# US 10,374,490 B2 · Electronic device and drive device including the same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,374,490 B2 - Document ID: US10374490B2 - Status: Granted - Kind: B2 - Application number: 14/811,601 - Filed: 2015-07-28 - Published: 2016-02-04 - Granted: 2019-08-06 - Earliest claimed: 2014-07-31 - Assignees: Denso Corporation - Applicants: Denso Corporation - Inventors: Toshihisa Yamamoto; Hideki Kabune; Yuuta Kadoike - Web page: https://patentgrep.com/patent/US10374490B2 ## CPC - H05K 7/205: {Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB] (details of PCBs relating to heat transfer H05K1/0201)} - H02K 9/223: {Heat bridges} - H02K 9/227: {Heat sinks} - H02K 11/33: Drive circuits, e.g. power electronics (H02K11/38 takes precedence) - H05K 7/20454: {with a conformable or flexible structure compensating for irregularities, e.g. cushion bags, thermal paste} - H05K 7/20463: {Filling compound, e.g. potted resin} - H05K 7/209: {Heat transfer by conduction from internal heat source to heat radiating structure (H05K7/20909 takes precedence)} - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H02K: DYNAMO-ELECTRIC MACHINES (dynamo-electric relays H01H53/00; conversion of DC or AC input power into surge output power {H03K3/53}) ## Abstract An electronic device includes a heat sink, where heat dissipating gel is interposed between the heat sink and a side of an electronic component, which is mounted on a substrate, opposite from the substrate. The electronic component includes an electrical conductor electrically connected to a chip, and an insulator portion that molds the chip with the electrical conductor. The heat sink includes a non-abutting surface that faces the electrical conductor of the electronic component, the heat dissipating gel interposed between the non-abutting surface and the electrical conductor, and an abutting surface that is positioned closer toward the substrate than the non-abutting surface is and abuttable with the insulator portion. Accordingly, when the abutting surface of the heat sink abuts the insulator portion of the electronic component, the non-abutting surface of the heat sink is prevented from abutting the electrical conductor of the electronic component. ## Claims ### Claim 1 An electronic device, comprising: a substrate; an electronic component which is mounted on the substrate and includes a chip, an electrical conductor electrically connected to the chip, and an insulator portion that molds the chip with the electrical conductor; an insulating and heat dissipating material disposed on a side of the electronic component opposite from the substrate; and a heat sink that includes a first surface, a second surface and a support portion, the support portion being formed away from the first surface and the second surface, and a distal end portion of the support portion being fixed to the substrate to space the electronic component away from the first surface and the second surface, wherein the heat sink is configured to absorb heat which is generated from the electronic component, the first surface faces the electrical conductor, which is exposed at the side of the electronic component opposite from the substrate, such that the insulating and heat dissipating material is interposed between the first surface and the electrical conductor, the second surface is positioned closer toward the substrate than the first surface, the second surface is positioned directly below the insulator portion to face the insulator portion and is spaced away from the insulator portion by a particular spacing, and no portion of the second surface is positioned immediately below the electronic conductor. ### Claim 2 (depends on 1) The electronic device of claim 1, wherein warpage of the substrate toward the heat sink closes the particular spacing between the second surface and the insulator portion of the electronic component, in a thickness direction of the substrate, and the insulating and heat dissipating material fills an insulating space formed between the first surface and the electrical conductor. ### Claim 3 (depends on 1) The electronic device of claim 1, wherein the second surface is provided at a location which faces the insulator portion and which does not face the electrical conductor. ### Claim 4 (depends on 1) The electronic device of claim 1, wherein warpage of the substrate toward the heat sink closes the particular spacing between the second surface and the insulator portion of the electronic component, in a direction parallel with the substrate, and the insulating and heat dissipating material fills an insulating space formed between the second surface and the electrical conductor. ### Claim 5 (depends on 1) The electronic device of claim 1, wherein the heat sink integrally includes a heat sink body and a protruding portion, the protruding portion protruding from the heat sink body and toward the substrate, the second surface is a surface of the protruding portion that faces the insulator portion, and the first surface is a surface of a region of the heat sink body that faces the electrical conductor. ### Claim 6 (depends on 5) The electronic device of claim 5, wherein the heat sink integrally includes the support portion, the heat sink body, and the protruding