# US 10,375,845 B2 · Devices with mounted components

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- Number: US 10,375,845 B2
- Document ID: US10375845B2
- Status: Granted
- Kind: B2
- Application number: 15/400,255
- Filed: 2017-01-06
- Published: 2018-07-12
- Granted: 2019-08-06
- Earliest claimed: 2017-01-06
- Assignees: Microsoft Technology Licensing, LLC
- Applicants: Microsoft Technology Licensing, LLC
- Inventors: Erin Elizabeth Hurbi; Michael Nikkhoo; Igor Markovsky; Brian Joseph Toleno
- Web page: https://patentgrep.com/patent/US10375845B2

## CPC

- H05K 5/0247: {Electrical details of casings, e.g. terminals, passages for cables or wiring}
- G02B 30/34: Stereoscopes providing a stereoscopic pair of separated images corresponding to parallactically displaced views of the same object, e.g. three-dimensional [3D] slide viewers
- G06F 1/163: {Wearable computers, e.g. on a belt}
- G06F 1/1656: {Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories (mounting of accessories to a computer display G06F1/1607; display hoods G06F1/1603; cooling arrangements for portable computers G06F1/203)}
- G06F 1/1658: {related to the mounting of internal components, e.g. disc drive or any other functional module}
- H05K 7/14: Mounting supporting structure in casing or on frame or rack
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- G02B: OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G06F: ELECTRIC DIGITAL DATA PROCESSING (computer systems based on specific computational models G06N)

## Abstract

Devices with components mounted to a surface interior often encounter problems with generated heat, which is difficult to dissipate from a tightly packed and sealed device interior. Excessive heat may also distort the surface substrate material, which may become brittle from accumulated thermal stress and/or warp in a manner that displaces the position and/or orientation of the components. Presented herein are device manufacturing techniques in view of temperature considerations. Devices may comprise a device housing of a housing material that exhibits a substantially isotropic coefficient of thermal expansion (CTE) and/or thermal conductivity in various dimensions. Devices may also comprise a housing mount for a component cluster that is mountable on the interior surface of the device housing, with electrically conductive traces integrated with the device housing that conductively interconnect the housing mount with the component cluster, optionally generated via laser-activation of a conductive additives or deposition of conductive material.

## Claims

### Claim 1

A device comprising:
a device housing comprising a housing material exhibiting a substantially isotropic coefficient of thermal expansion;
a first component mounted on an interior surface of the device housing;
a housing mount for attaching a component cluster, the housing mount mounted on the interior surface of the device housing;
a cluster mount coupled to the housing mount to attach the component cluster to the device housing, the component cluster comprising a display; and
electrically conductive traces formed on the device housing that conductively interconnect the housing mount through the device housing to the display of the component cluster.

### Claim 2 (depends on 1)

The device of claim 1, wherein the housing material further comprises a polymer comprising oriented fibers that are oriented to provide the substantially isotropic coefficient of thermal expansion, wherein the substantially isotropic coefficient of thermal expansion is substantially isotropic along at least two axes.

### Claim 3 (depends on 1)

The device of claim 1, wherein the device housing further comprises a thermally conductive additive that increases thermal conductivity through the device housing of the device.

### Claim 4 (depends on 3)

The device of claim 3, wherein the thermally conductive additive further exhibits substantially isotropic thermal conductivity along at least two axes.

### Claim 5 (depends on 1)

The device of claim 1, wherein:
the device housing further comprises a laser-activated conductive additive; and
the electrically conductive traces comprise laser activated traces.

### Claim 6 (depends on 1)

The device of claim 1, wherein the electrically conductive traces further comprise conductive material deposited on the interior surface of the device housing.

### Claim 7 (depends on 1)

The device of claim 1, wherein:
the cluster mount further comprises electrically conductive traces that are conductively interconnected with the component cluster; and
the electrically conductive traces of the housing mount further conductively connect to the electrically conductive traces of the cluster mount, while the housing mount is coupled with the cluster mount, to conductively interconnect the first component and the component cluster.

