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US 10,376,995 B2Granted
Tin-antimony-based high temperature solder for downhole components
AssigneeSchlumberger Technology Corporation
InventorsFrancis Dupouy, Mark Kostinovsky, Suriyakan Vongtragool Kleitz, Chandradip Pravinbhai Patel
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Abstract
A downhole tool conveyable within a wellbore extending into a subterranean formation, wherein the downhole tool comprises a first component, a second component, and a solder electrically and mechanically coupling the first and second components, wherein the solder comprises or consists of: from 9.6 to 10.2 weight % of antimony; from 0.01 to 0.25 weight % of manganese; and tin.
Claims17
An apparatus, comprising:
- a downhole tool conveyable within a wellbore extending into a subterranean formation, wherein the downhole tool comprises:
- a first component;
- a second component;
- and
- a solder electrically and mechanically coupling the first and second components, wherein the solder consists essentially of:
- antimony, manganese, and tin.
3 more elements
An apparatus, comprising:
- a downhole tool conveyable within a wellbore extending into a subterranean formation, wherein the downhole tool comprises:
- a first component;
- a second component;
- and
- a solder electrically and mechanically coupling the first and second components, wherein the solder consists of:
- from about 9 to about 11 percent, based on total weight of the solder, of antimony;
- from about 0.01 to about 0.25 percent, based on total weight of the solder, of manganese;
- and tin.
5 more elements
Dependencies are inferred from the claim text.