# US 10,375,824 B2 · Multi-functional high-current circuit board > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,375,824 B2 - Document ID: US10375824B2 - Status: Granted - Kind: B2 - Application number: 15/758,460 - Filed: 2016-08-11 - Published: 2018-09-13 - Granted: 2019-08-06 - Earliest claimed: 2015-09-11 - Assignees: ZF Friedrichshafen AG - Applicants: ZF Friedrichshafen AG - Inventors: Michael Sperber; Wilfried Lassmann; Dirk Schramm - Web page: https://patentgrep.com/patent/US10375824B2 ## CPC - H05K 1/0265: {characterized by the lay-out of or details of the printed conductors, e.g. reinforced conductors, redundant conductors, conductors having different cross-sections} - H05K 1/0206: {by printed thermal vias} - H05K 1/0209: {External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings} - H05K 1/021: {Components thermally connected to metal substrates or heat-sinks by insert mounting} - H05K 1/115: {Via connections; Lands around holes or via connections (H05K1/112 takes precedence)} - H05K 1/185: associated with components encapsulated in the insulating substrate of the PCBs; associated with components incorporated in internal layers of multilayer circuit boards - H05K 2201/064: Fluid cooling, e.g. by integral pipes - H05K 2201/066: Heatsink mounted on the surface of the printed circuit board [PCB] - H05K 2201/09327: Special sequence of power, ground and signal layers in multilayer PCB - H05K 2201/10015: Non-printed capacitor - H05K 2201/10053: Switch - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract A multifunctional high current circuit board includes a high current-carrying current-conducting layer and a switching layer, which is connected to at least one heat source, wherein high current-carrying potentials are conducted into the switching layer. ## Claims ### Claim 1 A multifunctional high current circuit board comprising: a. a high-current-conducting layer that includes a high current-carrying structure: and b. a switching layer that includes: two switching sub-layers electrically and thermally connected to the high current-carrying structure, and at least two heat sources arranged adjacent to one another, disposed below the two switching sub-layers, wherein the two switching sub-layers are configured to carry high current potentials; wherein the two switching sub-layers are interconnected by at least one micro through-hole plating; wherein high current-carrying potentials are conducted into the switching layer; and a monolithic passive cooling element configured to overlay the at least two heat sources, wherein the passive cooling element defines first and second partially enclosed spaces for receiving a first and a second of the at least two heat sources, respectively, wherein an interior of the first enclosed space is configured to compliment an outside surface of the first heat source, and an interior of the second enclosed space is configured to complement an outside surface of the second heat source to thereby efficiently draw heat generated by the respective heat sources away from the heat sources. ### Claim 2 (depends on 1) The multifunctional high current circuit board of claim 1, wherein the at least one heat source comprises an electrolyte capacitor and/or a power switch. ### Claim 3 (depends on 1) The multifunctional high current circuit board of claim 1, wherein the passive cooling element is at least in some sections attached to the high current circuit board by a heat-conducting medium. ### Claim 4 (depends on 1) The multifunctional high current circuit board of claim 1, wherein the passive cooling element is directly connected to one or both of: at least one of the at least two heat sources and the two switching sub-layers via a thermal connecting element. ### Claim 5 (depends on 4) The multifunctional high current circuit board of claim 4, wherein the thermal connecting element is a sealing compound and/or a heat-conducting medium. ### Claim 6 (depends on 1) The multifunctional high current circuit board of claim 1 further comprising an active cooling element. ### Claim 7 (depends on 6) The multifunctional high current circuit board of claim 6, wherein the active cooling element is designed as a cooling fan or as cooling water pump. ### Claim 8 (depends on 6) The multifunctional high current circuit board of claim 6, wherein the active cooling element is connected to the at least one heat source via a thermal connecting element and/or via a passive cooling element. ### Claim 9 (depends on 1) The multifunctional high current circuit board of claim 1, wherein the passing cooling element is designed as a heat dissipation layer. ### Claim 10 (depends on 1) The multifunctional high current circuit board of claim 1, wherein the passive cooling element is at least in some sections attached to the high current circuit board by a heat-conducting medium. ### Claim 11 (depends on 3) The multifunctional high current circuit board of claim 3, wherein the passive cooling element is directly connected to the one or both of: at least one of the at least two heat source and the two switching sub-layers via a thermal connecting element. ### Claim 12 (depends on 11) The multifunctional high current circuit board of claim 11, wherein the thermal connecting element is a sealing compound and/or a heat-conducting medium. ### Claim 13 (depends on 6) The multifunctional high current circuit board of claim 6, wherein the active cooling element is arranged adjacent to the at least one heat source. ### Claim 14 (depends on 13) The multifunctional high current circuit board of claim 13, wherein the active cooling element is designed as a cooling fan or as cooling water pump. ### Claim 15 (depends on 7) The multifunctional high current circuit board of claim 7, wherein the active cooling element is connected to the at least one heat source via a thermal connecting element and/or via a passive cooling element.