# US 10,374,134 B2 · Light emitting device, method of manufacturing covering member, and method of manufacturing light emitting device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,374,134 B2 - Document ID: US10374134B2 - Status: Granted - Kind: B2 - Application number: 15/167,570 - Filed: 2016-05-27 - Published: 2016-12-01 - Granted: 2019-08-06 - Earliest claimed: 2015-05-29 - Assignees: Nichia Corporation - Applicants: Nichia Corporation - Inventors: Tadao Hayashi; Teruhito Azuma; Suguru Beppu; Kunihiro Izuno; Tsuyoshi Okahisa - Web page: https://patentgrep.com/patent/US10374134B2 ## CPC - H10H 20/8515: {not being in contact with the bodies} - H10H 20/85: Packages - H10H 20/8514: {characterised by their shape, e.g. plate or foil} - H10H 20/8516: {having a non-uniform spatial arrangement or non-uniform concentration, e.g. patterned wavelength conversion layer or wavelength conversion layer with a concentration gradient} - H10H 20/855: Optical field-shaping means, e.g. lenses - H10H 20/856: Reflecting means - H10H 20/036: {of packages} - H10H 20/0361: {of wavelength conversion means} - H10H 20/0362: {of encapsulations} - H10H 20/0363: {of optical field-shaping means} - H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS ## Abstract A light emitting device includes: a covering member including a first light-reflective member having a through-hole, and a light-transmissive resin disposed in the through-hole; a light-emitting element arranged to face the light-transmissive resin; a second light-reflective member arranged to face the first light-reflective member around the light-emitting element, the second light-reflective member covering a lateral surface of the light-emitting element; and a bonding member bonding the light-transmissive resin and the light-emitting element, the bonding member covering at least a part of the lateral surface of the light-emitting element. The light-transmissive resin contains a wavelength-conversion material distributed predominantly on either (i) a side of a lower surface of the light-transmissive resin facing the light-emitting element, or (ii) a side of an upper surface of the light-transmissive resin apart from the light-emitting element. ## Claims ### Claim 1 A light emitting device comprising: a covering member including a first light-reflective member having a through-hole, and a light-transmissive resin disposed in the through-hole; a light-emitting element arranged to face the light-transmissive resin; a second light-reflective member arranged to face the first light-reflective member around the light-emitting element, the second light-reflective member covering a lateral surface of the light-emitting element; and a bonding member bonding the light-transmissive resin and the light-emitting element, the bonding member covering at least a part of the lateral surface of the light-emitting element, wherein a lower surface of the light-transmissive resin and a lower surface of the first light-reflective member extend in substantially the same plane, and wherein the light-transmissive resin contains a wavelength-conversion material distributed predominantly on either (i) a side of the lower surface of the light-transmissive resin facing the light-emitting element, or (ii) a side of an upper surface of the light-transmissive resin apart from the light-emitting element, wherein a sidewall of the through-hole has a protrusion that is inclined toward the lower surface of the light-transmissive resin, and wherein a tip of the protrusion contacts the wavelength-conversion material. ### Claim 2 (depends on 1) The light emitting device according to claim 1, wherein the wavelength-conversion material is distributed predominantly on the side of the lower surface of the light-transmissive resin. ### Claim 3 (depends on 1) The light emitting device according to claim 1, wherein the upper surface of the light-transmissive resin and an upper surface of the first light-reflective member are located in substantially the same plane. ### Claim 4 (depends on 1) The light emitting device according to claim 1, wherein the upper surface of the light-transmissive resin is a rough surface. ### Claim 5 (depends on 1) The light emitting device according to claim 1, wherein the first light-reflective member and the second light-reflective member each include resin. ### Claim 6 (depends on 1) The light emitting device according to claim 1, wherein a first light diffusion material is disposed in the light-transmissive resin, and wherein a refractive index of the first light diffusion material at 25° C. is higher than a refractive index of the light-transmissive resin at 25° C. ### Claim 7 (depends on 6) The light emitting device according to claim 6, wherein a portion of the first light diffusion material is contained in a region other than a region in which the wavelength-conversion material is predominantly distributed. ### Claim 8 (depends on 1) The light emitting device according to claim 1, wherein an external periphery of the through-hole on a side of the light-emitting element is positioned outside of an external periphery of the light-emitting element. ### Claim 9 (depends on 1) The light emitting device according to claim 1, wherein the light emitting element comprises: a light-transmissive substrate, a semiconductor laminated body located on a lower surface of the light-transmissive substrate, and a pair of electrodes located on a lower surface of the semiconductor laminated body, and wherein the second light-reflective member is formed of a single continuous mass of material that covers lateral surfaces of the light-transmissive substrate, semiconductor laminated body, and pair of electrodes. ### Claim 10 (depends on 9) The light emitting device according to claim 9, wherein the semiconductor laminated body comprises a first conductive-type semiconductor layer, a light-emission layer, and a second conductive-type semiconductor layer.