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OwnerHans-Jürgen Albrecht, Klaus Heinrich Georg Bartl +7inventors
InventorsHans-Jürgen Albrecht, Klaus Heinrich Georg Bartl, Werner Kruppa, Klaus Müller, Mathias Nowottnick, Gunnar Petzold, Hector Andrew Hamilton Steen, Klaus Wilke, Klaus Wittke
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The invention relates to a soldering material comprising an alloy that in addition to Sn (tin) as the major constituent, comprises 10 wt. % or less Ag (silver), 10 wt. % or less Bi (bismuth), 10 wt. % or less Sb (antimony) and 3 wt. % or less Cu (copper). Furthermore, the invention relates to a soldering material comprising a plurality of soldering components with such alloy compositions and contents in the soldering material that on fusing the soldering components an alloy is formed that comprises Sn, Ag, Bi, Sb and Cu in the abovementioned alloy contents.
A lead free soldering material consisting essentially of Sn (tin), 2 to 10 wt. % Ag, Bi, 1 to 3 wt. % Sb, 0.5 to 3 wt. % Cu and 0.05 to 0.3 wt. % Ni, wherein the Sb:Bi wt. % ratio is from 1:1.5-3.
A lead free soldering material consisting essentially of Sn (tin), 2 to 10 wt. % Ag, 1 to 3 wt. % Bi, 1 to 3 wt. % Sb, 0.5 to 3 wt. % Cu and 0.05 to 0.3 wt. % Ni.
Dependencies are inferred from the claim text.