# US 10,374,387 B2 · High power cavity package for light emitters > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,374,387 B2 - Document ID: US10374387B2 - Status: Granted - Kind: B2 - Application number: 15/809,733 - Filed: 2017-11-10 - Published: 2019-05-16 - Granted: 2019-08-06 - Earliest claimed: 2017-11-10 - Assignees: Finisar Corporation - Applicants: Finisar Corporation - Inventors: Brent Stapleton; Pritha Khurana; Nathan Lye - Web page: https://patentgrep.com/patent/US10374387B2 ## CPC - H01S 5/02257: using windows, e.g. specially adapted for back-reflecting light to a detector inside the housing - G03B 21/2033: {LED or laser light sources} - H01S 5/02208: characterised by the shape of the housings - H01S 5/02469: {Passive cooling, e.g. where heat is removed by the housing as a whole or by a heat pipe without any active cooling element like a TEC} - H01S 5/18308: {having a special structure for lateral current or light confinement} - H01S 5/18361: {Structure of the reflectors, e.g. hybrid mirrors} - H01S 5/423: {having a vertical cavity} - H01S 5/02234: Resin-filled housings; the housings being made of resin - H01S 5/02345: Wire-bonding - H01S 5/0236: using an adhesive - H01S 5/026: Monolithically integrated components, e.g. waveguides, monitoring photo-detectors, drivers (stabilisation of output H01S5/06) - H10W 70/682: {comprising holes having chips therein} - H10W 72/07352: {changes in structures or sizes} - H10W 72/07554: {changes in dispositions} - H10W 72/321: {Structures or relative sizes of die-attach connectors} - H10W 72/325: {Die-attach connectors having a filler embedded in a matrix} - H10W 72/352: {comprising metals or metalloids, e.g. solders} - H10W 72/354: {comprising polymers} - H10W 72/5445: {being orthogonal to a side surface of the chip, e.g. parallel arrangements} - H10W 72/5449: {not being orthogonal to a side surface of the chip, e.g. fan-out arrangements} - H10W 72/551: {Materials of bond wires} - H10W 76/12: characterised by their shape - H10W 90/00: Package configurations - H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W 90/754: {between a chip and a stacked insulating package substrate, interposer or RDL} - H01S: DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL - G03B: APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR (optical parts of such apparatus G02B; photosensitive materials or processes for photographic purposes G03C; apparatus for processing exposed photographic materials G03D) - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract An emitter package can include: a body having a bottom member, side members extending from the bottom member, and a top surface, wherein the body defines a cavity formed into the top surface and located between the bottom member and side members; the cavity having top side walls extending from the top surface to optic shelves, middle side walls extending from the optic shelves to contact shelves, and bottom side walls extending from the contact shelves to a base surface; electrical conductive pads on the base surface in the cavity; emitter chips on the electrical conductive pads, each emitter chip having one or more light emitters; shelf contact pads on the contact shelves; and electrical connector wires connected to and extending between the emitter chips and the shelf contact pads. ## Claims ### Claim 1 An emitter package comprising: a body having a bottom member, one or more side members extending from the bottom member, and a top surface, wherein the body defines a cavity formed into the top surface and located between the bottom member and one or more side members; the cavity having one or more top side walls extending from the top surface to one or more optic shelves, one or more middle side walls extending from the one or more optic shelves to one or more contact shelves, and one or more bottom side walls extending from the one or more contact shelves to a base surface; an optical element on and extending between the one or more optic shelves so as to cover at least a portion of the cavity; one or more electrical conductive pads on the base surface in the cavity; one or more light emitter chips on the one or more electrical conductive pads, each light emitter chip having one or more light emitters; one or more shelf contact pads on the one or more contact shelves; one or more electrical connector wires connected to and extending between the one or more light emitter chips and the one or more shelf contact pads; and one or more vents formed into the body and extending from the top surface into the cavity, the one or more vents forming a portion of the at least one of the one or more top side walls to vent the cavity. ### Claim 2 (depends on 1) The emitter package of claim 1, wherein the optical element is a diffuser on and extending between the one or more optic shelves so as to cover a portion of the cavity below the diffuser. ### Claim 3 (depends on 1) The emitter package of claim 1, wherein the body having the bottom member, the one or more side members extending from the bottom member, and the top surface, wherein the body defines the cavity formed into the top surface and located between the bottom member and one or more side members is a unitary member. ### Claim 4 (depends on 1) The emitter package of claim 1, comprising: one electrical conductive pad on the base surface in the cavity; one emitter chip on the one electrical conductive pad; and one shelf contact pad on the one or more contact shelves. ### Claim 5 (depends on 1) The emitter package of claim 1, comprising: four electrical conductive pads on the base surface in the cavity; one emitter chip on each of the electrical conductive pads; and four shelf contact pads on the one or more contact shelves. ### Claim 6 (depends on 1) The emitter package of claim 1, comprising at least one anode pad and at least one cathode pad on a bottom surface of the bottom member. ### Claim 7 (depends on 6) The emitter package of claim 6, wherein: each of the one or more cathode pads is electrically coupled with one of the one or more electrical conductive pads; and each of the one or more anode pads is electrically coupled with one of the one or more shelf contact pads. ### Claim 8 (depends on 7) The emitter package of claim 7, wherein: the cathode pad is electrically