# US 10,374,304 B2 · Electronic apparatus and antenna device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,374,304 B2 - Document ID: US10374304B2 - Status: Granted - Kind: B2 - Application number: 15/618,223 - Filed: 2017-06-09 - Published: 2017-09-28 - Granted: 2019-08-06 - Earliest claimed: 2015-06-16 - Assignees: Murata Manufacturing Co., Ltd. - Applicants: Murata Manufacturing Co., Ltd. - Inventors: Katsumi Taniguchi; Noboru Kato - Web page: https://patentgrep.com/patent/US10374304B2 ## CPC - H01Q 1/52: Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure (absorbing means H01Q17/00) - H01P 3/085: {Triplate lines} - H01Q 1/243: {with built-in antennas} - H01Q 1/38: formed by a conductive layer on an insulating support {(patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142)} - H01Q 1/48: Earthing means; Earth screens; Counterpoises - H03H 7/38: Impedance-matching networks - H04B 1/0458: {Arrangements for matching and coupling between power amplifier and antenna or between amplifying stages (matching circuits in general H03H)} - H05K 1/0216: {Reduction of cross-talk, noise or electromagnetic interference (grounding H05K1/0215)} - H05K 1/028: {Bending or folding regions of flexible printed circuits (H05K1/0283 takes precedence)} - H01Q: ANTENNAS, i.e. RADIO AERIALS (radiators or antennas for microwave heating H05B6/72) - H01P: WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE (operating at optical frequencies G02B) - H03H: IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS (waveguides, resonators, lines or other devices of the waveguide type H01P) - H04B: TRANSMISSION - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract An electronic apparatus includes an antenna device, a circuit board, and a housing containing the antenna device and the circuit board. The inner surface of the housing is spaced apart from the circuit board. The antenna device includes an antenna unit, a matching circuit unit connected to the antenna unit, a transmission line unit connected to the matching circuit unit, and a connecting portion included in the transmission line unit. The antenna device is disposed along the inner surface of the housing. The connecting portion is connected to a circuit of the circuit board. The antenna device includes a ground connection portion in the matching circuit unit in a region where the antenna device is disposed along the inner surface of the housing. The ground connection portion electrically connects a second ground conductor of the antenna device to a first ground conductor on the housing. ## Claims ### Claim 1 An electronic apparatus comprising: an antenna device; a circuit board including a circuit; and a housing containing the antenna device and the circuit board; wherein an inner surface of the housing and the circuit board are spaced from each other by a distance; the housing includes a first ground conductor; the antenna device includes: an antenna unit; a matching circuit unit connected to the antenna unit; a transmission line unit connected to the matching circuit unit; and a connecting portion included in the transmission line unit and connected to the circuit of the circuit board; the antenna unit, the matching circuit unit, the transmission line unit, and the connecting portion are disposed in a single substrate; the antenna device is at least partly disposed along the inner surface of the housing; at least one of the matching circuit unit and the transmission line unit includes a second ground conductor, and includes a ground connection portion at least in a portion of a surface of a region where the antenna device is disposed along the inner surface of the housing; and the ground connection portion electrically connects the second ground conductor to the first ground conductor. ### Claim 2 (depends on 1) The electronic apparatus according to claim 1, wherein an entirety of the substrate is flexible. ### Claim 3 (depends on 1) The electronic apparatus according to claim 1, wherein the substrate is flexible at least in an area where the antenna unit is disposed; and the antenna unit is located along the inner surface of the housing in a bent state. ### Claim 4 (depends on 1) The electronic apparatus according to claim 1, wherein the substrate is flexible at least in a vicinity of the connecting portion; and the transmission line unit is bent in the vicinity of the connecting portion. ### Claim 5 (depends on 4) The electronic apparatus according to claim 4, wherein a vicinity of the connecting portion is within a distance of less than three times the distance between the inner surface of the housing and the circuit board. ### Claim 6 (depends on 1) The electronic apparatus according to claim 1, wherein the antenna device is disposed along the inner surface of the housing, except in a vicinity of the connecting portion, and is connected to the circuit only at the connecting portion. ### Claim 7 (depends on 6) The electronic apparatus according to claim 6, wherein a vicinity of the connecting portion is within a distance of less than three times the distance between the inner surface of the housing and the circuit board. ### Claim 8 (depends on 1) The electronic apparatus according to claim 1, wherein the ground connection portion is exposed on a first principal surface of the substrate. ### Claim 9 (depends on 1) The electronic apparatus according to claim 1, wherein the matching circuit unit is a π-shaped or substantially π-shaped circuit including at least one reactance element. ### Claim 10 (depends on 9) The electronic apparatus according to claim 9, wherein the at least one reactance element is mounted on a second principal surface of the substrate. ### Claim 11 (depends on 1) The electronic apparatus according to claim 1, wherein the portion of the second ground conductor is exposed on a second principal surface of the substrate. ### Claim 12 (depends on 1) The electronic apparatus according to claim 1, wherein the substrate has a multilayer structure including a first protective layer defining an uppermost layer, at least one resin base layer defining at least one center layer, and a second protective layer defining a lowermost layer. ### Claim 13 (depends on 12) The electronic apparatus according to claim 12, wherein the at least one resin base layer is a resin layer, and the first and second protective layers are resist layers or coverlay films. ### Claim 14 (depends on 12) The electronic apparatus according to claim 12, wherein the antenna unit includes an antenna conductor that includes a C-shaped or substantially C-shaped conductive pattern near a second end portion of the at least one resin base layer. ### Claim 15 (depends on 1) The electronic apparatus according to claim 1, wherein the antenna unit, the matching circuit unit, the transmission line unit, and the connecting portion are arranged in this order in a longitudinal direction of the substrate. ### Claim 16 (depends on 1) The electronic apparatus according to claim 1, wherein the second ground conductor includes two second ground conductors; and the transmission line unit has a triplate stripline structure in which a signal conductor is sandwiched between the two second ground conductors. ### Claim 17 (depends on 1) The electronic apparatus according to claim 1, wherein at least one surface mount component is mounted on a principal surface of the circuit board. ### Claim 18 (depends on 17) The electronic apparatus according to claim 17, wherein at least one conductor is provided on the principal surface of the circuit board; and each of the at least one conductor is a conductive pattern that is connected to a respective one of the at least one surface mount component. ### Claim 19 (depends on 1) The electronic apparatus according to claim 1, wherein an entire first principal surface of the substrate extends along the inner surface of the housing.