# US 10,375,834 B1 · 3D printing with components embedded

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- Number: US 10,375,834 B1
- Document ID: US10375834B1
- Status: Granted
- Kind: B1
- Application number: 14/468,268
- Filed: 2014-08-25
- Granted: 2019-08-06
- Earliest claimed: 2013-08-27
- Assignees: Flextronics AP, LLC
- Applicants: Flextronics AP, LLC
- Inventors: Weifeng Liu; Murad Kurwa
- Web page: https://patentgrep.com/patent/US10375834B1

## CPC

- H05K 3/305: {Affixing by adhesive}
- H01R 12/52: connecting to other rigid printed circuits or like structures
- H05K 1/038: {Textiles (used as reinforcing materials for organic insulating substrates H05K1/0366)}
- H05K 1/0393: {Flexible materials (H05K1/038 takes precedence; specific organic compositions are classified in H05K1/0313 and subgroups)}
- H05K 1/14: Structural association of two or more printed circuits (providing electric connection to or between printed circuits H05K1/11, H01R12/00)
- H05K 1/181: associated with surface mounted components
- H05K 3/241: {characterised by the electroplating method; means therefor, e.g. baths or apparatus}
- H05K 3/34: by soldering
- H05K 3/3426: {characterised by the leads}
- H05K 3/4007: {Surface contacts, e.g. bumps (H05K3/4092 takes precedence; deposition of finish layers on pads H05K3/24; forming solder bumps H05K3/3465)}
- H05K 3/4015: {using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres}
- H05K 13/04: Mounting of components {, e.g. of leadless components}
- H05K 1/0271: {Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion}
- H05K 3/3436: {having an array of bottom contacts, e.g. pad grid array or ball grid array components}
- H05K 2201/068: wherein the coefficient of thermal expansion is important
- H05K 2201/10734: Ball grid array [BGA]; Bump grid array
- H05K 2201/10946: Leads attached onto leadless component after manufacturing the component
- H05K 2201/10984: Component carrying a connection agent, e.g. solder, adhesive
- H05K 2201/2045: Protection against vibrations
- H05K 2203/0104: for patterning or coating
- H05K 2203/0338: Transferring metal or conductive material other than a circuit pattern, e.g. bump, solder, printed component
- H05K 2203/0723: Electroplating, e.g. finish plating
- Y02P 70/50: Manufacturing or production processes characterised by the final manufactured product
- Y10T 29/49169: Assembling electrical component directly to terminal or elongated conductor
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H01R: ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- Y02P: CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

## Abstract

Methods of and devices for using additive processes (e.g., 3D printing) to embed components inside an object are disclosed. In some embodiments, the components include active components, such as computer chips. In other embodiments, the components include passive components, such as inductor, resistor, and capacitors. The methods and devices disclosed herein can be used for rapid prototyping and fast manufacturing.

## Claims

### Claim 1

A method of making an electronic board comprising:
a. coupling one or more discrete electronic components to a base layer; and
b. additive printing around and on the one or more electronic components after coupling the one or more electronic components to the base layer, wherein additive printing forms an insulating layer over the one or more electronic components, wherein the insulating layer has one or more holes formed by the additive process, the one or more holes extending through the insulating layer to a surface of each electronic component.

### Claim 2 (depends on 1)

The method of claim 1, wherein the additive printing comprises 3D printing.

### Claim 3 (depends on 1)

The method of claim 1, wherein the base layer is formed by using the additive printing.

### Claim 4 (depends on 1)

The method of claim 1, wherein the base layer is formed by layer-by-layer printing.

### Claim 5 (depends on 1)

The method of claim 1, wherein the electronic components comprise one or more computing chips.

### Claim 6 (depends on 1)

The method of claim 1, wherein the coupling comprises attaching using an adhesive.

### Claim 7 (depends on 1)

The method of claim 1, further comprising forming a conductive path pattern.

### Claim 8 (depends on 7)

The method of claim 7, wherein the conductive path pattern is formed by printing.

### Claim 9 (depends on 8)

The method of claim 8, wherein the printing comprises using an electrically conductive ink.

### Claim 10 (depends on 1)

The method of claim 1, further comprising depositing metals in the one or more holes after the one or more holes are formed.