# US 10,373,917 B2 · Electronic circuit package using conductive sealing material > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,373,917 B2 - Document ID: US10373917B2 - Status: Granted - Kind: B2 - Application number: 15/832,769 - Filed: 2017-12-05 - Published: 2019-06-06 - Granted: 2019-08-06 - Earliest claimed: 2017-12-05 - Assignees: TDK Corporation - Applicants: TDK Corporation - Inventors: Kenichi Kawabata - Web page: https://patentgrep.com/patent/US10373917B2 ## CPC - H10W 42/20: protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons - H10W 70/05: of insulating or insulated package substrates, or of interposers, or of redistribution layers (manufacture or treatment of leadframes H10W70/04) - H10W 42/276: {the arrangements being on an external surface of the package, e.g. on the outer surface of an encapsulation} - H10W 70/092: {Adapting interconnections, e.g. making engineering changes, repairing} - H10W 70/095: {of vias therein} - H10W 70/099: {Connecting interconnections to insulating or insulated package substrates, interposers or redistribution layers} - H10W 70/611: {for connecting multiple chips together} - H10W 70/635: {Through-vias} - H10W 70/65: Shapes or dispositions of interconnections - H10W 70/657: {on sidewalls or bottom surfaces of the package substrates, interposers or redistribution layers} - H10W 70/685: comprising multiple insulating layers - H10W 74/014: {using batch processing} - H10W 74/016: {using moulds} - H10W 74/114: {by a substrate and the encapsulations} - H10W 74/117: {the substrate having spherical bumps for external connection} - H10W 74/121: {by multiple encapsulations, e.g. by a thin protective coating and a thick encapsulation} - H10W 74/473: {containing a filler} - H10W 90/00: Package configurations - H10W 70/63: Vias, e.g. via plugs - H10W 72/0198: {batch processes} - H10W 72/07337: {using a polymer adhesive, e.g. an adhesive based on silicone or epoxy} - H10W 72/225: {Bumps having a filler embedded in a matrix} - H10W 72/252: {comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu} - H10W 74/00: Encapsulations, e.g. protective coatings - H10W 74/15: on active surfaces of flip-chip devices, e.g. underfills - H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract Disclosed herein is an electronic circuit package that includes a substrate having a power supply pattern, an electronic component mounted on a surface of the substrate; and a molding member having conductivity that covers the surface of the substrate so as to embed the electronic component therein. The power supply pattern includes a first power supply pattern exposed to the surface of the substrate, and the molding member contacts the first power supply pattern. ## Claims ### Claim 1 An electronic circuit package comprising: a substrate having a power supply pattern; a plurality of electronic components mounted on a surface of the substrate; and a molding member that covers the surface of the substrate so as to embed the electronic components therein, wherein the molding member includes a first portion located above each of the electronic components and a second portion located between the electronic components, each of the first and second portions having conductivity; wherein the power supply pattern includes a first power supply pattern exposed to the surface of the substrate, and wherein the molding member contacts the first power supply pattern, thereby a predetermined potential is applied to each of the first and second portions of the molding member. ### Claim 2 (depends on 1) The electronic circuit package as claimed in claim 1, wherein an occupying ratio of the first power supply pattern in the surface of the substrate is equal to or higher than 2%. ### Claim 3 (depends on 2) The electronic circuit package as claimed in claim 2, wherein the occupying ratio of the first power supply pattern in the surface of the substrate is equal to or higher than 8%. ### Claim 4 (depends on 1) The electronic circuit package as claimed in claim 1, wherein the first power supply pattern is disposed at least one corner portion of the surface of the substrate. ### Claim 5 (depends on 4) The electronic circuit package as claimed in claim 4, wherein the first power supply pattern is disposed at least two corner portions of the surface of the substrate. ### Claim 6 (depends on 5) The electronic circuit package as claimed in claim 5, wherein the two corner portions are diagonally opposed to each other. ### Claim 7 (depends on 1) The electronic circuit package as claimed in claim 1, wherein the first power supply pattern is disposed along at least one side of the surface of the substrate. ### Claim 8 (depends on 7) The electronic circuit package as claimed in claim 7, wherein the first power supply pattern is disposed along at least two sides of the surface of the substrate. ### Claim 9 (depends on 8) The electronic circuit package as claimed in claim 8, wherein the two sides are opposed to each other. ### Claim 10 (depends on 1) The electronic circuit package as claimed in claim 1, wherein the power supply pattern includes a second power supply pattern