# US 10,375,818 B2 · Printed board

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- Number: US 10,375,818 B2
- Document ID: US10375818B2
- Status: Granted
- Kind: B2
- Application number: 15/737,876
- Filed: 2016-07-04
- Published: 2018-08-16
- Granted: 2019-08-06
- Earliest claimed: 2015-07-08
- Assignees: NEC Corporation
- Applicants: NEC Corporation
- Inventors: Kazuhiro Kashiwakura; Ayako Uemura
- Web page: https://patentgrep.com/patent/US10375818B2

## CPC

- H05K 1/0216: {Reduction of cross-talk, noise or electromagnetic interference (grounding H05K1/0215)}
- H05K 1/0218: {by printed shielding conductors, ground planes or power plane (H05K1/0236 takes precedence)}
- H05K 1/0243: {Printed circuits associated with mounted high frequency components}
- H05K 1/11: Printed elements for providing electric connections to or between printed circuits
- H05K 3/46: Manufacturing multilayer circuits
- H05K 9/0064: {Earth or grounding circuit}
- H05K 2201/09309: Core having two or more power planes; Capacitive laminate of two power planes
- H05K 2201/09327: Special sequence of power, ground and signal layers in multilayer PCB
- H05K 2201/09609: Via grid, i.e. two-dimensional array of vias or holes in a single plane
- H05K 2201/10: Details of components or other objects attached to or integrated in a printed circuit board
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS

## Abstract

An objective of the present invention is to provide a printed board being capable of suppressing EMI emissions from power supply wirings. To accomplish the objective, a printed board of the present invention includes a plurality of ground layers disposed in a printed board, a power supply layer put between the plurality of the ground layers, and through holes disposed along at least periphery of the printed board and connecting the plurality of the ground layers, wherein the through holes are disposed at intervals according to a wavelength corresponding to a maximum frequency of electromagnetic waves to be suppressed. Further, a printed board of the present invention includes a power supply layer disposed in a printed board and put between ground layers above and below the power supply layers, and a plurality of through holes connecting the ground layers above and below the power supply layers, wherein the plurality of the through holes are disposed at and near the power supply layer and are spaced apart at intervals according to a wavelength corresponding to a maximum frequency of electromagnetic waves to be suppressed.

## Claims

### Claim 1

A printed board, comprising:
a plurality of ground layers disposed in a printed board;
a power supply layer put between the plurality of the ground layers; and
through holes disposed along at least periphery of the printed board and connecting the plurality of the ground layers,
wherein the through holes are disposed at intervals according to a wavelength corresponding to a maximum frequency of electromagnetic waves to be suppressed.

### Claim 2 (depends on 1)

The printed board according to claim 1,
wherein each of the intervals is equal to or below a quarter of the wavelength corresponding to the maximum frequency of the electromagnetic waves to be suppressed.

### Claim 3 (depends on 1)

The printed board according to claim 1,
wherein the through holes are disposed in at least double rows.

### Claim 4 (depends on 1)

The printed board according to claim 1,
wherein the plurality of the ground layers are layers of plane grounds.

### Claim 5 (depends on 1)

The printed board according to claim 1, comprising:
a plurality of the power supply layers,
wherein when at least one of the plurality of the power supply layers is formed on a separate layer from the others of the plurality of the power supply layers, the one of the plurality of the power supply layer formed on the separate layer is also put between the ground layers above and below the one of the plurality of the power supply layers.

### Claim 6 (depends on 1)

The printed board according to claim 1,
wherein the through holes are arranged parallel or with an inclination to periphery of the printed board or the power supply layer.

### Claim 7

A printed board, comprising:
a power supply layer disposed in a printed board and put between ground layers above and below the power supply layer; and
a plurality of through holes connecting the ground layers above and below the power supply layer,
wherein the plurality of the through holes are disposed at and near the power supply layer and are spaced apart at intervals according to a wavelength corresponding to a maximum frequency of electromagnetic waves to be suppressed.

### Claim 8 (depends on 7)

The printed board according to claim 7, comprising:
through holes disposed along the periphery of the printed board and connecting a plurality of the ground layers,
wherein the through holes are disposed at intervals according to a wavelength corresponding to a maximum frequency of electromagnetic waves to be suppressed.

### Claim 9 (depends on 7)

The printed board according to claim 7,
wherein one of the ground layers above and below the power supply layer is formed in a range to be overlapped with the power supply layer and in a range where the through holes are formed on both sides of the power supply layer.