# US 10,374,571 B2 · Balun structure

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- Number: US 10,374,571 B2
- Document ID: US10374571B2
- Status: Granted
- Kind: B2
- Application number: 15/792,291
- Filed: 2017-10-24
- Published: 2018-05-03
- Granted: 2019-08-06
- Earliest claimed: 2016-11-01
- Assignees: Semiconductor Manufacturing International (Shanghai) Corporation; Semiconductor Manufacturing International (Beijing) Corporation
- Applicants: Semiconductor Manufacturing International (Shanghai) Corporation; Semiconductor Manufacturing International (Beijing) Corporation
- Inventors: Xi Ning Wang; Jen Hao Cheng; Zhi Jiang Zhou; Jin Feng Gao
- Web page: https://patentgrep.com/patent/US10374571B2

## CPC

- H03H 7/42: Networks for transforming balanced signals into unbalanced signals and vice versa, e.g. baluns
- H01F 17/0013: {with stacked layers}
- H01F 21/12: discontinuously variable, e.g. tapped
- H01F 27/2804: {Printed windings}
- H10W 20/497: {Inductive arrangements or effects of, or between, wiring layers}
- H01F 2017/0073: {with a special conductive pattern, e.g. flat spiral}
- H03H: IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS (waveguides, resonators, lines or other devices of the waveguide type H01P)
- H01F: MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A balun structure is provided. The balun structure includes a substrate, a first coil structure and a second coil structure having a spiral shape and on the substrate. The first coil structure includes a first single-layer coil surrounding by first laminated coils that are connected to the first single-layer coil. The second coil structure can include a second single-layer coil and second laminated coils that are connected to the second single-layer coil. A projection of the first single-layer coil and a projection of the second single-layer coil on a surface of the substrate overlap with each other. A number of the second laminated coils is larger than or equal to a number of the first laminated coils. The second laminated coils are arranged alternately with the first laminated coils or the first single-layer coil in a plane parallel to the surface of the substrate.

## Claims

### Claim 1

A balun structure, comprising:
a substrate;
a first coil structure having a spiral shape and on the substrate, the first coil structure including:
a first single-layer coil, and
at least one first laminated coil connected to the first single-layer coil,
wherein the first single-layer coil is surrounded by the at least one first laminated coil; and
a second coil structure having a spiral shape and on the substrate, the second coil structure including:
a second single-layer coil, a projection of the second single-layer coil on a surface of the substrate overlaps a projection of the first single-layer coil on the surface of the substrate, and
at least one second laminated coil connected to the second single-layer coil,
wherein a number of the at least one second laminated coil is larger than or equal to a number of the at least one first laminated coil, and the at least one second laminated coil is arranged alternately with the at least one first laminated coil or the first single-layer coil in a plane parallel to the surface of the substrate.

### Claim 2 (depends on 1)

The balun structure of claim 1, wherein:
the second single-layer coil is on the substrate;
the first single-layer coil is on a dielectric layer; and
the first laminated coil includes:
a plurality of first upper-layer metal wires positioned on the dielectric layer,
a plurality of first lower-layer metal wires on the substrate, each first lower-layer metal wire being located corresponding to one first upper-layer metal wire, and
a plurality of first conductive plugs located between the first upper-layer metal wires and the first lower-layer metal wires.

### Claim 3 (depends on 2)

The balun structure of claim 2, wherein:
the first coil structure further includes:
a first connecting line on the dielectric layer for connecting the first single-layer coil and one adjacent first upper-layer metal wire,
a second connecting line on the substrate and connecting the first single-layer coil and one adjacent first lower-layer metal wire, and
a first connecting plug located at one end of the second connecting line for connecting the second connecting line and the first single-layer coil; and
the at least one second laminated coil includes an outer second laminated coil surrounding the second single-layer coil, the outer second laminated coil including:
a plurality of outer second upper-layer metal wires on the dielectric layer,
a plurality of outer second lower-layer metal wires on the substrate, each outer second lower-layer metal wire being located corresponding to one outer second upper-layer metal wire, and
a plurality of second conductive plugs between the outer second upper-layer metal wires and the outer second lower-layer metal wires; and
the second coil structure further includes:
a third connecting line on the substrate for connecting the second single-layer coil and one adjacent outer second lower-layer metal wire,
a fourth connecting line on the dielectric layer for connecting the second single-layer coil and one adjacent outer second upper-layer metal wire, and
a second connecting plug located at one end of the fourth connecting line for connecting the fourth connecting line and the second single-layer coil.

### Claim 4 (depends on 3)

The balun structure of claim 3, wherein:
a linewidth of the first upper-layer metal wire is longer than a linewidth of the first lower-layer metal wire, and a linewidth of the outer second upper-layer metal wire is shorter than a linewidth of the outer second lower-layer metal wire; or
the linewidth of the first upper-layer metal wire is shorter than the linewidth of the first lower-layer metal wire, and the linewidth of the outer second upper-layer metal wire is longer than the linewidth of the outer second lower-layer metal wire.

