first surface;
- and
- a groove which forms part of the ink slot;
- wherein a surface of the overmold is flush with a surface of the ink die.
An ink delivery system comprising:
- a printhead comprising an ink reservoir;
- a plurality of ink delivery devices, in which each ink delivery device comprises:
- an ink die comprising
- a first surface to contact an overmold;
- the overmold to encapsulate a number of surfaces of the ink die, the overmold comprising
- a second surface to receive an adhesive to attach the ink delivery device to a printhead, which second surface provides a larger contact area than the first surface;
- an ink slot cut through the ink die and the overmold;
- and
- an adhesive disposed between the printhead and the second surface to attach the ink delivery devices to the printhead, the adhesive being an expandable adhesive strip that is expanded to space multiple ink dies of the ink delivery devices.
A method of manufacturing an ink delivery device, the method comprising:
- placing an ink die with a first surface on a carrier substrate;
- encapsulating a number of surfaces of the ink die with an overmold having a second surface;
- in which:
- the second surface is used to attach the ink delivery device to a printhead;
- and
- the second surface is wider than the first surface;
- and
- forming, in the overmold and the ink die an ink slot through which ink passes;
- wherein encapsulating a number of surfaces of the ink die with an overmold having a second surface comprises:
- pouring a liquid epoxy over the ink die and carrier substrate;
- and
- hardening the liquid epoxy.
Dependencies are inferred from the claim text.