portion, the support portion protruding from the heat sink body and toward the substrate and supporting the substrate. ### Claim 7 (depends on 5) The electronic device of claim 5, wherein the heat sink includes a plurality of the protruding portion for one of the electronic component, and is configured to suppress tilting of the electronic component. ### Claim 8 (depends on 5) The electronic device of claim 5, wherein the heat sink includes the protruding portion having a shape that is configured to provide continuously abutting with the insulator portion of the electronic component, and that is configured to suppress tilting of the electronic component. ### Claim 9 (depends on 5) The electronic device of claim 5, wherein the heat sink includes the protruding portion having a shape that allows continuously abutting with a plurality of insulator portions of a plurality of electronic components. ### Claim 10 (depends on 1) The electronic device of claim 1, wherein the heat sink includes a heat sink body and a recessed portion that is indented from the heat sink body and away from the substrate, the second surface is a surface of a region of the heat sink body that faces the insulator portion, and the first surface is an inner surface of the recessed portion. ### Claim 11 (depends on 1) A drive device, comprising: a motor unit, for an electric power steering device, that outputs steering assist torque; a controller that drives the motor unit; and the electronic device of claim 1, the electronic device being used in the controller. ### Claim 12 (depends on 1) The electronic device of claim 1, wherein the insulating and heat dissipating material is further interposed between the insulator portion and the second surface. ### Claim 13 (depends on 12) The electronic device of claim 12, wherein the second surface is configured to be abuttable with the insulator portion. ### Claim 14 (depends on 1) The electronic device of claim 1, wherein the insulating and heat dissipating material comprises a heat dissipating gel. ### Claim 15 An electronic device, comprising: a substrate; an electronic component which is mounted on the substrate and includes a chip, an electrical conductor electrically connected to the chip, and an insulator portion that molds the chip with the electrical conductor; an insulating and heat dissipating material disposed on a side of the electronic component opposite from the substrate; and a heat sink that includes a first surface, a second surface and a support portion, the support portion being formed away from the first surface and the second surface, and a distal end portion of the support portion being fixed to the substrate to space the electronic component away from the first surface and the second surface, wherein the heat sink is configured to absorb heat which is generated from the electronic component, the first surface faces the electrical conductor, which is exposed at the side of the electronic component opposite from the substrate, such that the insulating and heat dissipating material is interposed between the first surface and the electrical conductor, the second surface is positioned closer toward the substrate than the first surface is, the second surface is positioned directly below the insulator portion to face the insulator portion and is spaced away from the insulator portion by a particular spacing, the heat dissipating material is further interposed between the insulator portion and the second surface, and the second surface is configured to be abuttable with the insulator portion. ### Claim 16 (depends on 15) The electronic device of claim 15, wherein the second surface is configured to prevent contact between the heat sink and the electrical conductor. ### Claim 17 An electronic device, comprising: a substrate; an electronic component which is mounted on the substrate and includes a chip, an electrical conductor electrically connected to the chip, and an insulator portion that molds the chip with the electrical conductor; an insulating and heat dissipating material disposed on a side of the electronic component opposite from the substrate; and a heat sink that includes a first surface, a second surface and a support portion, the support portion being formed away from the first surface and the second surface, and a distal end portion of the support portion being fixed to the substrate to space the electronic component away from the first surface and the second surface, wherein the heat sink is configured to absorb heat which is generated from the electronic component, the first surface faces the electrical conductor, which is exposed at the side of the electronic component opposite from the substrate, such that the insulating and heat dissipating material is interposed between the first surface and the electrical conductor, the second surface is positioned closer toward the substrate than the first surface is, the second surface is positioned to overlap with the insulator portion when viewed along a direction orthogonal to the second surface so as to face the insulator portion and is spaced away from the insulator portion by a particular spacing, and no portion of the second surface overlaps with the electronic conductor when viewed along the direction orthogonal to the second surface.