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US 10,376,929 B2Granted
Apparatus and method for polishing a surface of a substrate
AssigneeEbara Corporation
InventorsYu Ishii, Masayuki Nakanishi, Keisuke Uchiyama
Life of this patent
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Abstract
An apparatus which can polish an entirety of a surface of a substrate, such as a wafer, is disclosed. The apparatus includes a substrate holder configured to hold a substrate and rotate the substrate; and a polishing head configured to rub a polishing tool against a first surface of the substrate to polish the first surface. The substrate holder includes a plurality of rollers which can contact a periphery of the substrate. The plurality of rollers are rotatable about their respective own axes.
Claims18
An apparatus comprising:
- a substrate holder configured to hold a substrate and rotate the substrate about an axis of the substrate holder, the substrate holder including a plurality of rollers which can contact a periphery of the substrate and are rotatable about their respective own axes;
- and
- a polishing head configured to rub a polishing surface of a polishing tool against a first surface of the substrate to polish the first surface,
- wherein a sum of a distance from an axis of the polishing head to an outermost edge of the polishing surface of the polishing tool and a distance from the axis of the substrate holder to the axis of the polishing head is longer than a radius of the substrate.
1 more element
A method comprising:
- rotating a substrate about an axis of a substrate holder by rotating a plurality of rollers about their respective own axes while keeping the plurality of rollers in contact with a periphery of the substrate, the substrate holder having the plurality of rollers;
- and
- polishing a first surface of the substrate by rubbing a polishing surface of a polishing tool against the first surface, the polishing tool being held by a polishing head,
- wherein a sum of a distance from an axis of the polishing head to an outermost edge of the polishing surface of the polishing tool and a distance from the axis of the substrate holder to the axis of the polishing head is longer than a radius of the substrate.
1 more element
Dependencies are inferred from the claim text.