# US 10,373,930 B2 · Package structure and the method to fabricate thereof > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,373,930 B2 - Document ID: US10373930B2 - Status: Granted - Kind: B2 - Application number: 13/571,378 - Filed: 2012-08-10 - Published: 2014-02-13 - Granted: 2019-08-06 - Earliest claimed: 2012-08-10 - Assignees: Cyntec Co., Ltd. - Applicants: Jeng-Jen Li; Bau-Ru Lu - Inventors: Jeng-Jen Li; Bau-Ru Lu - Web page: https://patentgrep.com/patent/US10373930B2 ## CPC - H10W 90/00: Package configurations - H10W 70/09: extending onto an encapsulation that laterally surrounds the chip or wafer, e.g. fan-out wafer level package [FOWLP] RDLs - H10W 70/099: {Connecting interconnections to insulating or insulated package substrates, interposers or redistribution layers} - H10W 70/60: Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40) - H10W 70/614: {the multiple chips being integrally enclosed} - H10W 70/68: Shapes or dispositions thereof - H10W 70/6528: {of the portions that connect to chips, wafers or package parts} - H10W 72/29: Bond pads specially adapted therefor - H10W 72/9413: {on encapsulations} - H10W 90/701: {characterised by the relative positions of pads or connectors relative to package parts} - H10W 90/722: {between stacked chips} - H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract The invention discloses a package structure with at least one portion of a first conductive element disposed in a through-opening of a first substrate. A conductive structure is disposed on the first substrate and the first conductive element, wherein the conductive structure is electrically connected to the first substrate and said at least one first I/O terminal of the first conductive element. The conductive structure comprises at least one of a second conductive element, a second substrate or a conductive pattern. ## Claims ### Claim 1 A package structure, comprising: a first lead frame, having a top surface and a bottom surface and comprising a through-opening therein, wherein the through-opening is exposed from the top surface and the bottom surface of the first lead frame; a first electronic device, having at least one first I/O terminal on a top surface of the first electronic device, wherein at least one portion of the first electronic device is disposed in the through-opening of the first lead frame, wherein an insulating layer is disposed on the top surface of the first electronic device and the top surface of the first lead frame and extended into spaces between the first lead frame and the first electronic device in the through-opening; a conductive layer disposed on the insulating layer; and a second electronic device disposed above the top surface of the first lead frame and the top surface of the first electronic device, wherein the second electronic device is electrically connected to the first electronic device through the conductive layer, wherein a conductive pattern of the conductive layer electrically connects the first I/O terminal of the first electronic device to the top surface of the first lead frame through a via that is disposed in the insulating layer and located over the top surface of the first lead frame. ### Claim 2 (depends on 1) The package structure according to claim 1, wherein the first lead frame is not supported by a second substrate thereunder. ### Claim 3 (depends on 1) The package structure according to claim 1, further comprising a plurality of pads disposed underlying the first lead frame for electrically connecting with an external circuit. ### Claim 4 (depends on 1) The package structure according to claim 1, wherein the first lead frame further comprises a recess therein, further comprising a third electronic device having at least one third I/O terminal, wherein at least one portion of the third electronic device is disposed in the recess of the first lead frame, wherein the conductive pattern is electrically connected to said at least one third I/O terminal of the third electronic device. ### Claim 5 (depends on 1) The package structure according to claim 1, further comprising a heat-dissipating material disposed on the bottom of the first electronic device. ### Claim 6 (depends on 1) The package structure according to claim 1, wherein the top surface of the insulating layer is substantially at a same horizontal level, wherein the via extends from said horizontal level to the top surface of the first lead frame. ### Claim 7 A connecting structure for connecting to an electronic device having a terminal, comprising: a pad disposed on the terminal of the electronic device; and a first metallic material permeating across the entire interface between the pad and the terminal of the electronic device, wherein the first metallic material is electrically connected to the terminal of the electronic device and encapsulates at least one portion of the pad. ### Claim 8 (depends on 7) The connecting structure according to claim 7, further comprising a metallic oxide in the interface between the pad and the terminal of the electronic device, wherein the first metallic material encapsulates at least one portion of the metallic oxide. ### Claim 9 (depends on 7) The connecting structure according to claim 7, wherein the shape of the first metallic material is spherical, elliptic, tear-shaped or irregular. ### Claim 10 (depends on 7) The connecting structure according to claim 7, further comprising: an insulating material disposed on the electronic device, wherein the insulating layer has a through-hole therein, and the pad is disposed on the bottom of the through-hole; and a second metallic material disposed on the insulating material extending to the through-hole. ### Claim 11 (depends on 7) The connecting structure according to claim 7, wherein the pad is made of Al and the electronic device is a bare die. ### Claim 12 A method for forming a connecting structure for connecting to an electronic device having a terminal, comprising the steps of: disposing a pad on the terminal of the electronic device; and permeating a first metallic material across the entire interface between the pad and the terminal of the electronic device, wherein the first metallic material is electrically connected to the terminal of the electronic device and encapsulates at least one portion of the pad.