# US 10,375,816 B2 · Printed-circuit board, printed-wiring board, and electronic apparatus

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- Number: US 10,375,816 B2
- Document ID: US10375816B2
- Status: Granted
- Kind: B2
- Application number: 15/558,940
- Filed: 2016-04-26
- Published: 2018-03-15
- Granted: 2019-08-06
- Earliest claimed: 2015-05-08
- Assignees: Canon Kabushiki Kaisha
- Applicants: Canon Kabushiki Kaisha
- Inventors: Keita Yamazaki
- Web page: https://patentgrep.com/patent/US10375816B2

## CPC

- H05K 1/0209: {External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings}
- H05K 1/0203: {Cooling of mounted components (H05K1/0272 takes precedence)}
- H05K 1/0206: {by printed thermal vias}
- H05K 1/111: {Pads for surface mounting, e.g. lay-out}
- H05K 1/115: {Via connections; Lands around holes or via connections (H05K1/112 takes precedence)}
- H05K 1/181: associated with surface mounted components
- H05K 2201/09372: Pads and lands
- H05K 2201/09381: Shape of non-curved single flat metallic pad, land or exposed part thereof; Shape of electrode of leadless component
- H05K 2201/094: Array of pads or lands differing from one another, e.g. in size, pitch or thickness; Using different connections on the pads
- H05K 2201/10553: Component over metal, i.e. metal plate in between bottom of component and surface of PCB
- H05K 2201/10727: Leadless chip carrier [LCC], e.g. chip-modules for cards
- H05K 2201/10969: Metallic case or integral heatsink of component electrically connected to a pad on PCB
- Y02P 70/50: Manufacturing or production processes characterised by the final manufactured product
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- Y02P: CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS

## Abstract

A printed-wiring board has a land group with which a terminal group of a semiconductor package has been joined, a first conductor pattern arranged in a mounting area where the semiconductor package is mounted and joined with a heat radiation plate of the semiconductor package, a second conductor pattern, at least a part of which is arranged on the outside of the mounting area, and a third conductor pattern which connects the first and second conductor patterns. The land group includes a first land adjacent to the third conductor pattern and a second land which is not adjacent to the third conductor pattern, and the first land is formed in a shape different from that of the second land so as to be away from the third conductor pattern.

## Claims

### Claim 1

A printed-circuit board comprising:
an electronic component having a heat radiation part; and
a printed-wiring board on which the electronic component is mounted,
wherein the printed-wiring board includes:
a land group with which a terminal group of the electronic component is joined;
a first conductor pattern arranged in a mounting area where the electronic component is mounted and joined with the heat radiation part of the electronic component;
a second conductor pattern, at least a part of which is arranged on an outside of the mounting area; and
a third conductor pattern which connects the first conductor pattern to the second conductor pattern are formed on the printed-wiring board,
wherein the land group includes a first land adjacent to the third conductor pattern and a second land which is not adjacent to the third conductor pattern, and
wherein the first land is formed in a shape different from that of the second land so as to be spaced from the third conductor pattern.

### Claim 2 (depends on 1)

A printed-circuit board according to claim 1, wherein the first land has one side which faces one side of the third conductor pattern so as to be spaced therefrom.

### Claim 3 (depends on 2)

A printed-circuit board according to claim 2, wherein the one side of the first land and the one side of the third conductor pattern which face each other are parallel.

### Claim 4 (depends on 1)

A printed-circuit board according to claim 1, wherein:
the land group forms four partial land groups arranged along four sides of the mounting area,
the third conductor pattern is formed so as to pass through a gap between the two adjacent partial land groups among the four partial land groups, and
the first land is a land which is included in at least one of the two partial land groups and is located in an end portion on the side adjacent to the third conductor pattern.

### Claim 5 (depends on 4)

A printed-circuit board according to claim 4, wherein an edge on the side of the first conductor pattern of the first land is further from the first conductor pattern than the edge on the side of the first conductor pattern of the second land included in the partial land group in which the first land is included.

### Claim 6 (depends on 1)

A printed-circuit board according to claim 1, wherein the land group includes a third land connected to the third conductor pattern.

### Claim 7 (depends on 6)

A printed-circuit board according to claim 6, wherein:
the land group forms four partial land groups arranged along four sides of the mounting area, and
the third land is a land located in an intermediate portion between the lands located in both end portions in at least one of the four partial land groups.

