Copper clad laminate
AssigneeUbe Industries, Ltd.
InventorsKohji Narui, Masafumi Hashimoto, Takuro Kochiyama
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Abstract
A copper-clad laminate is prepared by laminating a copper foil on one side or both sides of a polyimide film by thermocompression bonding. The flexibility of the copper-clad laminate is remarkably improved by employing a polyimide film having a thickness of 5 to 20 μm and a copper foil having a thickness of 1 to 18 μm.
Claims10
A copper-clad laminate prepared by laminating a copper foil on one side or both sides of a polyimide film by thermocompression bonding, wherein the polyimide film has a thickness of 5 to 20 μm, and the copper foil has a thickness of 1 to 18 μm, wherein the polyimide film is a thermocompression-bonding multilayer polyimide film having a thermoplastic polyimide layer on one side or both sides of a heat-resistant polyimide layer, wherein the thermoplastic polyimide layer comprises a thermoplastic polyimide and polyimide particles with a median size of 0.3 to 0.8 μm and a maximum size of 2 μm or less dispersed within at least a depth of 0.5 μm from a surface of the thermoplastic polyimide layer in a ratio of about 0.5 to 10% by weight relative to the thermoplastic polyimide in the thermoplastic polyimide layer, wherein the polyimide particles are prepared from pyromellitic acid component and p-phenylenediamine component.
Dependencies are inferred from the claim text.