# US 10,374,575 B2 · Oscillation module, electronic apparatus, and vehicle > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,374,575 B2 - Document ID: US10374575B2 - Status: Granted - Kind: B2 - Application number: 15/412,629 - Filed: 2017-01-23 - Published: 2017-08-03 - Granted: 2019-08-06 - Earliest claimed: 2016-02-02 - Assignees: Seiko Epson Corporation - Applicants: Seiko Epson Corporation - Inventors: Masataka Nomura; Shigeki Sasayama; Akira Nakada - Web page: https://patentgrep.com/patent/US10374575B2 ## CPC - H03H 9/64: using surface acoustic waves - H01F 17/0006: {Printed inductances (printed coils for dynamo-electric machines H02K3/26; printed circuits H05K)} - H03B 5/326: {the resonator being an acoustic wave device, e.g. SAW or BAW device} - H03B 5/364: {the amplifier comprising field effect transistors (H03B5/366 takes precedence)} - H03H 9/1064: {for surface acoustic wave [SAW] devices} - H03J 3/04: Arrangements for compensating for variations of physical values, e.g. temperature - H03J 3/185: {with varactors, i.e. voltage variable reactive diodes} - H03J 3/20: of single resonant circuit by varying inductance only or capacitance only - H10D 64/011: {of electrodes ohmically coupled to a semiconductor} - H10D 89/60: Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD] - H01F 2017/0026: {Multilayer LC-filter} - H03H 7/06: including resistors (H03H7/075, H03H7/09, H03H7/12, H03H7/13 take precedence) - H03H 2001/0085: {Multilayer, e.g. LTCC, HTCC, green sheets} - H03H: IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS (waveguides, resonators, lines or other devices of the waveguide type H01P) - H01F: MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES - H03B: GENERATION OF OSCILLATIONS, DIRECTLY OR BY FREQUENCY-CHANGING, BY CIRCUITS EMPLOYING ACTIVE ELEMENTS WHICH OPERATE IN A NON-SWITCHING MANNER; GENERATION OF NOISE BY SUCH CIRCUITS (generators adapted for electrophonic musical instruments G10H; masers or lasers H01S; generation of oscillations in plasma H05H) - H03J: TUNING RESONANT CIRCUITS; SELECTING RESONANT CIRCUITS - H10D: INORGANIC ELECTRIC SEMICONDUCTOR DEVICES ## Abstract An oscillation module includes an SAW filter, and a high-pass filter formed in an integrated circuit, the high-pass filter has a coil part, a capacitance part, and a first interconnection adapted to connect the coil part and the capacitance part to each other, and the capacitance part includes a capacitance array. ## Claims ### Claim 1 An oscillation module comprising: an SAW filter; and a high-pass filter formed in an integrated circuit, wherein the high-pass filter has a coil part, a capacitance part, and a first interconnection adapted to connect the coil part and the capacitance part to each other, and the capacitance part includes a capacitance array, wherein the coil part is disposed in a second wiring layer thicker than a first wiring layer in which the first interconnection is disposed. ### Claim 2 (depends on 1) The oscillation module according to claim 1, wherein the second wiring layer is stacked above the first wiring layer. ### Claim 3 (depends on 1) The oscillation module according to claim 1, wherein the capacitance array includes a first capacitance, and at least one electrode of the first capacitance is disposed in a first wiring layer in which the first interconnection is disposed. ### Claim 4 (depends on 2) The oscillation module according to claim 2, wherein the capacitance array includes a first capacitance, and at least one electrode of the first capacitance is disposed in a first wiring layer in which the first interconnection is disposed. ### Claim 5 (depends on 3) The oscillation module according to claim 3, wherein the other electrode of the first capacitance is disposed so as to straddle a second wiring layer and a third wiring layer, and the second wiring layer and the third wiring layer are configured so as to sandwich the first wiring layer in which the one electrode is disposed. ### Claim 6 (depends on 4) The oscillation module according to claim 4, wherein the other electrode of the first capacitance is disposed so as to straddle a second wiring layer and a third wiring layer, and the second wiring layer and the third wiring layer are configured so as to sandwich the first wiring layer in which the one electrode is disposed. ### Claim 7 (depends on 5) The oscillation module according to claim 5, further comprising: a first terminal connected to the coil part; and a second terminal connected to an outside of the high-pass filter, wherein the first interconnection electrically connects the one electrode and the first terminal to each other, and a second interconnection disposed in the second wiring layer and a third interconnection disposed in the third wiring layer electrically connect the other electrode and the second terminal to each other. ### Claim 8 (depends on 3) The oscillation module according to claim 3, wherein the capacitance array further includes a second capacitance, and one electrode of the second capacitance is connected to the one electrode of the first capacitance with the first interconnection. ### Claim 9 (depends on 8) The oscillation module according to claim 8, wherein a capacitance value of the first capacitance and a capacitance value of the second capacitance are roughly equal to each other. ### Claim 10 (depends on 8) The oscillation module according to claim 8, wherein a capacitance value of the second capacitance is higher than a capacitance value of the first capacitance. ### Claim 11 (depends on 8) The oscillation module according to claim 8, wherein a wiring length of the first interconnection from the first terminal to the first capacitance is shorter than a wiring length of the first interconnection from the first terminal to the second capacitance. ### Claim 12 (depends on 8) The oscillation module according to claim 8, wherein the capacitance array further includes a third capacitance, and one electrode of the third capacitance is connected to the one electrode of the first capacitance and the one electrode of the second capacitance with the first interconnection. ### Claim 13 An oscillation module comprising: an SAW filter; and a high-pass filter formed in an integrated circuit, wherein the high-pass filter includes a coil part and a capacitance part including a capacitance array, the capacitance array includes a first terminal connected to the coil part, a first capacitance, and a second capacitance, a capacitance value of the first capacitance is lower than a capacitance value of the second capacitance, and a wiring length in a case in which the first capacitance and the first terminal are connected to each other is shorter than a wiring length in a case in which the second capacitance and the first terminal are connected to each other. ### Claim 14 An oscillation module comprising: an SAW filter; and a high-pass filter formed in an integrated circuit, wherein the high-pass filter includes a coil part and a capacitance part including a capacitance array, the capacitance array includes a first terminal connected to the coil part, a first array of n capacitances connected to each other, and a second array of m capacitances connected to each other, a total capacitance value of the first array is lower than a total capacitance value of the second array, and a wiring length in a case in which one of the capacitances belonging to the first array and the first terminal are connected to each other is shorter than a wiring length in a case in which one of the capacitances belonging to the second array and the first terminal are connected to each other. ### Claim 15 (depends on 14) The oscillation module according to claim 14, wherein n=2 and m=1. ### Claim 16 (depends on 1) An electronic apparatus comprising: the oscillation module according to claim 1. ### Claim 17 (depends on 1) A vehicle comprising: the oscillation module according to claim 1.