# US 10,373,941 B2 · Package-on-package structures and methods for forming the same

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- Number: US 10,373,941 B2
- Document ID: US10373941B2
- Status: Granted
- Kind: B2
- Application number: 15/912,807
- Filed: 2018-03-06
- Published: 2018-07-12
- Granted: 2019-08-06
- Earliest claimed: 2013-03-14
- Assignees: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicants: Taiwan Semiconductor Manufacturing Company, Ltd.
- Inventors: Kuei-Wei Huang; Chih-Wei Lin; Hsiu-Jen Lin; Wei-Hung Lin; Ming-Da Cheng; Chung-Shi Liu
- Web page: https://patentgrep.com/patent/US10373941B2

## CPC

- H10W 90/00: Package configurations
- H10W 70/098: {Applying pastes or inks, e.g. screen printing (H10W70/095 takes precedence)}
- H10W 70/099: {Connecting interconnections to insulating or insulated package substrates, interposers or redistribution layers}
- H10W 70/635: {Through-vias}
- H10W 70/685: comprising multiple insulating layers
- H10W 70/69: Insulating materials thereof
- H10W 74/016: {using moulds}
- H10W 90/701: {characterised by the relative positions of pads or connectors relative to package parts}
- H10W 70/60: Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40)
- H10W 70/698: Semiconductor materials that are electrically insulating, e.g. undoped silicon
- H10W 72/07211: {Treating the bond pad before connecting, e.g. by applying flux or cleaning}
- H10W 72/07234: {Using a reflow oven}
- H10W 72/551: {Materials of bond wires}
- H10W 72/884: {Die-attach connectors and bond wires}
- H10W 74/00: Encapsulations, e.g. protective coatings
- H10W 74/142: {the encapsulations exposing the passive side of the semiconductor body}
- H10W 90/722: {between stacked chips}
- H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 90/754: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A package includes a package component, which further includes a top surface and a metal pad at the top surface of the package component. The package further includes a non-reflowable electrical connector over and bonded to the metal pad, and a molding material over the package component. The non-reflowable electrical connector is molded in the molding material and in contact with the molding material. The non-reflowable electrical connector has a top surface lower than a top surface of the molding compound.

## Claims

### Claim 1

A package comprising:
a bottom package comprising:
a first package component comprising:
a top surface; and
a conductive pad at the top surface;
an electrical connector over and contacting the conductive pad, wherein a top surface of the electrical connector comprises a rounded portion, with a center portion of the rounded portion being lower than surrounding portions of the rounded portion; and
an encapsulating material over the first package component.

### Claim 2 (depends on 1)

The package of claim 1, wherein the electrical connector has a rounded bottom surface, with the rounded bottom surface having a shape of a part of a ball.

### Claim 3 (depends on 2)

The package of claim 2 further comprising a solder paste contacting both the rounded bottom surface of the electrical connector and a top surface of the conductive pad.

### Claim 4 (depends on 1)

The package of claim 1 further comprising:
a top package over the bottom package; and
a solder region bonding the electrical connector to the top package, wherein the solder region contacts the rounded portion of the top surface of the electrical connector.

### Claim 5 (depends on 4)

The package of claim 4, wherein the electrical connector is formed of a non-solder conductive material.

### Claim 6 (depends on 4)

The package of claim 4, wherein the encapsulating material comprises a top surface, and the solder region extends to a level lower than the top surface of the encapsulating material.

### Claim 7 (depends on 1)

The package of claim 1 further comprising a device die bonded to the top surface of the first package component, wherein the device die is in the encapsulating material.

### Claim 8 (depends on 1)

The package of claim 1, wherein the center portion of the rounded portion is a lowest portion of the top surface of the electrical connector.

### Claim 9

A package comprising:
a bottom package comprising:
a package component comprising:
a first conductive feature at a top surface of the package component; and
a second conductive feature at a bottom surface of the package component, wherein the first conductive feature is electrically coupled to the second conductive feature;
a partial metal ball having a rounded bottom surface in contact with a top surface of the first conductive feature, and the partial metal ball has a top surface recessing toward a center of the partial metal ball;
a die over and bonded to the package component;
a top package over the bottom package; and
a solder region bonding the partial metal ball to the top package.

### Claim 10 (depends on 9)

The package of claim 9, wherein the partial metal ball has a non-planar top surface.

### Claim 11 (depends on 10)

The package of claim 10, wherein the top surface of the partial metal ball comprises a rounded portion, with a lowest point of the rounded portion being close to a center of the top surface of the partial metal ball.

### Claim 12 (depends on 9)

The package of claim 9, wherein the rounded bottom surface of the partial metal ball has a spherical shape.

### Claim 13 (depends on 9)

The package of claim 9 further comprising an encapsulating material over the package component, with the die encapsulated by the encapsulating material, wherein at least a part of the partial metal ball is lower than a top surface of the encapsulating material.

### Claim 14 (depends on 9)

The package of claim 9 further comprising a solder paste in physical contact with both the rounded bottom surface of the partial metal ball and the top surface of the first conductive feature.

### Claim 15 (depends on 9)

The package of claim 9, wherein the partial metal ball comprises copper.

### Claim 16

A package comprising:
a bottom package comprising:
a package component comprising:
a top surface; and
a metal pad at the top surface of the package component;
a partial metal ball over and electrically coupling to the metal pad; and
a die over and bonded to the package component; and
a solder region over and joined to the partial metal ball.

### Claim 17 (depends on 16)

The package of claim 16 further comprising an encapsulating material encapsulating the partial metal ball therein, wherein a center portion of a top surface of the partial metal ball is lower than a top surface of the encapsulating material.

### Claim 18 (depends on 17)

The package of claim 17, wherein an entirety of the top surface of the partial metal ball is lower than the top surface of the encapsulating material.

### Claim 19 (depends on 16)

The package of claim 16 further comprising a solder paste in contact with a rounded bottom surface of the partial metal ball and a top surface of the metal pad.

### Claim 20 (depends on 16)

The package of claim 16, wherein the partial metal ball has a rounded bottom surface, with a bottom tip of the rounded bottom surface contacting a top surface of the metal pad.