# US 10,373,926 B2 · Anisotropic conductive film, method for producing anisotropic conductive film, method for producing connection body, and connection method

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- Number: US 10,373,926 B2
- Document ID: US10373926B2
- Status: Granted
- Kind: B2
- Application number: 15/926,210
- Filed: 2018-03-20
- Published: 2018-08-02
- Granted: 2019-08-06
- Earliest claimed: 2012-09-18
- Assignees: Dexerials Corporation
- Applicants: Dexerials Corporation
- Inventors: Kouichi Sato; Yasushi Akutsu
- Web page: https://patentgrep.com/patent/US10373926B2

## CPC

- C09J 7/10: without carriers
- B29C 59/02: by mechanical means, e.g. pressing {(B29C59/007 takes precedence; embossing expanded porous articles B29C44/5627)}
- B29C 71/04: by wave energy or particle radiation {, e.g. for curing or vulcanising preformed articles (during moulding, e.g. in a mould B29C35/08)}
- B32B 3/08: characterised by added members at particular parts {(layer formed of separate pieces of material which are juxtaposed side-by-side B32B3/14, B32B3/18)}
- B32B 3/30: characterised by a layer formed with recesses or projections, e.g. {hollows, grooves, protuberances, ribs (apertured layer B32B3/266; layer with cavities or internal voids B32B3/26)}
- B32B 7/12: using interposed adhesives or interposed materials with bonding properties
- B32B 27/08: of synthetic resin
- B32B 27/20: using fillers, pigments, thixotroping agents
- B32B 27/308: {comprising acrylic (co)polymers}
- B32B 27/36: comprising polyesters
- B32B 27/38: comprising epoxy resins
- B32B 33/00: Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
- C09J 9/02: Electrically-conducting adhesives
- G02F 1/13452: {Conductors connecting driver circuitry and terminals of panels}
- G02F 1/13454: {Drivers integrated on the active matrix substrate (G02F1/136277 takes precedence)}
- H10W 72/30: Die-attach connectors
- B29C 2035/0827: {using UV radiation}
- B29C 2059/028: {Incorporating particles by impact in the surface, e.g. using fluid jets or explosive forces to implant particles}
- B29K 2063/00: Use of {EP, i.e.} epoxy resins {or derivatives thereof}, as moulding material
- B29L 2009/003: {comprising a metal layer}
- B29L 2031/34: Electrical apparatus, e.g. sparking plugs or parts thereof
- B32B 2255/205: Metallic coating
- B32B 2264/102: Oxide or hydroxide
- B32B 2264/104: Oxysalt, e.g. carbonate, sulfate, phosphate or nitrate particles
- B32B 2270/00: Resin or rubber layer containing a blend of at least two different polymers
- B32B 2307/202: Conductive
- B32B 2307/412: Transparent
- B32B 2307/706: Anisotropic
- B32B 2457/00: Electrical equipment
- B32B 2457/202: LCD, i.e. liquid crystal displays
- C08K 3/08: Metals
- C08K 2201/001: Conductive additives
- C09J 2203/326: for bonding electronic components such as wafers, chips or semiconductors
- C09J 2301/208: the adhesive layer being constituted by at least two or more adjacent or superposed adhesive layers, e.g. multilayer adhesive
- C09J 2301/314: the adhesive layer and/or the carrier being conductive
- C09J 2301/408: additives as essential feature of the adhesive layer
- H10W 72/013: {of die-attach connectors}
- H10W 72/01304: {using temporary auxiliary members, e.g. using sacrificial coatings or handle substrates}
- H10W 72/01315: {Forming coatings}
- H10W 72/01325: {in solid form}
- H10W 72/01351: {Changing the shapes of die-attach connectors}
- H10W 72/07141: {Means for applying energy, e.g. ovens or lasers}
- H10W 72/072: {of bump connectors}
- H10W 72/073: {of die-attach connectors}
- H10W 72/07331: {Connecting techniques}
- H10W 72/07332: {Compression bonding, e.g. thermocompression bonding}
- H10W 72/07338: {hardening the adhesive by curing, e.g. thermosetting}
- H10W 72/074: {of anisotropic conductive adhesives}
- H10W 72/252: {comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu}
- H10W 72/261: {Functions other than electrical connecting}
- H10W 72/321: {Structures or relative sizes of die-attach connectors}
- H10W 72/322: {Multilayered die-attach connectors, e.g. a coating on a top surface of a core}
- H10W 72/325: {Die-attach connectors having a filler embedded in a matrix}
- H10W 72/351: {Materials of die-attach connectors}
- H10W 72/352: {comprising metals or metalloids, e.g. solders}
- H10W 72/353: {not comprising solid metals or solid metalloids, e.g. ceramics}
- H10W 72/354: {comprising polymers}
- H10W 72/953: {not comprising solid metals or solid metalloids, e.g. polymers, ceramics or liquids}
- H10W 74/15: on active surfaces of flip-chip devices, e.g. underfills
- H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL}
- Y10T 156/1039: Surface deformation only of sandwich or lamina [e.g., embossed panels]
- Y10T 428/24562: Interlaminar spaces
- C09J: ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES (preparation of glue or gelatine C09H)
- B29C: SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING (making preforms B29B11/00; making laminated products by combining previously unconnected layers which become one product whose layers will remain together B32B37/00 - B32B41/00)
- B32B: LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- G02F: OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- B29K: INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR {MOULDS, } REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29L: INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- C08K: Use of inorganic or non-macromolecular organic substances as compounding ingredients (paints, inks, varnishes, dyes, polishes, adhesives C09)
- Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