### Claim 8 (depends on 1)

The device of claim 1, wherein the housing material further comprises a resin that reduces a strain-to-failure measurement of the housing material.

### Claim 9 (depends on 1)

The device of claim 1, further comprising a heatsink that conducts heat away from the component cluster through the device housing.

### Claim 10

A component cluster mountable within a device, the component cluster comprising:
a component cluster body;
a cluster mount positioned on the component cluster body that couples with a housing mount of an interior surface of a device housing of the device;
an electrical component set comprising at least two electrical components mounted on the component cluster body, the at least two electrical components comprising a display; and
electrically conductive traces formed on the component cluster body that conductively connect the at least two electrical components through the cluster mount to another electrical component of the device.

### Claim 11 (depends on 10)

The component cluster of claim 10, wherein the cluster mount comprises a single mount point that couples with a single housing mount of the interior surface of the device.

### Claim 12 (depends on 10)

The component cluster of claim 10, wherein the at least two electrical components comprise:
a sensor coupled with the display.

### Claim 13 (depends on 10)

The component cluster of claim 10, wherein:
the component cluster is mounted within the device, the device comprising a helmet mountable on a head of a user; and
the electrical component set comprises an electrical component selected from:
a gaze-tracking camera;
an environment-tracking camera;
a speaker;
a display;
an inertial measurement unit;
a temperature sensor;
a processor;
a network adapter; and
a battery.

### Claim 14 (depends on 10)

The component cluster of claim 10, wherein:
a position of a first electrical component of the electrical component set is selected relative to a position of a second electrical component of the electrical component set; and
the component cluster body further comprises an optical bench that maintains an orientation of the first electrical component relative to the second electrical component.

### Claim 15 (depends on 10)

The component cluster of claim 10, wherein:
the component cluster is mounted to the interior surface of the device;
a position of a first electrical component of the electrical component set is selected relative to an orientation relative to the interior surface of the device; and
the component cluster body further comprises an optical bench that maintains an orientation of the first electrical component relative to the interior surface of the device.

### Claim 16 (depends on 10)

The component cluster of claim 10, wherein the component cluster is mounted in a device, and wherein:
the housing mount of the interior surface of the device housing further comprises electrically conductive traces that conductively interconnect the component cluster and a component mounted on the device; and
the electrically conductive traces formed on the component cluster body further connect with the electrically conductive traces of the chousing mount when the cluster mount is coupled with the housing mount.

### Claim 17 (depends on 10)

The component cluster of claim 10, wherein:
the component cluster is mounted to the interior surface of the device housing,
the device housing comprising a housing material exhibiting a substantially isotropic coefficient of thermal expansion; and
the material of the component cluster body comprises the housing material of the device housing.

### Claim 18 (depends on 10)

The component cluster of claim 10, wherein the component cluster body further comprises an electrically insulated substrate upon which the at least two electrical components are formed.

### Claim 19

A wearable device mountable on a user, the wearable device comprising:
a device housing comprising a housing material exhibiting a substantially isotropic coefficient of thermal expansion and a substantially isotropic thermal conductivity, and defining an interior surface of the device housing;
a component cluster comprising:
an optical bench mounted to the interior surface of the device housing, and
at least two electrical components each mounted to the optical bench with a position and an orientation, wherein the optical bench maintains the position and orientation of each of the at least two electrical components relative to other electrical components and the interior surface; and
electrical traces formed on the component cluster that conductively interconnect the at least two electrical components.

### Claim 20 (depends on 19)

The wearable device of claim 19, wherein:
the wearable device further comprises a head-mounted device wearable on the head of the user;
the at least two electrical components comprise:
a left display that presents a left visual to a user, and
a right display that presents a right visual to the user; and
the optical bench is mounted to the interior surface of the device housing at a mount position that maintains a position and an orientation of the left display relative to a left eye of the user, and maintains a position and an orientation of the right display relative to a right eye of the user.