connected to a first conductive pad, which is electrically connected through a first emitter chip and a connector wire to a first shelf contact pad, which is electrically connected through one or more first shelf vias to a second conductive pad, which is electrically connected through a second emitter chip and a connector wire to a second shelf contact pad, which is electrically connected through one or more second shelf vias to a third conductive pad, which is electrically connected through a third emitter chip and a connector wire to a third shelf contact pad, which is electrically connected through one or more third shelf vias to a fourth conductive pad, which is electrically connected through a fourth emitter chip and a connector wire to a fourth shelf contact pad, which is electrically connected to the anode pad. ### Claim 9 (depends on 7) The emitter package of claim 7, wherein a series of electrical connections, the cathode pad electrically connected to a conductive pad that is electrically connected through an emitter chip and connector wire to a shelf contact pad that is then coupled either: through one or more series of conductive pad, emitter chip, connector wire, and shelf contact pad, or to an anode pad. ### Claim 10 (depends on 1) The emitter package of claim 1, wherein: the one or more electrical conductive pads are each electrically isolated from each other; and/or the one or more shelf contact pads are each electrically isolated from each other. ### Claim 11 (depends on 1) The emitter package of claim 1, wherein the base surface includes one or more recessed regions or one or more raised regions around the one or more electrical conductive pads. ### Claim 12 (depends on 1) The emitter package of claim 1, wherein the one or more vents are formed into the body and extend from the top surface to the one or more bottom side walls, the one or more vents forming a portion of the at least one of the one or more top side walls, and optionally forming a portion of the at least one or more middle side walls. ### Claim 13 (depends on 1) The emitter package of claim 1, wherein the cavity includes four corners at the top surface, wherein each of the four corners has a rounded relief, wherein one of the rounded reliefs is larger than the other four reliefs. ### Claim 14 (depends on 1) The emitter package of claim 1, wherein the plurality of emitter chips are electrically connected in series. ### Claim 15 (depends on 1) The emitter package of claim 1, wherein the plurality of emitters on the one or more emitter chips are configured to emit infrared light. ### Claim 16 (depends on 1) The emitter package of claim 1, wherein the body is formed of a plastic or ceramic. ### Claim 17 (depends on 16) The emitter package of claim 16, wherein the ceramic is aluminum nitride or alumina. ### Claim 18 (depends on 1) A method of emitting one or more light beams, the method comprising: providing the emitter package of claim 1; and emitting light out of the cavity from the one or more light emitters of the one or more light emitter chips. ### Claim 19 (depends on 18) The method of claim 18, further comprising operating the one or more light emitters in pulse cycles. ### Claim 20 (depends on 18) The method of claim 18, further comprising operating the one or more light emitters in continuous wave modes. ### Claim 21 (depends on 18) The method of claim 18, wherein the light emitted from the one or more light emitters is infrared light. ### Claim 22 (depends on 1) A method of manufacturing the emitter package of claim 1, the method comprising: forming the body having the cavity; placing the one or more electrical conductive pads on the base surface in the cavity; placing the one or more emitter chips on the one or more electrical conductive pads; placing the one or more shelf contact pads on the one or more contact shelves; and electrically connecting the one or more emitter chips with the one or more shelf contact pads with one or more electrical connector wires connected to and extending between the one or more emitter chips and the one or more shelf contact pads. ### Claim 23 An emitter package comprising: a body having a bottom member, one or more side members extending from the bottom member, and a top surface, wherein the body defines a cavity formed into the top surface and located between the bottom member and one or more side members; the cavity having one or more top side walls extending from the top surface to one or more optic shelves, one or more middle side walls extending from the one or more optic shelves to one or more contact shelves, and one or more bottom side walls extending from the one or more contact shelves to a base surface; one or more electrical conductive pads on the base surface in the cavity; one or more light emitter chips on the one or more electrical conductive pads, each light emitter chip having one or more light emitters; one or more shelf contact pads on the one or more contact shelves; one or more electrical connector wires connected to and extending between the one or more light emitter chips and the one or more shelf contact pads; and at least one anode pad and at least one cathode pad on a bottom surface of the bottom member; wherein: each of the one or more cathode pads is electrically coupled with one of the one or more electrical conductive pads; each of the one or more anode pads is electrically coupled with one of the one or more shelf contact pads; and the cathode pad is electrically connected to a first conductive pad, which is electrically connected through a first emitter chip and a connector wire to a first shelf contact pad, which is electrically connected through one or more first shelf vias to a second conductive pad, which is electrically connected through a second emitter chip and a connector wire to a second shelf contact pad, which is electrically connected through one or more second shelf vias to a third conductive pad, which is electrically connected through a third emitter chip and a connector wire to a third shelf contact pad, which is electrically connected through one or more third shelf vias to a fourth conductive pad, which is electrically connected through a fourth emitter chip and a connector wire to a fourth shelf contact pad, which is electrically connected to the anode pad.