### Claim 5 (depends on 3)

The balun structure of claim 3, wherein:
the at least one second laminated coil further includes an inner second laminated coil surrounded by the second single-layer coil;
the inner second laminated coil includes:
a plurality of inner second upper-layer metal wires on the dielectric layer,
a plurality of inner second lower-layer metal wires on the substrate, each inner second lower metal wire is located corresponding to one inner second upper-layer metal wire, and
a plurality of third conductive plugs between the inner second upper-layer metal wires and the inner second lower-layer metal wires and the inner second upper metal wire; and
the second coil structure further includes:
a fifth connecting line on said substrate for connecting the second single-layer coil and one adjacent inner second lower-layer metal wire,
a sixth connecting line on the dielectric layer for connecting the second single-layer coil and one adjacent inner second upper-layer metal wire, and
a third connecting plug located at one end of the sixth connecting line for connecting the sixth connecting line and the second single-layer coil.

### Claim 6 (depends on 5)

The balun structure of claim 5, wherein:
a linewidth of the first upper-layer metal wire is longer than a linewidth of the first lower-layer metal wire, a linewidth of the outer second upper-layer metal wire is shorter than a linewidth of the outer second lower-lay metal wire, and a linewidth of the inner second upper-layer metal wire is shorter than a linewidth of the inner second lower-layer metal wire; or
the linewidth of the first upper-layer metal wire is shorter than the linewidth of the first lower-layer metal wire, the linewidth of the outer second upper-layer metal wire is longer than the linewidth of the outer second lower-lay metal wire, and the linewidth of the inner second upper-layer metal wire is longer than the linewidth of the inner second lower-layer metal wire.

### Claim 7 (depends on 1)

The balun structure of claim 1, wherein:
a number of the at least one first laminated coil is less than or equal to four.

### Claim 8 (depends on 1)

The balun structure of claim 1, wherein:
a number of the at least one second laminated coil is less than or equal to four.

### Claim 9 (depends on 1)

The balun structure of claim 1, wherein:
a linewidth of the first single-layer coil is in a range from about 1 μm to about 100 μm; and
a linewidth of the second single-layer coil is in a range from about 1 μm to about 100 μm.

### Claim 10 (depends on 4)

The balun structure of claim 4, wherein:
a linewidth of the first upper-layer metal wire s in a range from about 1 μm to about 100 μm; and
a linewidth of the first lower-layer metal wire is in a range from about 1 μm to about 100 μm.

### Claim 11 (depends on 4)

The balun structure of claim 4, wherein:
a linewidth of the outer second upper-layer metal wire s in a range from about 1 μm to about 100 μm; and
a linewidth of the outer second lower-layer metal wire is in a range from about 1 μm to about 100 μm.

### Claim 12 (depends on 4)

The balun structure of claim 4, wherein:
a linewidth of the inner second upper-layer metal wire is in a range from about 1 μm to about 100 μm; and
a linewidth of the inner second lower-layer metal wire is in a range from about 1 μm to about 100 μm.

### Claim 13 (depends on 3)

The balun structure of claim 3, wherein:
a distance between the first upper-layer metal wire and the second upper-layer metal wire is shorter than a distance between the first lower-layer metal wire and the second lower-layer metal wire.

### Claim 14 (depends on 13)

The balun structure of claim 13, wherein:
the distance between the first upper-layer metal wire and the second upper-layer metal wire is in a range from about 1 μm to about 100 μm.

### Claim 15 (depends on 13)

The balun structure of claim 13, wherein:
the distance between the first lower-layer metal wire and the second lower-layer metal wire is in a range from about 1 μm to about 100 μm.

### Claim 16 (depends on 3)

The balun structure of claim 3, wherein:
a material of the first single-layer coil, the first upper-layer metal wire, the first connecting line, the outer second upper-layer metal wire, and the fourth connecting line is copper.

### Claim 17 (depends on 3)

The balun structure of claim 3, wherein:
a material of the second single-layer coil, the first lower-layer metal wire, the second connecting line, the outer second lower-layer metal wire, and the third connecting line is aluminum.

### Claim 18 (depends on 5)

The balun structure of claim 5, wherein:
a material of the first single-layer coil, the first upper-layer metal wire, the first connecting line, the outer second upper-layer metal wire, the fourth connecting line, the inner second upper-layer metal wire, and the sixth connecting line is copper.

### Claim 19 (depends on 5)

The balun structure of claim 5, wherein:
a material of the second single-layer coil, the first lower-layer metal wire, the second connecting line, the outer second lower-layer metal wire, the third connecting line, the inner second lower-layer metal wire, and the fifth connecting line is aluminum.

### Claim 20 (depends on 1)

The balun structure of claim 1, wherein:
the first coil structure is a differential coil, and the second coil structure is a spiral coil; or
the first coil structure is a spiral coil, and the second coil structure is a differential coil.