# US 10,374,305 B2 · Multilayer substrate and electronic device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,374,305 B2 - Document ID: US10374305B2 - Status: Granted - Kind: B2 - Application number: 15/881,857 - Filed: 2018-01-29 - Published: 2018-05-31 - Granted: 2019-08-06 - Earliest claimed: 2015-07-30 - Assignees: Murata Manufacturing Co., Ltd. - Applicants: Murata Manufacturing Co., Ltd. - Inventors: Nobou Ikemoto; Jun Sasaki - Web page: https://patentgrep.com/patent/US10374305B2 ## CPC - H01Q 1/52: Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure (absorbing means H01Q17/00) - H01Q 1/40: Radiating elements coated with or embedded in protective material - H01Q 7/06: with core of ferromagnetic material (H01Q7/02 takes precedence) - H05K 1/115: {Via connections; Lands around holes or via connections (H05K1/112 takes precedence)} - H05K 1/147: {at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit (H05K1/148 takes precedence)} - H05K 1/165: {incorporating printed inductors} - H05K 1/181: associated with surface mounted components - H01Q 1/22: by structural association with other equipment or articles - H01Q 1/38: formed by a conductive layer on an insulating support {(patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142)} - H01Q 3/02: using mechanical movement of antenna or antenna system as a whole - H05K 1/028: {Bending or folding regions of flexible printed circuits (H05K1/0283 takes precedence)} - H05K 1/117: {Pads along the edge of rigid circuit boards, e.g. for pluggable connectors} - H05K 3/06: the conductive material being removed chemically or electrolytically, e.g. by photo-etch process {(semi-additive methods H05K3/108)} - H05K 3/4635: {laminating flexible circuit boards using additional insulating adhesive materials between the boards} - H05K 3/4652: {Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern (H05K3/4647 takes precedence)} - H05K 3/4691: {Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers} - H05K 2201/086: for inductive purposes, e.g. printed inductor with ferrite core - H05K 2201/10098: Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas - H05K 2201/10189: Non-printed connector - H05K 2201/2009: Reinforced areas, e.g. for a specific part of a flexible printed circuit - H01Q: ANTENNAS, i.e. RADIO AERIALS (radiators or antennas for microwave heating H05B6/72) - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract A multilayer substrate, in which flexible insulating base materials are laminated, includes first and second regions. The number of laminated insulating base materials in the second region is smaller than that in the first region. The multilayer substrate includes a coil antenna located in the first region, a magnetic member located in the first region, a mounting component located in the first region, a wiring pattern, and an external connection terminal. The mounting component entirely overlaps the magnetic member when viewed in a thickness direction and is located on a side opposite to the coil antenna across the magnetic member in the thickness direction. At least a portion of the coil antenna overlaps the magnetic member when viewed in the thickness direction. ## Claims ### Claim 1 A multilayer substrate comprising: a plurality of insulating base layers that are flexible and are laminated; a first region including a first number of the laminated insulating base layers; a second region including a second number of the laminated insulating base layers and being bent, the second number of laminated insulating base layers being less than the first number of laminated insulating base layers; a coil antenna located in the first region and including a winding axis extending along a lamination direction of the insulating base layers in the first region; a magnetic member located in the first region; a component located in the first region and located on a side opposite to the coil antenna across the magnetic member in the lamination direction; a wiring pattern located in the second region; and an external connection terminal located in the second region and electrically connected to the wiring pattern; wherein the component overlaps the magnetic member when viewed in the lamination direction; at least a portion of the coil antenna overlaps the magnetic member when viewed in the lamination direction; and the insulating base layers in the second region are in a bent state on a side opposite to the coil antenna across the magnetic member in the lamination direction. ### Claim 2 (depends on 1) The multilayer substrate according to claim 1, wherein the coil antenna includes a coil conductor; and the coil conductor includes a spiral shape. ### Claim 3 (depends on 2) The multilayer substrate according to claim 2, wherein the coil conductor includes a first coil conductor and a second coil conductor; and the first coil conductor and the second coil conductor are provided on different ones of the plurality of insulating base layers. ### Claim 4 (depends on 3) The multilayer substrate according to claim 3, wherein the first coil conductor and the second coil conductor are electrically connected by a first interlayer connection conductor. ### Claim 5 (depends on 3) The multilayer substrate according to claim 3, wherein the coil conductor further includes a third coil conductor; the first coil conductor and the third coil conductor are provided on a same one of the plurality of insulating base layers; the second coil conductor and the third coil conductor are electrically connected by a second interlayer connection conductor; and the third coil conductor is a rectangular or substantially rectangular conductor pattern. ### Claim 6 (depends on 1) The multilayer substrate according to claim 1, wherein the coil antenna includes a coil conductor; the coil conductor is provided on the plurality of insulating base layers; and each end of the coil conductor is located on an outermost periphery of the coil conductor when viewed in the lamination direction. ### Claim 7 (depends on 1) The multilayer substrate according to claim 1, wherein the coil antenna entirely overlaps the magnetic member when viewed in the lamination direction. ### Claim 8 (depends on 1) The multilayer substrate according to claim 1, wherein the wiring pattern includes a plurality of wiring patterns arranged in parallel or substantially in parallel to each other; the plurality of wiring patterns includes a ground wiring pattern to be electrically connected to the ground; and the ground wiring pattern is a wiring pattern, among the wiring patterns, located on an outermost side in an arrangement direction in which the plurality of wiring patterns are arranged in parallel or substantially in parallel to each other. ### Claim 9 (depends on 1) An electronic device comprising: the multilayer substrate according to claim 1; and a wiring substrate; wherein the external connection terminal of the multilayer substrate is electrically connected to the wiring substrate. ### Claim 10 (depends on 9) The electronic device according to claim 9, wherein the magnetic member is located between the coil antenna and the wiring substrate. ### Claim 11 (depends on 9) The electronic device according to claim 9, wherein the coil antenna does not overlap the wiring substrate when viewed in a direction perpendicular or substantially perpendicular to a main surface of the wiring substrate. ### Claim 12 (depends on 9) The electronic device according to claim 9, wherein, in the multilayer substrate, the winding axis of the coil antenna is not perpendicular to a main surface of the wiring substrate. ### Claim 13 (depends on 1) The multilayer substrate according to claim 1, wherein the second region is more flexible than the first region. ### Claim 14 (depends on 1) The multilayer substrate according to claim 1, wherein each of the first number of the laminated insulating base layers and each of the second number of the laminated insulating base layers is a rectangular or substantially rectangular flat plate. ### Claim 15 (depends on 1) The multilayer substrate according to claim 1, at least one of the first number of the laminated insulating base layers and the second number of the laminated insulating base layers includes an interlayer connection conductor extending in a thickness direction thereof. ### Claim 16 (depends on 15) The multilayer substrate according to claim 15, wherein the interlayer connection conductor is a via conductor. ### Claim 17 (depends on 1) The multilayer substrate according to claim 1, further comprising at least one mounting component mounted on a main surface of the multilayer substrate. ### Claim 18 (depends on 17) The multilayer substrate according to claim 17, wherein the at least one mounting component is a chip component. ### Claim 19 (depends on 17) The multilayer substrate according to claim 17, wherein the magnetic member is located between the coil antenna and the main surface of the multilayer substrate. ### Claim 20 (depends on 1) The multilayer substrate according to claim 1, wherein the second number of laminated insulating base layers included in the second region is one.