# US 10,374,137 B2 · Light converter assemblies with enhanced heat dissipation

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- Number: US 10,374,137 B2
- Document ID: US10374137B2
- Status: Granted
- Kind: B2
- Application number: 15/118,075
- Filed: 2015-03-10
- Published: 2016-12-22
- Granted: 2019-08-06
- Earliest claimed: 2014-03-11
- Assignees: OSRAM GmbH; OSRAM Opto Semiconductors GmbH
- Applicants: OSRAM GmbH; OSRAM Opto Semiconductors GmbH
- Inventors: Maria Anc; Alan Lenef
- Web page: https://patentgrep.com/patent/US10374137B2

## CPC

- H10H 20/8582: {characterised by their shape}
- B32B 3/02: characterised by features of form at particular places, e.g. in edge regions {(non-uniform thickness B32B3/263)}
- B32B 3/10: characterised by a discontinuous layer, i.e. formed of separate pieces of material
- B32B 7/027: Thermal properties
- B32B 7/04: Interconnection of layers
- F21K 9/64: using wavelength conversion means distinct or spaced from the light-generating element, e.g. a remote phosphor layer
- H10H 20/8512: {Wavelength conversion materials}
- H10H 20/8514: {characterised by their shape, e.g. plate or foil}
- H10H 20/8515: {not being in contact with the bodies}
- H10H 20/8516: {having a non-uniform spatial arrangement or non-uniform concentration, e.g. patterned wavelength conversion layer or wavelength conversion layer with a concentration gradient}
- H10H 20/8583: {not being in contact with the bodies}
- B32B 3/266: {characterised by an apertured layer, the apertures going through the whole thickness of the layer, e.g. expanded metal, perforated layer, slit layer regular cells B32B3/12}
- B32B 7/12: using interposed adhesives or interposed materials with bonding properties
- B32B 15/04: comprising metal as the main or only constituent of a layer, {which is} next to another layer of {the same or of} a {different material (next to a bituminous or tarry layer B32B11/08; next to a water-setting substance layer B32B13/06; next to a glass layer B32B17/061; next to a cellulosic plastic layer B32B23/042)}
- B32B 15/043: {of metal (B32B15/01 takes precedence)}
- B32B 15/20: comprising aluminium or copper {(B32B15/016 and B32B15/017 take precedence)}
- B32B 18/00: Layered products essentially comprising ceramics, e.g. refractory products
- B32B 2250/44: Number of layers variable across the laminate
- B32B 2255/20: Inorganic coating
- B32B 2255/205: Metallic coating
- B32B 2255/28: Multiple coating on one surface
- B32B 2307/302: Conductive
- B32B 2307/412: Transparent
- B32B 2307/416: Reflective
- B32B 2307/422: Luminescent, fluorescent, phosphorescent
- B32B 2311/08: Silver
- B32B 2311/12: Copper
- B32B 2311/24: Aluminium
- B32B 2315/02: Ceramics
- C04B 35/115: Translucent or transparent products
- C04B 2237/12: Metallic interlayers
- C04B 2237/121: based on aluminium
- C04B 2237/124: based on copper
- C04B 2237/125: based on noble metals, e.g. silver
- C04B 2237/16: Silicon interlayers
- C04B 2237/343: Alumina or aluminates
- C04B 2237/592: whereby the interlayer is not continuous, e.g. not the whole surface of the smallest substrate is covered by the interlayer
- C04B 2237/72: Forming laminates or joined articles comprising at least two interlayers directly next to each other
- C04B 2237/86: Joining of two substrates at their largest surfaces, one surface being complete joined and covered, the other surface not, e.g. a small plate joined at it's largest surface on top of a larger plate
- F21V 29/83: the elements having apertures, ducts or channels, e.g. heat radiation holes
- F21Y 2115/30: Semiconductor lasers
- H10H 20/8511: {characterised by their material, e.g. binder}
- Y10S 428/913: Material designed to be responsive to temperature, light, moisture
- Y10T 428/24322: Composite web or sheet
- Y10T 428/24331: including nonapertured component
- Y10T 428/24752: Laterally noncoextensive components
- Y10T 428/24777: Edge feature
- Y10T 428/24802: Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T 428/24843: with heat sealable or heat releasable adhesive layer
- Y10T 428/24851: Intermediate layer is discontinuous or differential
- Y10T 428/24917: including metal layer
- Y10T 428/24926: including ceramic, glass, porcelain or quartz layer
- Y10T 428/24942: including components having same physical characteristic in differing degree
- H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- B32B: LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- F21K: NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- C04B: LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE {(roofing granules E04D7/005)}; CERAMICS (devitrified glass-ceramics C03C10/00); REFRACTORIES; TREATMENT OF NATURAL STONE
- F21V: FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21Y: INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- Y10S: TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

## Abstract

The present disclosure is directed to light converter assemblies with enhanced heat dissipation. A light converter assembly may comprise a confinement material applied to at least a first substrate and a phosphor material also deposited on the first substrate so as to be surrounded by the confinement material. The first substrate may be hermetically sealed to a second substrate using the confinement material so that the phosphor material is confined between the substrates and protected from atmospheric contamination. The substrates may comprise, for example, sapphire to allow for light beam transmission and heat conductance. Confinement materials that may be employed to seal the first substrate to the second substrate may include, for example, silicon or a metal (e.g., silver, copper, aluminum, etc.) The phosphor material may comprise, for example, at least one quantum dot material.

