MEMS device, liquid ejecting head, liquid ejecting apparatus, and MEMS device manufacturing method

A MEMS device comprising:

• a wire that is formed of a conductive portion embedded into a recess opened in a first face of a substrate and a film member that is disposed over an opening of the recess in the first face;
• and
• a bump electrode that is electrically connected to the wire, wherein
• a total width, in a second direction intersecting a first direction along which the wire extends on the first face, of an opening of the recess in a connection region where the wire and the bump electrode are electrically connected to each other is narrower than a width, in the second direction, of an opening of the recess in a region outside the connection region.