# US 10,373,987 B2 · Array substrate and method of mounting integrated circuit using the same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,373,987 B2 - Document ID: US10373987B2 - Status: Granted - Kind: B2 - Application number: 15/901,846 - Filed: 2018-02-21 - Published: 2018-06-28 - Granted: 2019-08-06 - Earliest claimed: 2014-06-17 - Assignees: Samsung Display Co., Ltd. - Applicants: Samsung Display Co., Ltd. - Inventors: Dae Geun Lee - Web page: https://patentgrep.com/patent/US10373987B2 ## CPC - H10D 86/60: wherein the TFTs are in active matrices - G02F 1/13458: {Terminal pads} - H05K 1/111: {Pads for surface mounting, e.g. lay-out} - H10D 86/441: {Interconnections, e.g. scanning lines} - H05K 1/189: characterised by the use of flexible or folded printed circuits - H05K 2201/09381: Shape of non-curved single flat metallic pad, land or exposed part thereof; Shape of electrode of leadless component - H05K 2201/09418: Special orientation of pads, lands or terminals of component, e.g. radial or polygonal orientation - H05K 2201/09427: Special relation between the location or dimension of a pad or land and the location or dimension of a terminal - H05K 2201/09709: Staggered pads, lands or terminals; Parallel conductors in different planes - H05K 2201/09954: More mounting possibilities, e.g. on same place of PCB, or by using different sets of edge pads - H05K 2201/10128: Display - H05K 2203/166: Alignment or registration; Control of registration - H10K 59/131: Interconnections, e.g. wiring lines or terminals - H10W 72/07223: {Active alignment, e.g. using optical alignment using marks or sensors} - H10W 72/932: {Plan-view shape, i.e. in top view} - H10W 72/9445: {Top-view layouts, e.g. mirror arrays} - Y02E 10/549: Organic PV cells - Y02P 70/50: Manufacturing or production processes characterised by the final manufactured product - Y10T 29/49005: Acoustic transducer - H10D: INORGANIC ELECTRIC SEMICONDUCTOR DEVICES - G02F: OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H10K: ORGANIC ELECTRIC SOLID-STATE DEVICES - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - Y02E: REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION - Y02P: CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS - Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ## Abstract An electronic device, including an array substrate, a pad portion disposed on the array substrate, and an integrated circuit disposed on the pad portion and comprising a bump portion. The pad portion includes a first sub-pad unit including a first pad having an inclined shape and a second sub-pad unit including a second pad having an inclined shape. The first pad and the second pad are symmetrically arranged with respect to an imaginary line that divides the pad portion. The pad portion is electrically connected with the bump portion. ## Claims ### Claim 1 An electronic device, comprising: an array substrate; a pad portion disposed on the array substrate; and an integrated circuit disposed on the pad portion and comprising a bump portion; wherein: the pad portion comprises a first sub-pad unit comprising a first pad having an inclined shape and a second sub-pad unit comprising a second pad having an inclined shape; the first pad and the second pad are inclined in different directions symmetrically about an imaginary line that divides the pad portion; and the pad portion is electrically connected with the bump portion; the bump portion comprises a first sub-bump unit comprising a first bump having an inclined shape and a second sub-bump unit comprising a second bump having an inclined shape; the first bump and the second bump are inclined in different directions symmetrically about the imaginary line that divides the pad portion; and the first bump has a same inclination angle as the first pad; and the second bump has a same inclination angle as the second pad. ### Claim 2 (depends on 1) The electronic device of claim 1, wherein at least one of the first pad and the second pad has a parallelogram shape. ### Claim 3 (depends on 1) The electronic device of claim 1, wherein a shape of the first bump corresponds to a shape of the first pad, and a shape of the second bump corresponds to a shape of the second pad. ### Claim 4 (depends on 1) The electronic device of claim 1, wherein the first pad is electrically connected with the first bump and the second pad is electrically connected with the second bump. ### Claim 5 (depends on 1) The electronic device of claim 1, wherein an area of the first pad is greater than an area of the first bump. ### Claim 6 (depends on 1) The electronic device of claim 1, wherein: the first bump comprises a first region and a second region; and the first region overlaps the first pad and the second region does not overlap the first pad. ### Claim 7 An electronic device, comprising: an array substrate; a pad portion disposed on the array substrate; and an integrated circuit disposed on the pad portion and comprising a bump portion; wherein: the pad portion comprises a first sub-pad unit comprising a first pad having an inclined shape and a second sub-pad unit comprising a second pad having an inclined shape; the first pad and the second pad are inclined in different directions symmetrically about an imaginary line that divides the pad portion; the pad portion is electrically connected with the bump portion; the bump portion comprises a first sub-bump unit comprising a first bump having an inclined shape and a second sub-bump unit comprising a second bump having an inclined shape; the first bump and the second bump are inclined in different directions symmetrically about the imaginary line that divides the pad portion; and the first bump completely overlaps the first pad. ### Claim 8 (depends on 1) The electronic device of claim 1, wherein at least one of the first pad and the second pad has a quadrangle shape. ### Claim 9 (depends on 2) The electronic device of claim 2, wherein the pad portion further comprises: a third sub-pad unit comprising a third pad having a rectangular shape and disposed between the first sub-pad unit and the second sub-pad unit. ### Claim 10 (depends on 9) The electronic device of claim 9, wherein the bump portion further comprises a third sub-bump unit comprising a third bump having a rectangular shape and disposed between the first sub-bump unit and the second sub-bump unit.