exposed to a side surface of the substrate, and wherein the molding member further contacts the second power supply pattern. ### Claim 11 (depends on 10) The electronic circuit package as claimed in claim 10, wherein the side surface of the substrate includes a side surface upper part and a side surface lower part protruding from the side surface upper part, wherein the second power supply pattern is exposed to the side surface upper part of the substrate, and wherein the molding member covers the side surface upper part of the substrate without covering the side surface lower part of the substrate. ### Claim 12 (depends on 1) The electronic circuit package as claimed in claim 1, further comprising a metal film that covers the molding member and has higher conductivity than that of the molding member. ### Claim 13 (depends on 1) The electronic circuit package as claimed in claim 1, wherein the molding member includes a resin material and a first filler blended in the resin material, and wherein a surface of the first filler is covered with a metal coating having higher conductivity than that of the first filler. ### Claim 14 (depends on 13) The electronic circuit package as claimed in claim 13, wherein the first filler comprises a magnetic material. ### Claim 15 (depends on 14) The electronic circuit package as claimed in claim 14, further comprising a magnetic film that covers the molding member and has higher permeability than that of the molding member. ### Claim 16 (depends on 13) The electronic circuit package as claimed in claim 13, wherein the molding member further includes a second filler having a size smaller than that of the first filler, and wherein a surface of the second filler is covered with a metal coating. ### Claim 17 (depends on 16) The electronic circuit package as claimed in claim 16, wherein the second filer comprises a magnetic material. ### Claim 18 (depends on 16) The electronic circuit package as claimed in claim 16, wherein the second filer comprises a conductive material. ### Claim 19 (depends on 16) The electronic circuit package as claimed in claim 16, wherein the second filer comprises an insulating material. ### Claim 20 (depends on 14) The electronic circuit package as claimed in claim 14, wherein the first filler comprises a material containing 32 wt. % to 39 wt. % of a metal material composed mainly of Ni in Fe. ### Claim 21 (depends on 1) The electronic circuit package as claimed in claim 1, further comprising an insulating coating that insulates the electronic components and their terminal electrodes from the molding member. ### Claim 22 (depends on 1) The electronic circuit package as claimed in claim 1, wherein a volume resistivity of the molding member is equal to or less than 1×10−4 Ω·cm. ### Claim 23 An electronic circuit package comprising: a substrate having a main surface; a first land pattern formed on the main surface of the substrate; a power supply pattern formed on the substrate; an electronic component mounted on the main surface of the substrate; and a molding member covering the main surface of the substrate so as to embed the electronic component therein, wherein the molding member includes a resin material and a plurality of fillers blended in the resin material, each surface of the plurality of fillers being covered with a metal material, and wherein the molding member contacts the first land pattern and the power supply pattern to thereby apply a predetermined potential to each of the first land pattern and the power supply pattern. ### Claim 24 (depends on 23) The electronic circuit package as claimed in claim 23, further comprising: a second land pattern formed on the main surface of the substrate, wherein the electronic component has a terminal electrode connected to the second land pattern; and an insulating coating formed on the second land pattern and the terminal electrode so as to prevent the molding member from contacting the second land pattern and the terminal electrode. ### Claim 25 (depends on 24) The electronic circuit package as claimed in claim 24, wherein the insulating coating is small in thickness than the molding member. ### Claim 26 (depends on 24) The electronic circuit package as claimed in claim 24, wherein the electronic component further comprises another terminal electrode connected to the first land pattern, and wherein the insulating coating partially covers the first land pattern so as not to prevent the molding member from contacting the first land pattern. ### Claim 27 (depends on 26) The electronic circuit package as claimed in claim 26, wherein the insulating coating covers the another terminal electrode of the electronic component so as to prevent the molding member from contacting the another terminal electrode. ### Claim 28 (depends on 23) The electronic circuit package as claimed in claim 23, wherein each of the fillers is smaller in size than the electronic component. ### Claim 29 (depends on 23) The electronic circuit package as claimed in claim 23, wherein the electronic component is directly in contact with the metal material included in the molding member.