# US 10,373,925 B2 · Metal pad modification

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- Number: US 10,373,925 B2
- Document ID: US10373925B2
- Status: Granted
- Kind: B2
- Application number: 16/010,712
- Filed: 2018-06-18
- Published: 2019-01-03
- Granted: 2019-08-06
- Earliest claimed: 2017-06-28
- Assignees: International Business Machines Corporation
- Applicants: International Business Machines Corporation
- Inventors: Krishna Tunga; Ekta Misra
- Web page: https://patentgrep.com/patent/US10373925B2

## CPC

- H10W 72/20: Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
- H10W 72/90: Bond pads, in general
- H10W 72/01235: {by plating, e.g. electroless plating or electroplating}
- H10W 72/01935: {by plating, e.g. electroless plating or electroplating}
- H10W 72/07236: {Soldering or alloying}
- H10W 72/222: {Multilayered bumps, e.g. a coating on top and side surfaces of a bump core}
- H10W 72/232: {Plan-view shape, i.e. in top view}
- H10W 72/244: {relative to underlying supporting features, e.g. bond pads, RDLs or vias}
- H10W 72/252: {comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu}
- H10W 72/253: {not comprising solid metals or solid metalloids, e.g. polymers or ceramics}
- H10W 72/283: {Reinforcing structures, e.g. bump collars}
- H10W 72/29: Bond pads specially adapted therefor
- H10W 72/923: {Bond pads having multiple stacked layers}
- H10W 72/932: {Plan-view shape, i.e. in top view}
- H10W 72/9415: {relative to the surface, e.g. recessed, protruding}
- H10W 72/942: {relative to underlying supporting features, e.g. bond pads, RDLs or vias}
- H10W 72/952: {comprising metals or metalloids, e.g. PbSn, Ag or Cu}
- H10W 72/953: {not comprising solid metals or solid metalloids, e.g. polymers, ceramics or liquids}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

The present invention provides a structure. In an exemplary embodiment, the structure includes a base material, at least one metal pad, where a first surface of the metal pad is in contact with the base material, and a metal pedestal, where the metal pedestal is in contact with the metal pad, where a radial alignment of the metal pad is shifted by an offset distance, with respect to the metal pedestal, such that the metal pad is shifted towards a center axis of the base material, where a first dimension of the metal pad is smaller than a second dimension of the metal pad, where the second dimension is orthogonal to a line running from a center of the metal pad to the center axis of the base material, where the first dimension is parallel to the line.

## Claims

### Claim 1

A structure comprising:
a base material;
at least one metal pad,
wherein a first surface of the metal pad is in contact with a surface of the base material;
a metal pedestal;
wherein a first surface of the metal pedestal is in contact with a second surface of the metal pad,
wherein a first dimension of the metal pad is smaller than a second dimension of the metal pad,
wherein the second dimension is orthogonal to a line running from a center of the metal pad to a center axis of the base material,
wherein the first dimension is parallel to the line running from the center of the metal pad to the center axis of the base material; and
a solder bump in contact with a second surface of the metal pedestal.

### Claim 2 (depends on 1)

The structure of claim 1, wherein the metal pad has a cross sectional shape selected from the group consisting of rounded rectangle, elliptical, and oblong.

### Claim 3 (depends on 1)

The structure of claim 1 further comprising:
a passivation layer between the metal pedestal and the metal pad with a via in the passivation layer,
wherein the metal pedestal contacts the metal pad through the via in the passivation layer; and
wherein the metal pedestal is deposited on the passivation layer and the second surface of the metal pad.

### Claim 4 (depends on 3)

The structure of claim 3, wherein the passivation layer has a thickness ranging from 0 μm to 20 μm.