## Claims

### Claim 1

A light converter assembly comprising:
a first substrate and a second substrate, the first and second substrates comprising a light transmissive, thermally conductive material;
a phosphor material disposed between the first and second substrates;
a confinement material disposed between the first and second substrates, the confinement material surrounding the phosphor material and bonding the first and second substrates together to hermetically seal the phosphor material between the first and second substrates,
wherein the confinement material has a thermal conductivity greater than 10 W/m*K,
wherein the confinement material comprises two layers, and
wherein a first layer of the confinement material is deposited on a surface of the first substrate and a second layer of the confinement material is deposited on a surface of the second substrate; and
a heat sink attached to the second substrate and the first layer of the confinement material on the first substrate, wherein the first substrate is larger than the second substrate such that an interfacial area of the first substrate and the heat sink is increased, and wherein the heat sink comprises an aperture positioned so that an excitation beam is able to impinge on the phosphor material.

### Claim 2 (depends on 1)

The light converter assembly according to claim 1, wherein the heat sink covers a side surface of the second layer of the confinement material.

### Claim 3 (depends on 1)

The light converter assembly according to claim 1, wherein the phosphor material is arranged within an opening in the second layer of the confinement material.

### Claim 4 (depends on 3)

The light converter assembly according to claim 3, wherein a further opening, aligned with the opening in the second layer of the confinement material, is formed in the first layer of the confinement material, wherein the phosphor material is further arranged within the further opening.

### Claim 5 (depends on 3)

The light converter assembly according to claim 3, wherein a recess, aligned with the opening in the second layer of the confinement material, is formed in the surface of the second substrate, wherein the phosphor material is further arranged within the recess.

### Claim 6 (depends on 3)

The light converter assembly according to claim 3, wherein the first layer of the confinement material covers a top surface of the phosphor material completely, and wherein the second layer of the confinement material covers a side surface of the phosphor material completely.

### Claim 7 (depends on 1)

The light converter assembly according to claim 1, wherein the first and second layers of the confinement material covers at least about 50% of the corresponding first and second substrate surface to which it is applied.

### Claim 8 (depends on 7)

The light converter assembly according to claim 7, wherein the first and second layers of the confinement material cover at least about 75% of the corresponding first and second substrate surface to which it is applied.

### Claim 9 (depends on 8)

The light converter assembly according to claim 8, wherein the first and second layers of the confinement material cover at least about 50% of the corresponding first and second substrate surface to which it is applied.

### Claim 10 (depends on 1)

The light converter assembly according to claim 1, wherein the first and second substrates comprise sapphire.

### Claim 11 (depends on 10)

The light converter assembly according to claim 10, wherein the confinement material has a thermal conductivity greater than a thermal conductivity of the first and second substrates.

### Claim 12 (depends on 10)

The light converter assembly according to claim 10, wherein the confinement material has a thermal conductivity of at least 100 W/m*K.

### Claim 13 (depends on 10)

The light converter assembly according to claim 10, wherein the confinement material comprises at least one of silicon, aluminum, silver or copper.

### Claim 14 (depends on 13)

The light converter assembly according to claim 13, wherein the first and second substrates are flat plates and the confinement material is silicon.

### Claim 15 (depends on 1)

The light converter assembly according to claim 1, wherein the first and second layers of the confinement material have a different composition.

### Claim 16 (depends on 1)

The light converter assembly according to claim 1, further comprising a bonding facilitator material, wherein the bonding facilitator material is disposed between the first and second layers of the confinement material.

### Claim 17 (depends on 1)

The light converter assembly according to claim 1, further comprising a reflective material located between the first and second substrates in an area corresponding to at least an area of the phosphor material.

### Claim 18 (depends on 17)

The light converter assembly according to claim 17, wherein the reflective material has a composition that is the same as the confinement material.

### Claim 19 (depends on 1)

The light converter assembly according to claim 1, wherein the phosphor material comprises a plurality of quantum dots deposited substantially in one or more monolayers.

### Claim 20 (depends on 19)

The light converter assembly according to claim 19, wherein the phosphor material further comprises at least one layer of a coating to prevent agglomeration of the plurality of quantum dots.

### Claim 21 (depends on 20)

The light converter assembly according to claim 20, wherein the coating comprises aluminum oxide.

### Claim 22

A light converter assembly comprising:
a first substrate and a second substrate, the first and second substrates comprising a light transmissive thermally conductive material;
a phosphor material disposed between the first and second substrates; and
a confinement material disposed between the first and second substrates, the confinement material surrounding the phosphor material and bonding the first and second substrates together to hermetically seal the phosphor material between the first and second substrates,
wherein the confinement material has a thermal conductivity greater than 10 W/m*K,
wherein the confinement material comprises two layers,
wherein a first layer of the confinement material is deposited on a surface of the first substrate and a second layer of the confinement material is deposited on a surface of the second substrate,
wherein the phosphor material is located in an opening of the second layer of the confinement material,
wherein the first layer of the confinement material covers a top surface of the phosphor material completely, and
wherein the second layer of the confinement material covers a side surface of the phosphor material completely.

### Claim 23 (depends on 22)

The light converter assembly according to claim 22, further comprising a heat sink coupled to at least one of the first and second substrates.