# US 10,375,837 B2 · Method of manufacturing a ceramic substrate

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- Number: US 10,375,837 B2
- Document ID: US10375837B2
- Status: Granted
- Kind: B2
- Application number: 15/543,264
- Filed: 2016-01-08
- Published: 2018-02-01
- Granted: 2019-08-06
- Earliest claimed: 2015-01-13
- Assignees: Ngk Spark Plug Co., Ltd.
- Applicants: Ngk Spark Plug Co., Ltd.
- Inventors: Tatsuya Katoh; Masanori Ito; Masaki Kutsuna
- Web page: https://patentgrep.com/patent/US10375837B2

## CPC

- H05K 3/40: Forming printed elements for providing electric connections to or between printed circuits
- B32B 9/005: {comprising one layer of ceramic material, e.g. porcelain, ceramic tile (layered products with at least two ceramic layers composed mainly of ceramic B32B18/00)}
- C03C 4/14: for electro-conductive glass
- C03C 10/0054: {containing PbO, SnO2, B2O3}
- C04B 35/6303: {Inorganic additives}
- H05K 1/0296: {Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295 (H05K1/11 takes precedence; lay-out adapted to mounted component configuration H05K1/18)}
- H05K 1/0306: {Inorganic insulating substrates, e.g. ceramic, glass}
- H05K 1/09: Use of materials for the {conductive, e.g. } metallic pattern
- H05K 1/092: {Dispersed materials, e.g. conductive pastes or inks}
- H05K 3/12: using {thick film techniques, e.g.} printing techniques to apply the conductive material {or similar techniques for applying conductive paste or ink patterns}
- H05K 3/1291: {Firing or sintering at relative high temperatures for patterns on inorganic boards, e.g. co-firing of circuits on green ceramic sheets}
- H05K 3/28: Applying non-metallic protective coatings {(H05K3/0091 takes precedence; methods for intermediate insulating layers for build-up multilayer circuits H05K3/4673)}
- H05K 3/285: {Permanent coating compositions}
- H05K 3/321: by conductive adhesives
- H05K 3/4061: {for via connections in inorganic insulating substrates}
- H05K 3/46: Manufacturing multilayer circuits
- H05K 3/4664: {Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders (H05K3/4647 takes precedence)}
- H10W 70/692: Ceramics or glasses
- B32B 2307/202: Conductive
- C03C 2204/00: Glasses, glazes or enamels with special properties
- C04B 2237/40: Metallic
- C04B 2237/704: of one or more of the ceramic layers or articles
- H05K 3/4629: {laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets}
- H05K 2201/017: Glass ceramic coating, e.g. formed on inorganic substrate
- H05K 2201/0769: Anti metal-migration, e.g. avoiding tin whisker growth
- H05K 2203/1126: Firing, i.e. heating a powder or paste above the melting temperature of at least one of its constituents
- Y10T 29/49163: with sintering of base
- Y10T 428/12458: having composition, density, or hardness gradient
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- B32B: LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- C03C: CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C04B: LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE {(roofing granules E04D7/005)}; CERAMICS (devitrified glass-ceramics C03C10/00); REFRACTORIES; TREATMENT OF NATURAL STONE
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

## Abstract

A method of manufacturing a ceramic substrate includes the steps of preparing a ceramic paste in which a powder of at least one of a metal boride and a metal silicide is added to a raw material powder of a glass ceramic, applying the ceramic paste to a green sheet which is to become a ceramic layer after firing, applying a conductor paste which is to become a conductor trace after firing to the ceramic paste having been applied to the green sheet, and firing the green sheet carrying the ceramic paste and the conductor paste applied thereto.

## Claims

### Claim 1

A method of manufacturing a ceramic substrate including a ceramic layer mainly formed of a glass ceramic and a conductor trace mainly formed of silver (Ag), comprising:
a step of preparing a ceramic paste in which a powder of at least one of a metal boride and a metal silicide is added to a raw material powder of the glass ceramic, the raw material powder of the glass ceramic comprising borosilicate glass powder and alumina (Al2O3) powder;
a step of applying the ceramic paste to a green sheet which is to become the ceramic layer after firing;
a step of applying a conductor paste which is to become the conductor trace after firing to the ceramic paste having been applied to the green sheet; and
a step of firing the green sheet carrying the ceramic paste and the conductor paste applied thereto;
wherein a total amount of the at least one of the metal boride and the metal silicide with respect to an amount of an inorganic component of the ceramic paste is 3 vol. % to 7 vol. % such that diffusion of a silver component of the conductor trace is prevented.

### Claim 2 (depends on 1)

The method of manufacturing a ceramic substrate according to claim 1, wherein the powder includes metal boride that is at least one of lanthanum hexaboride (LaB6), silicon hexaboride (SiB6), and titanium diboride (TiB2).

### Claim 3 (depends on 1)

The method of manufacturing a ceramic substrate according to claim 1, wherein the powder includes metal silicide that is at least one of titanium disilicide (TiSi2), zirconium disilicide (ZiSi2), and tantalum disilicide (TaSi2).

### Claim 4

A method of manufacturing a ceramic substrate including a ceramic layer mainly formed of a glass ceramic and a conductor trace mainly formed of silver (Ag), comprising:
a step of preparing a ceramic slurry in which a powder of at least one of a metal boride and a metal silicide is added to a raw material powder of the glass ceramic, the raw material powder of the glass ceramic comprising borosilicate glass powder and alumina (Al2O3) powder;
a step of making from the ceramic slurry a green sheet which is to become the ceramic layer after firing;
a step of applying a conductor paste which is to become the conductor trace after firing to the green sheet; and
a step of firing the green sheet carrying the conductor paste applied thereto;
wherein, a total amount of the at least one of the metal boride and the metal silicide with respect to an amount of an inorganic component of the ceramic slurry is 3 vol. % to 7 vol. % such that diffusion of a silver component of the conductor trace is prevented.