### Claim 8 (depends on 1)

A printed-circuit board according to claim 1, wherein the printed-wiring board further comprises:
a fourth conductor pattern arranged in a layer different from a layer in which the third conductor pattern is arranged, and
a via conductor which connects the first conductor pattern and the fourth conductor pattern are formed on the printed-wiring board.

### Claim 9 (depends on 1)

A printed-circuit board according to claim 1, wherein the printed-wiring board further comprises:
a fourth conductor pattern arranged in a layer different from a layer in which the third conductor pattern is arranged, and
a via conductor which is arranged at a position other than a position corresponding to the heat radiation part of the electronic component and which connects the third conductor pattern and the fourth conductor pattern.

### Claim 10

A printed-wiring board on which an electronic component having a heat radiation part can be mounted, comprising:
a land group with which a terminal group of the electronic component is joined;
a first conductor pattern which is arranged in a mounting area where the electronic component is mounted and which is joined with the heat radiation part of the electronic component;
a second conductor pattern, at least a part of which is arranged on an outside of the mounting area; and
a third conductor pattern which connects the first conductor pattern and the second conductor pattern,
wherein the land group includes a first land adjacent to the third conductor pattern and a second land which is not adjacent to the third conductor pattern, and
the first land is formed in a shape different from that of the second land so as to be spaced from the third conductor pattern.

### Claim 11 (depends on 10)

A printed-wiring board according to claim 10, wherein the first land has one side which faces one side of the third conductor pattern so as to be spaced therefrom.

### Claim 12 (depends on 11)

A printed-wiring board according to claim 11, wherein the one side of the first land and the one side of the third conductor pattern which face each other are parallel.

### Claim 13 (depends on 10)

A printed-wiring board according to claim 10, wherein:
the land group forms four partial land groups arranged along four sides of the mounting area,
the third conductor pattern is formed so as to pass through a gap between the two adjacent partial land groups among the four partial land groups, and
the first land is a land which is included in at least one of the two partial land groups and is located in an end portion on the side adjacent to the third conductor pattern.

### Claim 14 (depends on 13)

A printed-wiring board according to claim 13, wherein an edge on the side of the first conductor pattern of the first land is further from the first conductor pattern than the edge on the side of the first conductor pattern of the second land included in the partial land group in which the first land is included.

### Claim 15 (depends on 10)

A printed-wiring board according to claim 10, wherein the land group includes a third land connected to the third conductor pattern.

### Claim 16 (depends on 15)

A printed-wiring board according to claim 15, wherein:
the land group forms four partial land groups arranged along four sides of the mounting area, and
the third land is a land located in an intermediate portion between the lands located in both end portions in at least one of the four partial land groups.

### Claim 17 (depends on 10)

A printed-wiring board according to claim 10, further comprising:
a fourth conductor pattern arranged in a layer different from a layer in which the third conductor pattern is arranged; and
a via conductor which connects the first conductor pattern and the fourth conductor pattern.

### Claim 18 (depends on 10)

A printed-wiring board according to claim 10, further comprising:
a fourth conductor pattern arranged in a layer different from a layer in which the third conductor pattern is arranged; and
a via conductor which is arranged at a position other than a position corresponding to the heat radiation part of the electronic component and which connects the third conductor pattern and the fourth conductor pattern.

### Claim 19 (depends on 18)

A printed-wiring board according to claim 18, further comprising a via conductor which connects the first conductor pattern and the fourth conductor pattern.

### Claim 20

An electronic device comprising:
a printed-circuit board; and
an operating unit connected to the printed-circuit board,
wherein the printed-circuit board comprises:
an electronic component having a heat radiation part; and
a printed-wiring board on which the electronic component is mounted,
wherein the printed-wiring board comprises:
a land group with which a terminal group of the electronic component is joined;
a first conductor pattern arranged in a mounting area where the electronic component is mounted and joined with the heat radiation part of the electronic component;
a second conductor pattern, at least a part of which is arranged on an outside of the mounting area; and
a third conductor pattern which connects the first conductor pattern to the second conductor pattern,
wherein the land group includes a first land adjacent to the third conductor pattern and a second land which is not adjacent to the third conductor pattern, and
the first land is formed in a shape different from that of the second land so as to be spaced from the third conductor pattern.