# US 10,375,821 B2 · Converter mounting board > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,375,821 B2 - Document ID: US10375821B2 - Status: Granted - Kind: B2 - Application number: 15/157,991 - Filed: 2016-05-18 - Published: 2016-12-01 - Granted: 2019-08-06 - Earliest claimed: 2015-05-25 - Assignees: Fujitsu Limited - Applicants: Fujitsu Limited - Inventors: Kazuya Okamoto; Hironobu Kageyama - Web page: https://patentgrep.com/patent/US10375821B2 ## CPC - H05K 1/0237: {High frequency adaptations (H05K1/0216 takes precedence)} - H02M 1/44: Circuits or arrangements for compensating for electromagnetic interference in converters or inverters - H05K 1/0243: {Printed circuits associated with mounted high frequency components} - H05K 1/0265: {characterized by the lay-out of or details of the printed conductors, e.g. reinforced conductors, redundant conductors, conductors having different cross-sections} - H02M 3/1566: {with means for compensating against rapid load changes, e.g. with auxiliary current source, with dual mode control or with inductance variation} - H05K 1/113: {Via provided in pad; Pad over filled via} - H05K 1/144: {Stacked arrangements of planar printed circuit boards} - H05K 2201/042: Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other - H05K 2201/0979: Redundant conductors or connections, i.e. more than one current path between two points - H05K 2201/09972: Partitioned, e.g. portions of a PCB dedicated to different functions; Boundary lines therefore; Portions of a PCB being processed separately or differently - H05K 2201/10166: Transistor - H05K 2201/10303: Pin-in-hole mounted pins - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H02M: APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF (transformers H01F; dynamo-electric converters H02K47/00; controlling transformers, reactors or choke coils, control or regulation of electric motors, generators or dynamo-electric converters H02P) ## Abstract A converter mounting board includes: an electronic component which is supplied an electric current; a high-frequency DC-DC converter that supplies a direct current corresponding to a fast change of the electric current of the electronic component; and a low-frequency DC-DC converter located far away from the electronic component than the high-frequency DC-DC converter and supplies a direct current corresponding to a slow change of the electric current of the electronic component. ## Claims ### Claim 1 A converter mounting board comprising: an electronic component which is supplied with an electric current; a high-frequency DC-DC converter that supplies a first direct current corresponding to a fast change of the electric current to the electronic component; and a low-frequency DC-DC converter located farther away from the electronic component than the high-frequency DC-DC converter and that supplies a second direct current corresponding to a slow change of the electric current slower than the first direct current corresponding to the fast change of the electric current to the electronic component, wherein the high-frequency DC-DC converter and the low-frequency DC-DC converter independently output the first direct current and the second direct current to the electronic component, respectively, the first direct current and the second direct current output from the high-frequency DC-DC converter and the low-frequency DC-DC converter, respectively, are synthesized to be supplied to the electronic component, and when a frequency of a load current of the electronic component is higher than a predetermined frequency, the first direct current from the high-frequency DC-DC converter is supplied to the electronic component. ### Claim 2 (depends on 1) The converter mounting board according to claim 1, further comprising: a component mounting substrate on which the electronic component is mounted. ### Claim 3 (depends on 2) The converter mounting board according to claim 2, wherein the high-frequency DC-DC converter is mounted on the component mounting substrate. ### Claim 4 (depends on 2) The converter mounting board according to claim 2, wherein the low-frequency DC-DC converter is mounted on the component mounting substrate. ### Claim 5 (depends on 1) The converter mounting board according to claim 1, further comprising: a converter mounting substrate on which the low-frequency DC-DC converter is mounted. ### Claim 6 (depends on 1) The converter mounting board according to claim 1, wherein the high-frequency DC-DC converter is smaller in size than the low-frequency DC-DC converter. ### Claim 7 (depends on 1) The converter mounting board according to claim 1, further comprising: a shield wiring line that shields a current wiring line that is disposed between the high-frequency DC-DC converter and the electronic component. ### Claim 8 A converter mounting board comprising: an electronic component which is supplied with an electric current; a component mounting substrate on which the electronic component is mounted; a high-frequency DC-DC converter mounted on the component mounting substrate and that supplies a first direct current corresponding to a fast change of the electric current to the electronic component; a converter mounting substrate disposed separately from the component mounting substrate; and a low-frequency DC-DC converter mounted on the converter mounting substrate and that supplies a second direct current corresponding to a slow change of the electric current slower than the first direct current corresponding to the fast change of the electric current to the electronic component, wherein the high-frequency DC-DC converter and the low-frequency DC-DC converter independently output the first direct current and the second direct current to the electronic component, respectively, the first direct current and the second direct current output from the high-frequency DC-DC converter and the low-frequency DC-DC converter, respectively, are synthesized to be supplied to the electronic component, and when a frequency of a load current of the electronic component is higher than a predetermined frequency, the first direct current from the high-frequency DC-DC converter is supplied to the electronic component. ### Claim 9 (depends on 8) The converter mounting board according to claim 8, further comprising: a pillar disposed between the component mounting substrate and the converter mounting substrate so that an electric current supplied from the low-frequency DC-DC converter flows through the pillar. ### Claim 10 (depends on 9) The converter mounting board according to claim 9, wherein the pillar has an exposed outer surface. ### Claim 11 (depends on 9) The converter mounting board according to claim 9, wherein the pillar is coupled to the component mounting substrate from a side opposite to a component mounting surface of the component mounting substrate on which the electronic component is mounted.