# US 10,374,301 B2 · Wiring component

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- Number: US 10,374,301 B2
- Document ID: US10374301B2
- Status: Granted
- Kind: B2
- Application number: 15/840,192
- Filed: 2017-12-13
- Published: 2018-06-21
- Granted: 2019-08-06
- Earliest claimed: 2017-12-13
- Assignees: TDK Corporation
- Applicants: TDK Corporation
- Inventors: Yuhei Horikawa; Makoto Orikasa; Yoshihiro Kanbayashi; Hisayuki Abe; Hirohumi Asou; Kosuke Kunitsuka
- Web page: https://patentgrep.com/patent/US10374301B2

## CPC

- H01Q 1/38: formed by a conductive layer on an insulating support {(patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142)}
- H01Q 7/00: Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
- H04B 5/26: using coils
- H01Q 1/2208: {associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems (methods or arrangements for sensing record carriers, e.g. for reading patterns G06K7/00; record carrier for use with machines and with at least a part designed to carry digital markings G06K19/00)}
- H01Q 1/2225: {used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal}
- H01Q: ANTENNAS, i.e. RADIO AERIALS (radiators or antennas for microwave heating H05B6/72)
- H04B: TRANSMISSION

## Abstract

Disclosed herein is a wiring component that includes a base material and a planar coil pattern formed on the base material. The planar coil pattern includes a coil wiring portion having one end, other end, and first to third connecting positions, the second connecting position being closer to the other end compared with the first connecting position, the third connecting position being closer to the one end compared with the second connecting position; a power-feed wiring portion connected to the first connecting position; and a connection wiring portion that short-circuits the second connecting position and the third connecting position. A cross-section structure of the planar coil pattern has a base resin layer formed on the base material, and a conductive layer formed on the base resin layer.

## Claims

### Claim 1

A wiring component comprising:
a base material; and
a planar coil pattern formed on the base material,
wherein the planar coil pattern includes:
a coil wiring portion having one end, other end, and first to third connecting positions, the second connecting position being closer to the other end compared with the first connecting position, the third connecting position being closer to the one end compared with the second connecting position;
a power-feed wiring portion connected to the first connecting position; and
a connection wiring portion that short-circuits the second connecting position and the third connecting position, and
wherein a cross-section structure of the planar coil pattern has a base resin layer formed on the base material, and a conductive layer formed on the base resin layer.

### Claim 2 (depends on 1)

The wiring component as claimed in claim 1,
wherein the coil wiring portion includes a spiral pattern, and
wherein the one end and the other end of the coil wiring portion are an outer peripheral end and an inner peripheral end of the spiral pattern, respectively.

### Claim 3 (depends on 2)

The wiring component as claimed in claim 2, wherein the second connecting position is located at the inner peripheral end of the spiral pattern.

### Claim 4 (depends on 2)

The wiring component as claimed in claim 2, wherein the third connecting position is located at a cross point of an innermost turn of the spiral pattern and an extension line extending from the inner peripheral end in a winding direction.

### Claim 5 (depends on 2)

The wiring component as claimed in claim 2, wherein the first connecting position is apart from the outer peripheral end and located on an outermost turn of the spiral pattern.

### Claim 6 (depends on 1)

The wiring component as claimed in claim 1, wherein the base material comprises a resin film.

### Claim 7 (depends on 1)

The wiring component as claimed in claim 1, wherein the base resin layer includes at least one of metal selected from Pd, Cu, Ni, Ag, Pt, and Au.

### Claim 8 (depends on 1)

The wiring component as claimed in claim 1, wherein the conductive layer includes a base conductive layer formed on the base resin layer by electroless plating, and a wiring conductive layer thicker than the base conductive layer, formed on the base conductive layer by electrolytic plating.

### Claim 9 (depends on 8)

The wiring component as claimed in claim 8, wherein each of the base conductive layer and the wiring conductive layer comprises at least one of metal selected from Cu, Ag, and Au, respectively.
