# US 10,373,927 B2 · Connection body and method of manufacturing connection body

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- Number: US 10,373,927 B2
- Document ID: US10373927B2
- Status: Granted
- Kind: B2
- Application number: 15/324,759
- Filed: 2015-07-22
- Published: 2017-07-20
- Granted: 2019-08-06
- Earliest claimed: 2014-07-22
- Assignees: Dexerials Corporation
- Applicants: Dexerials Corporation
- Inventors: Reiji Tsukao
- Web page: https://patentgrep.com/patent/US10373927B2

## CPC

- H05K 3/323: {by applying an anisotropic conductive adhesive layer over an array of pads}
- H10W 70/65: Shapes or dispositions of interconnections
- H10W 72/20: Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
- H10W 90/701: {characterised by the relative positions of pads or connectors relative to package parts}
- G02F 1/13458: {Terminal pads}
- G02F 2202/28: Adhesive materials or arrangements
- H01R 4/04: using electrically conductive adhesives
- H01R 12/7076: {for connection between PCB and component, e.g. display}
- H01R 13/2414: {conductive elastomers}
- H05K 1/111: {Pads for surface mounting, e.g. lay-out}
- H05K 2201/0269: Non-uniform distribution or concentration of particles
- H05K 2201/09409: Multiple rows of pads, lands, terminals or dummy patterns; Multiple rows of mounted components
- H10P 74/207: {Electrical properties, e.g. testing or measuring of resistance, deep levels or capacitance-voltage characteristics}
- H10W 72/07141: {Means for applying energy, e.g. ovens or lasers}
- H10W 72/07178: {Means for aligning}
- H10W 72/07183: {Means for monitoring}
- H10W 72/072: {of bump connectors}
- H10W 72/07223: {Active alignment, e.g. using optical alignment using marks or sensors}
- H10W 72/07227: {involving guiding structures, e.g. spacers or supporting members}
- H10W 72/07232: {Compression bonding, e.g. thermocompression bonding}
- H10W 72/07252: {changes in structures or sizes}
- H10W 72/073: {of die-attach connectors}
- H10W 72/07323: {Active alignment, e.g. using optical alignment using marks or sensors}
- H10W 72/07332: {Compression bonding, e.g. thermocompression bonding}
- H10W 72/074: {of anisotropic conductive adhesives}
- H10W 72/221: {Structures or relative sizes}
- H10W 72/227: {Multiple bumps having different sizes}
- H10W 72/232: {Plan-view shape, i.e. in top view}
- H10W 72/234: {Cross-sectional shape, i.e. in side view}
- H10W 72/241: {Dispositions, e.g. layouts}
- H10W 72/248: {Top-view layouts, e.g. mirror arrays}
- H10W 72/252: {comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu}
- H10W 72/261: {Functions other than electrical connecting}
- H10W 72/325: {Die-attach connectors having a filler embedded in a matrix}
- H10W 72/351: {Materials of die-attach connectors}
- H10W 72/352: {comprising metals or metalloids, e.g. solders}
- H10W 72/354: {comprising polymers}
- H10W 74/15: on active surfaces of flip-chip devices, e.g. underfills
- H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 99/00: Subject matter not provided for in other groups of this subclass
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- G02F: OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- H01R: ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10

## Abstract

A connection body includes a circuit board terminals arranged into terminal rows, the terminals rows being arranged in parallel to one another in a widthwise direction orthogonal to a direction in which the terminals are arranged, and an electronic component including bumps arranged into bump rows corresponding to the terminal rows, the bumps being arranged in parallel to one another in a widthwise direction orthogonal to a direction in which the bumps are arranged. The electronic component is connected upon the circuit board interposed by an anisotropic conductive adhesive including electrically conductive particles arranged therein. A distance between mutually opposing terminals of the terminals and bumps of the bumps arranged toward the outer sides of the circuit board and the electronic component is greater than a distance between mutually opposing terminals of the terminals and bumps of the bumps arranged toward their inner sides.

