# US 10,375,867 B2 · Electronic device and method for producing same

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- Number: US 10,375,867 B2
- Document ID: US10375867B2
- Status: Granted
- Kind: B2
- Application number: 15/756,114
- Filed: 2017-03-27
- Published: 2018-09-06
- Granted: 2019-08-06
- Earliest claimed: 2016-04-27
- Assignees: OMRON Corporation
- Applicants: Omron Corporation
- Inventors: Wakahiro Kawai
- Web page: https://patentgrep.com/patent/US10375867B2

## CPC

- H05K 9/0084: {comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition}
- H05K 1/0218: {by printed shielding conductors, ground planes or power plane (H05K1/0236 takes precedence)}
- H05K 1/185: associated with components encapsulated in the insulating substrate of the PCBs; associated with components incorporated in internal layers of multilayer circuit boards
- H05K 1/189: characterised by the use of flexible or folded printed circuits
- H05K 3/0014: {Shaping of the substrate, e.g. by moulding}
- H05K 3/125: {by ink-jet printing}
- H05K 5/04: Metal casings
- H10W 42/20: protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
- H10W 74/019: {using temporary auxiliary substrates (H10W74/017 takes precedence)}
- H10W 74/121: {by multiple encapsulations, e.g. by a thin protective coating and a thick encapsulation}
- H10W 99/00: Subject matter not provided for in other groups of this subclass
- H05K 1/182: associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
- H05K 3/282: {for inhibiting the corrosion of the circuit, e.g. for preserving the solderability}
- H05K 3/288: {Removal of non-metallic coatings, e.g. for repairing}
- H05K 2201/0715: provided by an outer layer of PCB
- H05K 2201/0723: provided by an inner layer of PCB
- H05K 2201/09118: Moulded substrate
- H05K 2203/0156: Temporary polymeric carrier or foil, e.g. for processing or transferring
- H05K 2203/0191: Using tape or non-metallic foil in a process, e.g. during filling of a hole with conductive paste
- H05K 2203/1316: Moulded encapsulation of mounted components
- H05K 2203/1469: Circuit made after mounting or encapsulation of the components
- H10W 72/0198: {batch processes}
- H10W 72/9413: {on encapsulations}
- H10W 74/016: {using moulds}
- H10W 90/10: Configurations of laterally-adjacent chips
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

The present invention provides an electronic device which includes an electromagnetic shield, can keep down a production cost, can be made to have a reduced thickness, and has a high degree of freedom in designing a wiring circuit. Further, the present invention provides a method for producing such an electronic device. The electronic device (1A) includes at least one high frequency functional component (21), an electrically conductive member (10) which electromagnetically shields the at least one high frequency functional component (21), and a resin molded body (23) in which at least part of the high frequency functional component (21) and at least part of the electrically conductive member (10) are embedded and fixed.

## Claims

### Claim 1

An electronic device comprising:
at least one electronic component;
an electrically conductive member which electromagnetically shields the at least one electronic component;
a resin molded body in which at least part of the at least one electronic component and at least part of the electrically conductive member which electromagnetically shields the at least one electronic component are embedded and fixed;
a first electronic component which is the at least one electronic component that is electromagnetically shielded; and
a second electronic component which is not electromagnetically shielded, wherein:
the second electronic component is at least partially embedded in the resin molded body;
the first electronic component is fixed with an insulating member that is provided in a space surrounded by the electrically conductive member;
at least part of the insulating member is embedded in the resin molded body together with at least part of the first electronic component and at least part of the electrically conductive member;
the electrically conductive member includes a first electrically conductive member which is embedded in the resin molded body, a second electrically conductive member which is not embedded in the resin molded body, and at least one third electrically conductive member which is provided between the first electrically conductive member and the second electrically conductive member;
the first electrically conductive member and the second electrically conductive member are electrically connected with each other via the at least one third electrically conductive member;
an electrode of the first electronic component is connected with an electrode of the second electronic component on a surface of the resin molded body and on a surface of the insulating member, which is embedded in the resin molded body, via wiring connection such that a wire of the wiring connection connecting the electrode of the first electronic component with the electrode of the second electronic component does not contact with the at least one third electrically conductive member; and
a part between the wire of the wiring connection and the second electrically conductive member is insulated with an insulating member which is not embedded in the resin molded body or with air.

### Claim 2 (depends on 1)

The electronic device as set forth in claim 1, wherein the electrode of the first electronic component and the electrode of the second electronic component are flush with or substantially flush with the surface of the resin molded body.

### Claim 3 (depends on 1)

The electronic device as set forth in claim 1, wherein the second electrically conductive member has an opening which is provided immediately above at least one of the first electronic component.

### Claim 4 (depends on 2)

The electronic device as set forth in claim 2, wherein the wiring connection is formed by printing with use of an electrically conductive material.

### Claim 5 (depends on 1)

A method for producing an electronic device recited in claim 1, said method comprising:
an attaching/temporarily-fixing step of attaching and temporarily fixing at least one electronic component to a temporarily-fixing member;
a first electromagnetically shielding step of covering the at least one electronic component with a first insulating member and a first electrically conductive member so as to electromagnetically shield the at least one electronic component;
a resin molding step of placing the temporarily-fixing member inside a molding die after the first electromagnetically shielding step in a state in which the at least one electronic component, the first insulating member, and the first electrically conductive member are temporarily fixed to the temporarily-fixing member, and carrying out resin molding so that each of the at least one electronic component, the first insulating member, and the first electrically conductive member is at least partially embedded in a resin molded body;
a taking-out step of separating the temporarily-fixing member from the resin molded body which has been made in the resin molding step; and
a second electromagnetically shielding step of covering, after the taking-out step, the at least one electronic component with a second electrically conductive member so as to electromagnetically shield the at least one electronic component on a side opposite to a side on which the first electrically conductive member is provided.

### Claim 6 (depends on 5)

The method as set forth in claim 5, wherein:
in the attaching/temporarily-fixing step, an electrically conductive thin plate which has electrical conductivity is attached to the temporarily-fixing member;
the method further includes, after the taking-out step and before the second electromagnetically shielding step, a circuit forming step of forming a wiring circuit, which is connected with an electrode of the at least one electronic component, on a surface formed by the resin molded body and the first insulating member such that a wire does not make contact with the electrically conductive thin plate; and
in the second electromagnetically shielding step, a second insulating member is stacked on the wiring circuit and the at least one electronic component in a part excluding the electrically conductive thin plate, and then a second electrically conductive member is stacked on a region in which the at least one electronic component is embedded and which includes the electrically conductive thin plate.

### Claim 7 (depends on 6)

The method as set forth in claim 6, wherein the first insulating member, the first electrically conductive member, the second insulating member, the second electrically conductive member, and the wiring circuit are formed by ink-jet printing.

### Claim 8 (depends on 6)

The method as set forth in claim 6, wherein in the circuit forming step, the wiring circuit is formed by printing wiring by spraying electrically conductive ink.

### Claim 9 (depends on 1)

The electronic device as set forth in claim 1, wherein each of the first electrically conductive member and the second electrically conductive member comprises a thin film having a thickness of 1 μm to 10 μm.

### Claim 10 (depends on 1)

The electronic device as set forth in claim 1, wherein the at least one third electrically conductive member comprises a metallic member having a thickness of 0.1 mm or more.