Substrate processing system having susceptorless substrate support with enhanced substrate heating control
AssigneeApplied Materials, Inc.
InventorsJoseph M. Ranish, Kailash Patalay
Life of this patent
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Abstract
Methods and apparatus for processing substrates are provided herein. In some embodiments, an apparatus includes a process kit, the process kit comprising a first ring to support a substrate proximate a peripheral edge of the substrate; a second ring disposed about the first ring; and a path formed between the first and second rings that allows the first ring to rotate with respect to the second ring, wherein the path substantially prevents light from travelling between a first volume disposed below the first and second rings and a second volume disposed above the first and second rings.
Claims12
An apparatus for processing a substrate, comprising:
- a processing chamber having a substrate support comprising a first ring to support a substrate proximate a peripheral edge of the substrate, a base disposed below the first ring, and one or more and a plurality of support members extending from the base in contact with and supporting the first ring above the base;
- a second ring disposed about the substrate support, the second ring having an inner lip extending radially inward from an inner surface of the second ring;
- a lamphead to provide energy to a substrate when disposed on the substrate support, wherein the base is formed of material that is substantially transparent to wavelengths of light provided by the lamphead;
- a temperature sensor opposing the lamphead to measure energy radiated from the substrate;
- and
- a path formed between the first and second rings that allows the first ring to rotate with respect to the second ring, wherein the path substantially prevents light from travelling between a first volume disposed below the first and second rings and a second volume disposed above the first and second rings.
Dependencies are inferred from the claim text.