## Claims

### Claim 1

A connection body comprising:
a circuit board comprising a plurality of terminals arranged into a plurality of terminal rows, the plurality of terminal rows being arranged in parallel to one another in a widthwise direction orthogonal to a direction in which the plurality of terminals are arranged; and
an electronic component comprising a plurality of bumps arranged into a plurality of bump rows corresponding to the plurality of terminal rows, the plurality of bump rows being arranged in parallel to one another in a widthwise direction orthogonal to a direction in which the plurality of bumps are arranged,
wherein
the electronic component is connected upon the circuit board interposed by an anisotropic conductive adhesive comprising electrically conductive particles arranged therein,
a distance between mutually opposing terminals of the plurality of terminals and bumps of the plurality of bumps arranged toward outer sides of the circuit board and the electronic component is greater than a distance between mutually opposing terminals of the plurality of terminals and bumps of the plurality of bumps arranged toward inner sides of the circuit board and the electronic component, and
a ratio D (=Do/Di) of a distance Do between mutually opposing the terminals and the bumps arranged toward the outer sides of the circuit board and the electronic component to a distance Di between mutually opposing the terminals and the bumps arranged toward the inner sides of the circuit board and the electronic component is within 130% of a ratio d (=do/di), at both ends of the plurality of bumps on the electronic component in a direction in which the plurality of bumps are arranged, of an average distance do between mutually opposing terminals of the plurality of terminals and bumps of the plurality of bumps arranged toward the outer sides of the circuit board and the electronic component and an average distance di between mutually opposing terminals of the plurality of terminals and bumps of the plurality of bumps arranged toward the inner sides of the circuit board and the electronic component.

### Claim 2 (depends on 1)

The connection body according to claim 1, wherein the ratio D at the center portion of the plurality of bump rows on the electronic component is within 130% of the ratio d.

### Claim 3 (depends on 1)

The connection body according to claim 1, the connection body being manufactured by using the anisotropic conductive adhesive comprising the electrically conductive particles arranged therein.

### Claim 4 (depends on 1)

The connection body according to claim 1, wherein an average diameter of the electrically conductive particles is 5 μm or less.

### Claim 5 (depends on 1)

The connection body according to claim 1, wherein, the plurality of bumps comprise concave and convex portions formed on bump surfaces that capture the electrically conductive particles, the concave and convex portions have a difference in elevation within 50% of a particle diameter of the electrically conductive particles.

### Claim 6 (depends on 1)

The connection body according to claim 1, wherein the distance between mutually opposing the terminals and the bumps arranged toward the outer sides of the circuit board and the electronic component is within 130% of the distance between mutually opposing the terminals and the bumps arranged toward the inner sides of the circuit board and the electronic component.

### Claim 7 (depends on 6)

The connection body according to claim 6, wherein, at a center portion of the plurality of bump rows on the electronic component, a distance between mutually opposing terminals of the plurality of terminals and bumps of the plurality of bumps arranged toward the outer sides of the circuit board and the electronic component is within 130% of a distance between mutually opposing terminals of the plurality of terminals and bumps of the plurality of bumps arranged toward the inner sides of the circuit board and the electronic component.

### Claim 8

A connection body comprising:
a circuit board comprising a plurality of terminals arranged into a plurality of terminal rows, the plurality of terminal rows being arranged in parallel to one another in a widthwise direction orthogonal to a direction in which the plurality of terminals are arranged; and
an electronic component comprising a plurality of bumps arranged into a plurality of bump rows corresponding to the plurality of terminal rows, the plurality of bump rows being arranged in parallel to one another in a widthwise direction orthogonal to a direction in which the plurality of bumps are arranged,
wherein
the electronic component is connected upon the circuit board interposed by an anisotropic conductive adhesive comprising electrically conductive particles arranged therein,
a distance between mutually opposing terminals of the plurality of terminals and bumps of the plurality of bumps arranged toward outer sides of the circuit board and the electronic component is greater than a distance between mutually opposing terminals of the plurality of terminals and bumps of the plurality of bumps arranged toward inner sides of the circuit board and the electronic component, and
the circuit board comprises:
a first terminal region comprising a terminal row of the plurality of terminal rows formed in the first terminal region; and
a second terminal region comprising a plurality of terminal rows of the plurality of terminal rows arranged in parallel to one another in a widthwise direction;
the electronic component comprises
a first bump region comprising a bump row of the plurality of bump rows formed in the first bump region; and
a second bump region comprising a plurality of bump rows of the plurality of the bump rows arranged in parallel to one another in a widthwise direction; and
a distance Do between mutually opposing terminals of the plurality of terminals and bumps of the plurality of bumps arranged toward outer sides in the second terminal region and the second bump region of the circuit board and the electronic component is within 110% of an average distance dAVE of a distance between mutually opposing terminals of the plurality of terminals and bumps of the plurality of bumps at both end portions of a terminal row of the plurality of terminal rows and a bump row of the plurality of bump rows arranged toward outer sides in the second terminal region and the second bump region of the circuit board and the electronic component, and a distance between mutually opposing terminals of the plurality of terminals and bumps of the plurality of bumps at both end portions of the terminal row and the bump row in the first terminal region and the first bump region of the circuit board and the electronic component.

