# US 10,374,322 B2 · Antenna packaging solution

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- Number: US 10,374,322 B2
- Document ID: US10374322B2
- Status: Granted
- Kind: B2
- Application number: 15/806,496
- Filed: 2017-11-08
- Published: 2019-05-09
- Granted: 2019-08-06
- Earliest claimed: 2017-11-08
- Assignees: International Business Machines Corporation
- Applicants: International Business Machines Corporation
- Inventors: Jean Labonte; Sylvain Ouimet
- Web page: https://patentgrep.com/patent/US10374322B2

## CPC

- H01Q 21/0087: {Apparatus or processes specially adapted for manufacturing antenna arrays (manufacturing waveguides H01P11/00)}
- H01Q 1/2283: {mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package}
- H01Q 1/523: {between antennas of an array}
- H01Q 9/0457: {electromagnetically coupled to the feed line}
- H01Q 21/065: {Patch antenna array}
- H01Q 21/22: Antenna units of the array energised non-uniformly in amplitude or phase, e.g. tapered array or binomial array
- H10W 44/20: at high-frequency [HF] or radio frequency [RF]
- H10W 72/50: Bond wires
- H10W 90/701: {characterised by the relative positions of pads or connectors relative to package parts}
- H10W 44/248: {for antennas}
- H10W 72/252: {comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu}
- H10W 72/536: {the connected ends being ball-shaped}
- H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H01Q: ANTENNAS, i.e. RADIO AERIALS (radiators or antennas for microwave heating H05B6/72)
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A first and second antenna substrate are included in an advanced antenna package. Each antenna substrate includes a respective array of antenna elements disposed on a respective first surface of the substrate. A plurality of stand-off balls disposed between the first surfaces of first and second antenna substrates are bonded to the first surface of the first antenna substrate. A first sub-plurality of the stand-off balls are placed at positions in a peripheral region of the first and second antenna substrates. A second sub-plurality of the stand-off balls are placed at interior positions between antenna elements of the first and second antenna substrates. A plurality of adhesive pillars are disposed between and bond the first surfaces of first and second antenna substrates at a plurality of discrete selected locations. A first location of the discrete selected locations is in a peripheral region. A second location of the discrete selected locations is at an interior position between antenna elements. A method for fabricating the antenna package is also described.

## Claims

### Claim 1

A method for fabricating an antenna package comprising:
providing a first and second antenna substrate, each antenna substrate with a respective array of antenna elements disposed on a respective first surface;
placing a plurality of stand-off balls on the first surface of the first antenna substrate, a first sub-plurality of the stand-off balls placed at positions in a peripheral region of the first substrate and a second sub-plurality of the stand-off balls at interior positions between antenna elements;
dispensing an adhesive on the first surface of one of the antenna substrates at a plurality of discrete selected locations, wherein a first location of the discrete selected locations is a peripheral region and a second location of the discrete selected locations is at interior positions between antenna elements; and
joining the first antenna substrate to the second antenna substrate in a force capping process using an adhesive cure process, wherein the plurality of stand-off balls provide a plurality of controlled gap spacers and the dispensed adhesive forms a plurality of adhesive pillars joining the first and second antenna substrates.

### Claim 2 (depends on 1)

The method as recited in claim 1, wherein the first antenna substrate is an antenna lid laminate substrate and the first second antenna substrate is an antenna carrier laminate substrate on which semiconductor chips are bonded on a second surface opposite to the first surface, wherein the plurality of stand-off balls and the plurality of adhesive pillars control an air gap between the first and second antenna substrates.

### Claim 3 (depends on 1)

The method as recited in claim 1, and wherein the peripheral region is located outside the antenna array.

### Claim 4 (depends on 1)

The method as recited in claim 1, wherein the adhesive is dispensed on the second substrate.

### Claim 5 (depends on 1)

The method as recited in claim 1, wherein the adhesive is dispensed on the first substrate.

### Claim 6 (depends on 1)

The method as recited in claim 1, wherein at least a subgroup of the plurality of stand-off balls is located where compressive forces are expected and at least subgroup of the adhesive pillars is located where tensile forces are expected.

### Claim 7 (depends on 4)

The method as recited in claim 4, wherein a respective ball stand-off is located on the first substrate at a location corresponding to a respective discrete selected location so that a composite stand-off ball adhesive pillar is formed which joins the first and second substrates.

### Claim 8 (depends on 1)

The method as recited in claim 1, wherein a minimum number of ball stand-offs and pillars are selected to reduce antenna interference and maintain structural integrity.

### Claim 9 (depends on 1)

The method as recited in claim 1, wherein the respective arrays of antenna elements are uniform in spacing and all of the stand-off balls and adhesive pillars are located at positions between antenna elements.

### Claim 10 (depends on 1)

The method as recited in claim 1, wherein the ball stand-offs are copper balls attached with solder only on the first surface of the first antenna substrate.