# US 10,374,116 B2 · Light receiving and emitting element module and sensor device

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- Number: US 10,374,116 B2
- Document ID: US10374116B2
- Status: Granted
- Kind: B2
- Application number: 15/569,595
- Filed: 2016-04-27
- Published: 2018-10-18
- Granted: 2019-08-06
- Earliest claimed: 2015-04-27
- Assignees: KYOCERA Corporation
- Applicants: KYOCERA Corporation
- Inventors: Naoki Fujimoto
- Web page: https://patentgrep.com/patent/US10374116B2

## CPC

- H10F 55/00: Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto
- G01N 21/17: Systems in which incident light is modified in accordance with the properties of the material investigated (where the material investigated is optically excited causing a change in wavelength of the incident light G01N21/63)
- G01S 7/4813: {Housing arrangements}
- G01S 17/04: Systems determining the presence of a target
- H10F 55/255: formed in, or on, a common substrate
- H10F 77/334: {for shielding light, e.g. light blocking layers or cold shields for infrared detectors}
- H10F 77/407: {indirectly associated with the devices}
- H10F 77/50: Encapsulations or containers (for photovoltaic modules H10F19/80)
- H10H 20/855: Optical field-shaping means, e.g. lenses
- H10W 90/00: Package configurations
- G01N 2201/061: Sources
- H03K 2217/94108: making use of reflection
- H10F: INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- G01N: INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES (measuring or testing apparatus or processes other than immunoassay, involving enzymes or microorganisms C12M, C12Q)
- G01S: RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H03K: PULSE TECHNIQUE (measuring pulse characteristics G01R; modulating sinusoidal oscillations with pulses H03C; transmission of digital information H04L; discriminator circuits detecting phase difference between two signals by counting or integrating cycles of oscillation H03D3/04; automatic control, starting, synchronisation or stabilisation of generators of electronic oscillations or pulses where the type of generator is irrelevant or unspecified H03L; coding, decoding or code conversion, in general H03M)

## Abstract

A light receiving and emitting element module includes a wiring substrate; a light emitting element and a light receiving element which are disposed on the wiring substrate; and a lens member having a lens portion, a support portion configured to support the lens portion disposed above the light emitting element and the light receiving element and a column disposed on a lower surface of the support portion, wherein a tip end of the column is in contact with an upper surface of the wiring substrate.

## Claims

### Claim 1

A light receiving and emitting element module, comprising:
a wiring substrate;
a light emitting element and a light receiving element which are disposed on the wiring substrate; and
a lens member comprising a lens portion, a support portion configured to support the lens portion disposed above the light emitting element and the light receiving element and a plurality of columns disposed on a lower surface of the support portion,
the plurality of columns including a plurality of first columns and a plurality of second columns,
the plurality of first columns being positioned with the light emitting element and the light receiving element interposed therebetween, and tip ends of the first columns being in contact with and above a top flat surface of the wiring substrate,
the plurality of second columns being positioned with the light emitting element and the light receiving element interposed therebetween, and tip ends of the second columns being disposed in a plurality of hole portions whose openings are disposed in the top flat surface of the wiring substrate.

### Claim 2 (depends on 1)

The light receiving and emitting element module according to claim 1, wherein the lens portion, the support portion, the plurality of first columns and the plurality of second columns are integrated in the lens member.

### Claim 3 (depends on 1)

The light receiving and emitting element module according to claim 1, wherein a tip end surface of each of the plurality of first columns of the lens member is a convexly curved surface.

### Claim 4 (depends on 1)

The light receiving and emitting element module according to claim 1, further comprising:
a light shield, which is disposed between the lens member and the wiring substrate, is surrounding the light emitting element and the light receiving element, and the light shield comprises a wall portion having frame-like and including an upper surface and a lower surface,
wherein the wall portion of the light shield comprises through holes including openings disposed in the upper surface and the lower surface of the wall portion, and
the plurality of first columns and the plurality of second columns are disposed in the through holes.

### Claim 5 (depends on 4)

The light receiving and emitting element module according to claim 4,
wherein the upper surface of the light shield is apart from the lower surface of the support portion of the lens member.

### Claim 6 (depends on 4)

The light receiving and emitting element module according to claim 4,
wherein when the light receiving and emitting element module is viewed from above, an outer edge of the light shield is disposed outside an outer edge of the lens member,
an upper surface of the outer edge of the light shield further comprises a convex portion protruding upward, and
the lens member is fixed to the light shield via an adhesive on a side surface of the support portion of the lens member and an inner surface of the convex portion.

### Claim 7 (depends on 6)

The light receiving and emitting element module according to claim 6, wherein the convex portion is surrounding the support portion of the lens member.

### Claim 8 (depends on 1)

The light receiving and emitting element module according to claim 1,
wherein the wiring substrate is rectangular in a plan view thereof, and
the plurality of hole portions are disposed on a diagonal line of the wiring substrate, and the light emitting element and the light receiving element are disposed in between the plurality of hole portions.

### Claim 9 (depends on 8)

The light receiving and emitting element module according to claim 8,
wherein the second columns are fixed via an adhesive on inner surfaces of the hole portions.

### Claim 10 (depends on 1)

A sensor device, comprising:
the light receiving and emitting element module according to claim 1; and
a control circuit electrically connected to the light receiving and emitting element module and configured to control the light receiving and emitting element module,
the sensor device irradiating light from the light emitting element to an object and detecting a property of the object according to an output value from the light receiving element which is outputted according to reflected light from the object.