## Abstract

To reduce substrate warp occurring after connection an anisotropic conductive film is used. An anisotropic conductive film has: a first insulating adhesive layer; a second insulating adhesive layer; and a conductive particle-containing layer sandwiched by the first insulating adhesive layer and the second insulating adhesive layer and having conductive particles contained in an insulating adhesive, wherein air bubbles are contained between the conductive particle-containing layer and the first insulating adhesive layer, and, the conductive particle-containing layer, a portion thereof below the conductive particles and in contact with the second insulating adhesive layer has a lower degree of cure than other portions thereof.

## Claims

### Claim 1

A method for producing a connection body, the connection body being obtained by anisotropic conductive connection between a terminal of a first electronic component and a terminal of a second electronic component by using an anisotropic conductive film, the anisotropic conductive film comprising:
a first insulating adhesive layer; and
a conductive particle-containing layer laminated on the first insulating adhesive layer and having conductive particles each contained independently in an insulating adhesive;
wherein air bubbles are contained between the conductive particle-containing layer and the first insulating adhesive layer, and
wherein the air bubbles are contained in accordance with the conductive particles, the method comprising curing the anisotropic conductive film in a sandwiched state of sandwiching the anisotropic conductive film between the first electronic component and the second electronic component.

### Claim 2

A connection body obtained by anisotropic conductive connection between a first electronic component and a second electronic component by using an anisotropic conductive film, the anisotropic conductive film comprising:
a first insulating adhesive layer; and
a conductive particle-containing layer laminated on the first insulating adhesive layer and having conductive particles each contained independently in an insulating adhesive;
wherein air bubbles are contained between the conductive particle-containing layer and the first insulating adhesive layer, and
wherein the air bubbles are contained in accordance with the conductive particles.

### Claim 3 (depends on 2)

The connection body according to claim 2, wherein, the conductive particle-containing layer has the conductive particles regularly arranged in a single layer.

### Claim 4 (depends on 2)

The connection body according to claim 2, wherein a part of the conductive particles is exposed at an interface surface between the conductive particle-containing layer and the first insulating adhesive layer.

### Claim 5 (depends on 2)

The connection body according to claim 2, wherein the conductive particle-containing layer is a photo-curable adhesive layer.

### Claim 6 (depends on 2)

The connection body according to claim 2, wherein the air bubbles have a size of less than 5 μm.

### Claim 7 (depends on 2)

The connection body according to claim 2, wherein, in the conductive particle-containing layer, a portion containing the conductive particle has a larger thickness than a portion between the conductive particles.

### Claim 8 (depends on 2)

The connection body according to claim 2, further comprising a second insulating layer,
wherein the conductive particles are sandwiched between the first insulating adhesive layer and the second insulating adhesive layer.

### Claim 9 (depends on 8)

The connection body according to claim 8, wherein the curing system of the first and second insulating adhesive layers is one of a cationic curing system, an anionic curing system and a radical curing system.

### Claim 10 (depends on 8)

The connection body according to claim 8, wherein a liquid composition is provided in any one of a portion between the first insulating adhesive layer and the conductive particle and a portion between the second insulating adhesive layer and the conductive particle.

### Claim 11 (depends on 10)

The connection body according to claim 10, wherein the liquid composition is contained in the air bubbles.

### Claim 12 (depends on 2)

The connection body according to claim 2, wherein, in the conductive particle-containing layer, a portion thereof below the conductive particles has a lower degree of cure than other portions thereof.

### Claim 13 (depends on 2)

The connection body according to claim 2, wherein the conductive particles are regularly arranged as viewed from a planar perspective, and the air bubbles are regularly contained in accordance with the conductive particles.

### Claim 14 (depends on 2)

The connection body according to claim 2, wherein the conductive particles and the air bubbles are present on one surface.

### Claim 15 (depends on 13)

The connection body according to claim 13, wherein the conductive particles are regularly arranged in a single layer and the air bubbles are present in an intermediate region between adjacent conductive particles.

### Claim 16 (depends on 13)

The connection body according to claim 13, wherein the conductive particle-containing layer has the conductive particles regularly arranged in a single layer and the air bubbles are present in a vicinity of adjacent conductive particles.

### Claim 17 (depends on 2)

The connection body according to claim 2, wherein the air bubbles include air bubbles having a maximum length of less than 1 μm.

### Claim 18 (depends on 17)

The connection body according to claim 17, wherein the air bubbles form a group.

### Claim 19 (depends on 1)

A display apparatus comprising a connection body in which a substrate and an electronic component are connected by anisotropic conductive connection using the method of claim 1.

### Claim 20 (depends on 2)

A display apparatus comprising a connection body obtained by anisotropic conductive connection according to claim 2.