### Claim 9 (depends on 8)

The connection body according to claim 8, wherein upon a plurality of terminal rows being arranged in parallel to one another in the first terminal region in a widthwise direction orthogonal to a direction in which the plurality of terminals are arranged and a plurality of bump rows being arranged in parallel to one another in the first bump region in a widthwise direction orthogonal to a direction in which the plurality of bumps are arranged, the terminal row and the bump row in the first terminal region and the first bump region are a terminal row of the plurality of terminal rows and a bump rows of the plurality of bump rows arranged toward outer sides in the first terminal region and the first bump region.

### Claim 10 (depends on 8)

The connection body according to claim 8, wherein the distance Do at the center portion of the plurality of bump rows on the electronic component is within 110% of the average distance dAVE.

### Claim 11 (depends on 8)

The connection body according to claim 8, wherein, the plurality of bumps comprise concave and convex portions formed on bump surfaces that capture the electrically conductive particles, the concave and convex portions have a difference in elevation within 50% of a particle diameter of the electrically conductive particles.

### Claim 12

A connection body comprising:
a circuit board comprising a plurality of terminals arranged into a plurality of terminal rows, the plurality of terminal rows being arranged in parallel to one another in a widthwise direction orthogonal to a direction in which the plurality of terminals are arranged; and
an electronic component comprising a plurality of bumps arranged into a plurality of bump rows corresponding to the plurality of terminal rows, the plurality of bump rows being arranged in parallel to one another in a widthwise direction orthogonal to a direction in which the plurality of bumps are arranged,
wherein
the electronic component is connected upon the circuit board interposed by an anisotropic conductive adhesive comprising electrically conductive particles arranged therein,
a distance between mutually opposing terminals of the plurality of terminals and bumps of the plurality of bumps arranged toward outer sides of the circuit board and the electronic component is greater than a distance between mutually opposing terminals of the plurality of terminals and bumps of the plurality of bumps arranged toward inner sides of the circuit board and the electronic component, and
the plurality of bumps comprise concave and convex portions formed on bump surfaces that capture the electrically conductive particles, the concave and convex portions have a difference in elevation within 50% of a particle diameter of the electrically conductive particles.

### Claim 13

A method of manufacturing a connection body, the connection body comprising:
a circuit board comprising a plurality of terminals arranged into a plurality of terminal rows, the plurality of terminal rows being arranged in parallel to one another in a widthwise direction; and
an electronic component comprising a plurality of bumps arranged into a plurality of bump rows corresponding to the plurality of terminal rows, the plurality of bump rows arranged in parallel to one another in a widthwise direction, the method comprising the steps of;
mounting the electrical component onto the circuit board interposed by an anisotropic conductive adhesive comprising electrically conductive particles arranged therein; and
pressing the electrical component while hardening the anisotropic conductive adhesive,
wherein
a distance between mutually opposing terminals of the plurality of terminals and bumps of the plurality of bumps arranged toward outer sides of the circuit board and the electronic component is greater than a distance between mutually opposing terminals of the plurality of terminals and bumps of the plurality of bumps arranged toward inner sides of the circuit board and the electronic component and
a ratio D (=Do/Di) of a distance Do between mutually opposing the terminals and the bumps arranged toward the outer sides of the circuit board and the electronic component to a distance Di between mutually opposing the terminals and the bumps arranged toward the inner sides of the circuit board and the electronic component is within 130% of a ratio d (=do/di), at both ends of the plurality of bumps on the electronic component in a direction in which the plurality of bumps are arranged, of an average distance do between mutually opposing terminals of the plurality of terminals and bumps of the plurality of bumps arranged toward the outer sides of the circuit board and the electronic component and an average distance di between mutually opposing terminals of the plurality of terminals and bumps of the plurality of bumps arranged toward the inner sides of the circuit board and the electronic component.

### Claim 14 (depends on 13)

The method of manufacturing a connection body according to claim 13, wherein the anisotropic conductive adhesive comprises:
an electrically conductive particle containing layer containing the electrically conductive particles; and
an electrically insulating adhesive layer not containing the electrically conductive particles,
a viscosity of the electrically conductive particle containing layer is greater than a viscosity of the electrically insulating adhesive layer.