# US 10,375,849 B2 · Backplane electronic board and associated electronic control unit

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- Number: US 10,375,849 B2
- Document ID: US10375849B2
- Status: Granted
- Kind: B2
- Application number: 15/559,975
- Filed: 2016-03-23
- Published: 2018-04-19
- Granted: 2019-08-06
- Earliest claimed: 2015-03-23
- Assignees: Safran Electronics & Defense
- Applicants: Safran Electronics & Defense
- Inventors: Francois Guillot; Pascal Spoor; Patrice Chetanneau
- Web page: https://patentgrep.com/patent/US10375849B2

## CPC

- H05K 7/1439: {Back panel mother boards}
- G06F 1/184: Mounting of motherboards
- H01R 12/7064: {Press fitting}
- H01R 12/716: {Coupling device provided on the PCB}
- H05K 1/111: {Pads for surface mounting, e.g. lay-out}
- H05K 1/115: {Via connections; Lands around holes or via connections (H05K1/112 takes precedence)}
- H05K 3/0011: {Working of insulating substrates or insulating layers}
- H05K 3/421: {Blind plated via connections (H05K3/422, H05K3/423 and H05K3/425 take precedence)}
- H05K 3/4644: {by building the multilayer layer by layer, i.e. build-up multilayer circuits (making via holes in the insulating layers H05K3/0011; special circuit boards as base or core whereon the multilayer is built H05K3/4602)}
- H05K 7/1412: {hold down mechanisms, e.g. avionic racks}
- H05K 7/1445: {with double-sided connections}
- H05K 7/1452: {Mounting of connectors; Switching; Reinforcing of back panels}
- H05K 7/1459: {Circuit configuration, e.g. routing signals}
- H05K 3/0094: {Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement}
- H05K 2201/0104: Properties and characteristics in general
- H05K 2201/09509: Blind vias, i.e. vias having one side closed
- H05K 2201/09545: Plated through-holes or blind vias without lands
- H05K 2201/10189: Non-printed connector
- H05K 2201/10295: Metallic connector elements partly mounted in a hole of the PCB
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- G06F: ELECTRIC DIGITAL DATA PROCESSING (computer systems based on specific computational models G06N)
- H01R: ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS

## Abstract

The present invention concerns a backplane electronic board (20) having on inner face (142) suitable for being connected to electronic board connectors (12) and an outer face (143) suitable for being connected to an outer connector (15), the backplane board (20) being characterized in that it has blind holes opening on the inner face (142) of same, and holes opening on the outer face (143) of same, the holes being suitable for receiving press-fit connection elements and forming therewith an electrical connection point.

## Claims

### Claim 1

A backplane electronic board comprising:
an internal face adapted for being connected to connectors of electronic boards and an external face adapted for being connected to an external connector, the backplane board having a first leak-proof membrane, a series of first blind holes opening on the one hand on the internal face of the backplane electronic board and on the other hand on the first leak-proof membrane, and a second leak-proof membrane, a series of second blind holes opening on the one hand on the external face of the backplane electronic board and on the other hand on the second leak-proof membrane, the first and the second blind holes being adapted for receiving force-insertion connection elements and forming with them an electric connection point;
two conductive layers connected to two equipotentials positioned on either side of a central insulating layer, both conductive layers being connected together with a cylindrical metal layer, and further having metallized through-holes which cross the backplane board on both sides, the metallized through-holes, the cylindrical metal layer, and both conductive layers forming a capacitive through-hole and therefore a low-pass filtering network ensuring a function of filtering the electromagnetic noise;
a main printed circuit having two multilayer printed circuits, two insulating layers, and a double face printed circuit positioned between the two insulating layers, the two insulating layers positioned between the two multilayer printed circuits, the double face printed circuit forming a shielding area; and
an interface platelet attached on the main printed circuit, the interface platelet having holes adapted for receiving force-insertion connection elements and forming with them an electric connection point.

### Claim 2 (depends on 1)

The backplane electronic board according to claim 1, comprising:
a first printed circuit having a face intended to form the internal face of the backplane electronic board;
a second printed circuit having a face intended to form the external face of the backplane electronic board and;
a third printed circuit;
the first leakproof membrane being positioned between the first printed circuit and the third printed circuit;
the second leakproof membrane being positioned between the second printed circuit and the third printed circuit.

### Claim 3 (depends on 1)

The backplane board according to claim 1, wherein the first membrane is positioned between the multilayer printed circuit, and one of the insulating layers.

### Claim 4 (depends on 1)

The backplane board according to claim 1, wherein the interface platelet comprising a matrix of beads adapted for being welded on the main printed circuit.

### Claim 5 (depends on 1)

The backplane board according to claim 1, wherein the first blind holes being advantageously covered with a third leak-proof membrane intended to protect the metallized holes and to be pierced by force-insertion connection elements.

### Claim 6 (depends on 1)

The backplane board according to claim 1, wherein the leak-proof membranes are polyimide films.

### Claim 7 (depends on 1)

An electronic computer comprising a mechanical frame, the backplane board according to claim 1, one or several electronic board connectors connected to the backplane board on the backplane board's internal face, and at least one external connector connected to the backplane board on its external face.

### Claim 8 (depends on 1)

A method for manufacturing a backplane electronic board according to claim 1, comprising the following steps:
(E1) providing a first printed circuit having a first face and a second face intended to form the internal face of the backplane electronic board, a second printed circuit having a first face and a second face intended to form the external face of the backplane electronic board and a third printed circuit;
(E2) depositing on the first face of the first printed circuit of a film adapted for solidifying and forming a first membrane; and depositing on the first face of the second printed circuit a film adapted for solidifying and forming a second membrane;
(E3) attachment of the first face of the first printed circuit on one of the faces of the third printed circuit;
(E4) attachment of the first face of the second printed circuit on the other face of the third printed circuit;
(E5) forming in the first printed circuit a series of first blind holes opening on the one hand on the internal face of the backplane electronic board, and on the other hand on the first leak-proof membrane;
(E6) forming in the second printed circuit a series of second blind holes opening on the one hand on the external face of the backplane electronic board, and on the other hand on the second leak-proof membrane.

### Claim 9 (depends on 8)

The manufacturing method according to claim 8, further comprising the following steps:
before step (E2):
(E1′) forming through-holes in the third printed circuit;
(E1″) depositing a first metallization on the wall of the through-holes;
during steps (E3) and (E4), the first printed circuit is attached onto the third printed circuit and the second printed circuit onto the third printed circuit by insulating resin, the insulating resin forming an insulating layer on the wall of the through-holes;
(E7) forming in the first printed circuit and the second printed circuit through-holes communicating with those formed in the third printed circuit;
(E8) depositing a second metallization on the insulating layer covering the wall of the through-holes.

### Claim 10

A backplane electronic board comprising:
an internal face adapted for being connected to connectors of electronic boards and an external face adapted for being connected to an external connector, the backplane board having a first leak-proof membrane, a series of first blind holes opening on the one hand on the internal face of the backplane electronic board and on the other hand on the first leak-proof membrane, and a second leak-proof membrane, a series of second blind holes opening on the one hand on the external face of the backplane electronic board and on the other hand on the second leak-proof membrane, the first and the second blind holes being adapted for receiving force-insertion connection elements and forming with them an electric connection point;
two conductive layers connected to two equipotentials positioned on either side of a central insulating layer, both conductive layers being connected together with a cylindrical metal layer, and further having metallized through-holes which cross the backplane board on both sides, the metallized through-holes, the cylindrical metal layer, and both conductive layers forming a capacitive through-hole and therefore a low-pass filtering network ensuring a function of filtering the electromagnetic noise;
a main printed circuit having two multilayer printed circuits, two insulating layers, and a double face printed circuit positioned between the two insulating layers, the two insulating layers positioned between the two multilayer printed circuits, the double face printed circuit forming a shielding area;
the backplane electronic board further comprising:
a first printed circuit having a face intended to form the internal face of the backplane electronic board;
a second printed circuit having a face intended to form the external face of the backplane electronic board and; a third printed circuit;
the first leak-proof membrane being positioned between the first printed circuit and the third printed circuit;
the second leak-proof membrane being positioned between the second printed circuit and the third printed circuit;
wherein the first membrane is positioned between the multilayer printed circuit, and one of the insulating layers; and
an interface platelet attached on the main printed circuit, the interface platelet having holes adapted for receiving force-insertion connection elements and forming with them an electric connection point.